公开(公告)号：US20190074201A1

公开(公告)日：2019-03-07

申请号：US16079961

申请日：2017-03-30

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Samer BANNA ,  Kyle TANTIWONG

IPC: H01L21/67 ,  G06T7/00

Abstract: Embodiments of the disclosure provide methods and system for inspecting and treating a substrate. In one embodiment, a method is provided including transmitting a first plurality of beams from a diffractive beam splitter to a first surface of a substrate to generate a reflection of a second plurality of beams, wherein the first plurality of beams are spaced apart from each other upon arriving at the first surface of the substrate; receiving the second plurality of beams on a recording surface of an optical device, wherein the second plurality of beams are spaced apart from each other upon arriving at the recording surface; measuring positional information of the second plurality of beams on the recording surface; comparing the positional information of the second plurality of beams to positional information stored in a memory; and storing a result of the comparison in the memory.

公开(公告)号：US20230378047A1

公开(公告)日：2023-11-23

申请号：US17747630

申请日：2022-05-18

Applicant: Applied Materials, Inc.

Inventor： Mukhles SOWWAN ,  Samer BANNA

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/538 ,  H01L23/48 ,  H01L21/48 ,  H01L21/768

CPC classification number: H01L23/49894 ,  H01L25/0657 ,  H01L23/49838 ,  H01L23/49827 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/481 ,  H01L21/486 ,  H01L21/76898 ,  H01L2924/1436 ,  H01L2924/3511 ,  H01L2924/35121 ,  H01L2924/37001 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06544 ,  H01L24/16

Abstract: The present disclosure relates to thin-form-factor semiconductor device packages, and methods and systems for forming the same. Embodiments of the disclosure include methods and apparatus for forming semiconductor device packages that include frames that are coated with a layer of a coupling agent on which subsequently layers are formed. The utilization of the coupling agent between the frame and subsequently formed layers enhances the thermo-mechanical reliability of the package frames by mitigating the stress induced by any subsequently formed insulation layers and/or RDLs, and by providing improved coupling between such layers and the relatively smooth surfaces of the frames.

公开(公告)号：US20230187222A1

公开(公告)日：2023-06-15

申请号：US17549325

申请日：2021-12-13

Applicant: Applied Materials, Inc.

Inventor： Mukhles SOWWAN ,  Samer BANNA ,  Nirmalya MAITY ,  Nalamasu OMKARAM ,  Gary E. DICKERSON

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/147 ,  H01L23/49822

Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, printed circuit board (PCB) assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a substrate core (e.g., a core structure) is implanted with dopants to achieve a desired bulk resistivity or conductivity. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

公开(公告)号：US20230129405A1

公开(公告)日：2023-04-27

申请号：US17511380

申请日：2021-10-26

Applicant: Applied Materials, Inc.

Inventor： Mukhles SOWWAN ,  Samer BANNA

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/498 ,  H01L21/48

Abstract: The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor device package. In certain embodiments, a glass or silicon substrate is patterned by laser ablation to form structures for subsequent formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor device package, which may have one or more embedded dies therein. In certain embodiments, an insulating layer is formed over the substrate by laminating a pre-structured insulating film thereon. The insulating film may be pre-structured by laser ablation to form structures therein, followed by selective curing of sidewalls of the formed structures.

公开(公告)号：US20220177821A1

公开(公告)日：2022-06-09

申请号：US17111359

申请日：2020-12-03

Applicant: Applied Materials, Inc.

Inventor： Samer BANNA ,  Mukhles SOWWAN ,  Gary E. DICKERSON

IPC: C12M3/00 ,  C12M1/00

Abstract: Methods and apparatus of bioreactors for therapeutic cells manufacturing are provided herein. In some embodiments, a bioreactor includes: an upper bioreactor reservoir configured to perform multiple cell therapy manufacturing process steps including genetic modification and expansion to a plurality of cells disposed therein, wherein the upper bioreactor reservoir includes a plurality of ports for delivering fluids into and out of the upper bioreactor reservoir; a lower bioreactor compartment configured to hold a suspension comprising a molecular species; and a membrane disposed between the lower bioreactor compartment and the upper bioreactor reservoir, wherein the membrane includes a plurality of micro-straws extending through the membrane and into the upper bioreactor reservoir to transfect the plurality of cells with the molecular species.

公开(公告)号：US20170110292A1

公开(公告)日：2017-04-20

申请号：US15393828

申请日：2016-12-29

Applicant: Applied Materials, Inc.

Inventor： Vladimir KNYAZIK ,  Kyle TANTIWONG ,  Samer BANNA ,  Waheb BISHARA

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  F26B21/004 ,  H01J37/3244

Abstract: An apparatus for providing processing gases to a process chamber with improved uniformity is disclosed. One embodiment provides a gas delivery assembly. The gas delivery assembly includes a hub, a nozzle, and one or more gas diffusers disposed in the nozzle. The nozzle has a cylindrical body with a side wall and a top surface. A plurality of injection passages are formed inside the nozzle to deliver processing gases into the process chamber via a plurality of outlets disposed in the side wall. The injection passages are configured to direct process gases out of each outlet disposed in the side wall in a direction which is not radially aligned with a centerline of the hub.

公开(公告)号：US20150364354A1

公开(公告)日：2015-12-17

申请号：US14762796

申请日：2014-03-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Kyle TANTIWONG ,  Vladimir KNYAZIK ,  Samer BANNA

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01J37/3244 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  Y10T279/23

Abstract: An electrostatic chuck (ESC) with a cooling base for plasma processing chambers, such as a plasma etch chamber. In embodiments, a plasma processing chuck includes a plurality of independent edge zones. In embodiments, the edge zones are segments spanning different azimuth angles of the chuck to permit independent edge temperature tuning, which may be used to compensate for other chamber related non-uniformities or incoming wafer non-uniformities. In embodiments, the chuck includes a center zone having a first heat transfer fluid supply and control loop, and a plurality of edge zones, together covering the remainder of the chuck area, and each having separate heat transfer fluid supply and control loops. In embodiments, the base includes a diffuser, which may have hundreds of small holes over the chuck area to provide a uniform distribution of heat transfer fluid.

Abstract translation: 具有用于等离子体处理室的冷却基座的静电卡盘（ESC），例如等离子体蚀刻室。 在实施例中，等离子体处理卡盘包括多个独立的边缘区域。 在实施例中，边缘区域是跨越卡盘的不同方位角的区段，以允许独立的边缘温度调节，其可以用于补偿其它室相关的不均匀性或进入的晶片非均匀性。 在实施例中，卡盘包括具有第一传热流体供应和控制回路以及多个边缘区域的中心区域，其一起覆盖卡盘区域的其余部分，并且每个具有单独的传热流体供应和控制回路。 在实施例中，底座包括扩散器，其可以在卡盘区域上方具有数百个小孔以提供传热流体的均匀分布。

公开(公告)号：US20140209596A1

公开(公告)日：2014-07-31

申请号：US14162510

申请日：2014-01-23

Applicant: Applied Materials, Inc.

Inventor： Dmitry LUBOMIRSKY ,  Kyle TANTIWONG ,  Samer BANNA

IPC: H01L21/02

CPC classification number: H01L21/6831 ,  H01L21/67 ,  H01L21/67098

Abstract: Embodiments of the present disclosure generally provide apparatus and method for cooling a substrate support in a uniform manner. One embodiment of the present disclosure provides a cooling assembly for a substrate support. The cooling assembly includes a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support, a diffuser disposed on a second side of the cooling base, wherein the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner, and an inlet/outlet plate disposed under the diffuser, wherein the inlet/outlet plate is provides an interface between the diffuser and an inlet and outlet of a cooling fluid.

Abstract translation: 本公开的实施例通常提供用于以均匀方式冷却衬底支撑件的装置和方法。 本公开的一个实施例提供了一种用于衬底支撑件的冷却组件。 所述冷却组件包括冷却基座，所述冷却基座具有用于接触所述基板支撑件并且向所述基板支撑件提供冷却的第一侧，设置在所述冷却基座的第二侧上的扩散器，其中所述扩散器限定多个用于输送冷却流体的冷却路径 以平行方式朝向冷却基座，以及设置在扩散器下方的入口/出口板，其中入口/出口板提供扩散器与冷却流体的入口和出口之间的界面。

公开(公告)号：US20220135921A1

公开(公告)日：2022-05-05

申请号：US17307439

申请日：2021-05-04

Applicant: APPLIED MATERIALS, INC.

Inventor： Mukhles SOWWAN ,  Samer BANNA

IPC: C12M3/00 ,  C12M1/12 ,  C12M1/00 ,  C12N5/00 ,  C12N5/0783

Abstract: Embodiments of methods and apparatus for T-cell activation, T-cell transfection, and T-cell expansion are provided herein. For example, the apparatus includes a pump connected to a circulation path and configured to circulate cells suspended in a fluid to and from a container connected to the circulation path, the circulation path comprising a 3D printed blood vessel bed comprising in order of cell flow an artery-scaled vessel, an arteriole-scaled vessel, a capillary-scaled vessel, a venule-scaled vessel, and a vein-scaled vessel.

公开(公告)号：US20220132859A1

公开(公告)日：2022-05-05

申请号：US17507141

申请日：2021-10-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Mukhles SOWWAN ,  Samer BANNA

IPC: A01N59/20 ,  C09D1/00 ,  C09D5/14 ,  C08L23/06 ,  C08L23/12

Abstract: Methods and apparatus form antimicrobial films for sanitization of high touch surfaces. In some embodiments, an antimicrobial film includes a polymer layer with a first top surface and a bottom surface, at least one microstructure on the first top surface of the polymer layer with the microstructure having a second top surface, at least one nanostructure on the second top surface of the at least one microstructure with at least one nanostructure having an exposed surface, and an antimicrobial coating formed on the first top surface of the polymer layer, the second top surface of the at least one microstructure, and the exposed surface of the at least nanostructure. An adhesive layer is formed on the bottom surface to the polymer layer to allow the antimicrobial film to be applied to the high touch surfaces.