公开(公告)号：US20150076628A1

公开(公告)日：2015-03-19

申请号：US14028856

申请日：2013-09-17

Applicant: Analog Devices, Inc.

Inventor： David Bolognia ,  Vikram Venkatadri

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B7/0058 ,  B81B7/008 ,  B81B2201/0257 ,  B81C1/00309 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/406 ,  H04R25/405 ,  H01L2924/00014

Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.

Abstract translation: 集成器件封装包括具有第一开口的壳体和与壳体的内部体积流体连通的第二开口。 封装衬底具有第一端口和第二端口。 第一器件裸片安装到第一端口上的衬底上。 第二器件裸片通过第二端口安装到衬底上。 衬底被耦合到壳体以覆盖第一和第二开口，使得第一器件管芯通过第一开口设置在内部容积内，并且第二器件管芯通过第二开口设置在内部容积内。

公开(公告)号：US10090094B2

公开(公告)日：2018-10-02

申请号：US15174477

申请日：2016-06-06

Applicant: Analog Devices, Inc.

Inventor： David Bolognia ,  Vikram Venkatadri

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F41/10 ,  H05K3/30 ,  H01F27/30

Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.

公开(公告)号：US20180248098A1

公开(公告)日：2018-08-30

申请号：US15475832

申请日：2017-03-31

Applicant: ANALOG DEVICES, INC.

Inventor： Jiawen Bai ,  David Bolognia

IPC: H01L35/30 ,  H01L35/10 ,  G08C17/00

CPC classification number: H01L35/30 ,  G08C17/00 ,  G08C2200/00 ,  H01L35/10

Abstract: An integrated device package can include a package substrate and a thermoelectric generator (“TEG”) device electrically connected to the package substrate. The TEG device can be configured to convert thermal energy to electrical current. A magnet can be disposed over a bottom side of the TEG device. The magnet can be configured to connect to a heat source and to define a thermally conductive pathway between the heat source and the TEG device. A heat sink can be attached to a top side of the TEG device.

公开(公告)号：US09870967B2

公开(公告)日：2018-01-16

申请号：US15066397

申请日：2016-03-10

Applicant: ANALOG DEVICES, INC.

Inventor： David Bolognia ,  Jingwen Zhu

IPC: H01L23/12 ,  H01L21/00 ,  H01L23/053 ,  H01L23/16 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/053 ,  H01L23/10 ,  H01L24/06 ,  H01L2924/16195

Abstract: Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a substrate, a wall attached to the substrate, a first adhesive layer disposed between a bottom surface of the wall and a top surface of the substrate, and a second adhesive layer disposed around an outer perimeter of the first adhesive layer, the second adhesive layer disposed adjacent and contacting the wall, the second adhesive layer different from the first adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer connects the wall to electrical ground.

公开(公告)号：US09254995B2

公开(公告)日：2016-02-09

申请号：US14028856

申请日：2013-09-17

Applicant: Analog Devices, Inc.

Inventor： David Bolognia ,  Vikram Venkatadri

IPC: H04R25/00 ,  B81B7/00 ,  H04R1/40 ,  B81C1/00 ,  H04R1/04 ,  H04R9/08

CPC classification number: B81B7/0074 ,  B81B7/0058 ,  B81B7/008 ,  B81B2201/0257 ,  B81C1/00309 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/406 ,  H04R25/405 ,  H01L2924/00014

Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.

Abstract translation: 集成器件封装包括具有第一开口的壳体和与壳体的内部体积流体连通的第二开口。 封装衬底具有第一端口和第二端口。 第一器件裸片安装到第一端口上的衬底上。 第二器件裸片通过第二端口安装到衬底上。 衬底被耦合到壳体以覆盖第一和第二开口，使得第一器件管芯通过第一开口设置在内部容积内，并且第二器件管芯通过第二开口设置在内部容积内。

公开(公告)号：US20140197531A1

公开(公告)日：2014-07-17

申请号：US13739953

申请日：2013-01-11

Applicant: ANALOG DEVICES, INC.

Inventor： David Bolognia

IPC: H01L25/16 ,  H01L21/50

CPC classification number: H01L25/16 ,  G06F3/01 ,  G06K9/0002 ,  H01L23/48 ,  H01L23/5387 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/19106 ,  H04R25/658 ,  H01L2924/014

Abstract: Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.

Abstract translation: 本文公开了与紧凑型装置包相关的各种实施例。 在一些布置中，柔性基底可以耦合到具有相对于彼此成角度的壁的载体。 基底可以成形为包括两个弯曲部。 第一和第二集成器件管芯可以以各种布置安装在两个弯头之间的衬底的相对侧上。

公开(公告)号：US20140159226A1

公开(公告)日：2014-06-12

申请号：US13708727

申请日：2012-12-07

Applicant: ANALOG DEVICES, INC.

Inventor： David Bolognia

IPC: H01L23/34

CPC classification number: H01L27/14634 ,  G01D11/245 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14661 ,  H01L31/0203 ,  H01L31/024 ,  Y10T29/49126

Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate having a mounting segment and a first wing segment extending from the mounting segment. The first wing segment may be folded around an edge of the stiffener. A sensor die may be mounted on the mounting segment of the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

Abstract translation: 本文公开了紧凑型传感器模块的各种实施例。 传感器模块可以包括加强件和具有安装段的传感器基板和从安装段延伸的第一翼段。 第一翼段可以围绕加强筋的边缘折叠。 传感器芯片可以安装在传感器基板的安装段上。 处理器基板可以耦合到传感器基板。 处理器管芯可以安装在处理器基板上并且可以与传感器管芯电连通。