Embedded antenna structures
    11.
    发明授权

    公开(公告)号:US10483620B2

    公开(公告)日:2019-11-19

    申请号:US14862032

    申请日:2015-09-22

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with antenna structures that are embedded in a dielectric such as plastic. The plastic may be molded over the antenna structures using molding equipment. Antenna structures may be embedded in molded plastic structures such as plastic electronic device housing structures. The plastic electronic device housing structures may form housing structures such as housing wall structures. The antenna structures may be embedded within the housing wall structures in the vicinity of an exterior surface of the housing wall structures. Embedded antenna structures may also be mounted under other dielectric structures such portions of a display cover layer.

    Electronic devices with molded insulator and via structures
    16.
    发明授权
    Electronic devices with molded insulator and via structures 有权
    具有模制绝缘体和通孔结构的电子设备

    公开(公告)号:US09582085B2

    公开(公告)日:2017-02-28

    申请号:US14502949

    申请日:2014-09-30

    Applicant: Apple Inc.

    Abstract: An electronic device may have printed circuits to which electrical components are mounted. Plastic may be molded over a printed circuit. Vias may be formed in the printed circuit that connect metal traces on the surface of the molded plastic to metal traces on the printed circuit. The vias may be formed by drilling or by covering the metal traces on the printed circuit with mold pins in a molding tool during plastic molding operations. Plated metal traces or other metal traces may extend onto the interior surface of via holes. Vias may also be filled with conductive material such as solder or conductive adhesive. Metal members that are soldered or otherwise connected to printed circuit traces may be used in coupling surface metal traces to printed circuit traces. Antenna structure, shielding structures, and electrodes for a stylus may be formed using the metal traces on the molded plastic.

    Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 塑料可以在印刷电路上模制。 可以在印刷电路中形成通孔,其将模制塑料表面上的金属迹线连接到印刷电路上的金属迹线。 可以通过在塑料模制操作期间通过钻孔或通过在模制工具中的模具销覆盖印刷电路上的金属迹线来形成通孔。 镀金属痕迹或其他金属迹线可延伸到通孔的内表面。 通孔也可以填充导电材料,例如焊料或导电粘合剂。 焊接或以其他方式连接到印刷电路迹线的金属构件可用于将表面金属迹线耦合到印刷电路迹线。 用于触针的天线结构,屏蔽结构和电极可以使用模制塑料上的金属迹线形成。

    INJECTION MOLD WITH MULTI-AXIAL CORE INSERTS
    17.
    发明申请
    INJECTION MOLD WITH MULTI-AXIAL CORE INSERTS 有权
    注射模具与多轴芯插件

    公开(公告)号:US20140265763A1

    公开(公告)日:2014-09-18

    申请号:US14038176

    申请日:2013-09-26

    Applicant: Apple Inc.

    Abstract: Systems and methods of providing a tooling system for forming a unitary housing are disclosed herein. One embodiment may utilize a plurality of injection cavity slides. The slides may form the interior cavity of the housing. Utilizing a plurality of injection cavity slides to form a single cavity insert may allow the slides to be remove from an opening in the housing which is smaller than the cavity of the housing. Removing the slides from housing allows for the formation of housing having a unitary structure.

    Abstract translation: 本文公开了提供用于形成整体外壳的加工系统的系统和方法。 一个实施例可以利用多个注射腔玻片。 幻灯片可以形成外壳的内腔。 利用多个注射腔滑动件以形成单个腔插入件可以允许滑块从壳体中小于壳体腔体的开口移除。 从外壳上移除滑块允许形成具有整体结构的壳体。

    Illuminated low-travel key mechanism for a keyboard

    公开(公告)号:US10468211B2

    公开(公告)日:2019-11-05

    申请号:US15851355

    申请日:2017-12-21

    Applicant: Apple Inc.

    Abstract: A key mechanism for an electronic device includes a switch housing and a hinged structure. As one example, the hinged structure can be a butterfly hinge. The switch housing includes switch pin retaining mechanisms on opposing sides of the switch housing. The hinged structure includes two separate wings that are positioned adjacent to each other such that a cavity is formed between the two wings. The two wings are coupled together by coupling elements. The wings of the hinged structure can include switch housing pins on each arm of the wing that extend into the cavity and couple to the switch pin retaining mechanisms in the switch housing. Various configurations of switch pin retaining mechanisms and switch housing pins can be used to attach the hinged structure to the switch housing.

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