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    ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE
    13.
    发明申请
    ASSEMBLY STRUCTURE AND PACKAGE STRUCTURE 有权

    公开(公告)号：US20210202392A1

    公开(公告)日：2021-07-01

    申请号：US16732157

    申请日：2019-12-31

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN

    IPC: H01L23/538 ,  H01L25/18 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

    Abstract: An assembly structure includes a core-computing section and a sub-computing section. The core-computing section has a first surface and a second surface opposite to the first surface. The core-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The sub-computing section has a first surface stacked on the first surface of the core-computing section and a second surface opposite to the first surface. The sub-computing section includes at least one conductive via electrically connecting the first surface and the second surface. The assembly structure includes a first signal transmission path and a second signal transmission path. The first signal transmission path is between the at least one conductive via of the sub-computing section and the at least one conductive via of the core-computing section. The second signal transmission path is between the second surface of the sub-computing section and the at least one conductive via of the sub-computing section.

    SYSTEM COMPRISING PACKAGED OPTICAL DEVICES
    14.
    发明申请
    SYSTEM COMPRISING PACKAGED OPTICAL DEVICES 有权

    公开(公告)号：US20210167856A1

    公开(公告)日：2021-06-03

    申请号：US17144938

    申请日：2021-01-08

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Chang-Yu LIN ,  Cheng-Yuan KUNG ,  Hung-Yi LIN

    IPC: H04B10/40 ,  G02B6/42

    Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

    PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    15.
    发明申请
    PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20200035654A1

    公开(公告)日：2020-01-30

    申请号：US16518837

    申请日：2019-07-22

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Chien-Hua CHEN ,  Cheng-Yuan KUNG

    IPC: H01L25/10 ,  H01L41/047 ,  H01L41/053 ,  H01L23/522 ,  H01L41/23 ,  H01L41/25 ,  H03H9/60 ,  H03H9/64

    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.

    SEMICONDUCTOR DEVICE PACKAGE
    16.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE 审中-公开

    公开(公告)号：US20190181082A1

    公开(公告)日：2019-06-13

    申请号：US16277962

    申请日：2019-02-15

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Chien-Hua CHEN ,  Sheng-Chi HSIEH ,  Cheng-Yuan KUNG

    IPC: H01L23/498 ,  H05K1/16 ,  H01L21/48 ,  H01L23/538

    CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L2224/11 ,  H05K1/162

    Abstract: A semiconductor device package includes: (1) a substrate having a first surface and a second surface opposite to the first surface; (2) a first patterned conductive layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first patterned conductive layer is adjacent to the substrate and opposite to the first surface of the first patterned conductive layer; (3) a first insulation layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first insulation layer is adjacent to the substrate and opposite to the first surface of the first insulation layer; and (4) a second patterned conductive layer extending from the first surface of the first insulation layer to the second surface of the substrate, the second patterned conductive layer electrically connected to the first patterned conductive layer.

    PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    20.
    发明申请
    PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20230077877A1

    公开(公告)日：2023-03-16

    申请号：US17472348

    申请日：2021-09-10

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Cheng-Yuan KUNG ,  Hung-Yi LIN

    IPC: G02B6/42

    Abstract: A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.

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