摘要:
A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion.
摘要:
A ceramic capacitor includes a capacitor body and a metal layer arranged on an outer surface of the capacitor body. The outer surface includes: a first capacitor major surface; a second capacitor major surface opposite to the first capacitor major surface in a thickness direction of the capacitor body; and a capacitor lateral surface between the first and second capacitor major surfaces. The capacitor body includes a first layer section and a second layer section. The first layer section includes a plurality of ceramic dielectric layers and a plurality of internal electrodes, wherein the ceramic dielectric layers and the internal electrodes are layered alternately. The second layer section is exposed at the first capacitor major surface, and includes a corner portion at a boundary between the first capacitor major surface and the capacitor lateral surface. The metal layer covers the corner portion of the second layer section.
摘要:
A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor forming layer portion has a laminated structure wherein ceramic dielectric layers and inner electrodes connected to a peripheral portion of capacitor via conductors, are alternately laminated. The cover layer portion is exposed at a surface portion of the ceramic body and has a laminated structure wherein ceramic dielectric layers and dummy electrodes not connected to the capacitor via conductors, are alternately laminated.
摘要:
A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
摘要:
A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion.
摘要:
A refrigerator capable of properly cooling a plurality of containers storing a liquid beverage by uniformizing and stabilizing a temperature inside a cooling chamber. The refrigerator comprises the cooling chamber storing the containers of the liquid beverage, a cooling duct incorporating a heat exchanger, the suction port of the cooling duct installed in the cooling chamber, the cool air blowout port of the cooling duct installed in the cooling chamber, a lead-in port formed at the upper end of a cool air feed duct, through holes blowing out the air in the cool air feed duct into the cooling chamber, and a fan positioned the lead-in port of the cool air feed duct. The cool duct sucks the air in the cooling chamber from the suction port, cools it by the heat exchanger, and blows it out from the cool air blowout port. The lead-in port of the cool air feed duct faces the cool air blowout port of the cooling duct and also faces the inside of the cooling chamber. Air is sucked into the cool air feed duct by the fan.
摘要:
An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area that overlaps an orthogonal projection of the sub-core portion. The latter incorporates a laminated ceramic capacitor formed by first and second conductor layers with a ceramic (dielectric) layer therebetween. The first layer is connected to first and second side terminals of a first type while the second layer is connected to first and second side terminals of a second type. The housing portion has an inner edge which, in cross section, is of a quadrate shape, and a radius portion is formed at each corner having a dimension of between 0.1 and 2 mm.
摘要:
An assembly includes a semiconductor device having surface-connecting terminals, a substrate having surface-connecting pads, and a capacitor having an approximately plate-shaped capacitor main body having a first surface on which the semiconductor device is mounted and a second surface at which the capacitor main body is mounted on the substrate and a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces and connected to the surface-connecting terminals and the surface-connecting pads.
摘要:
A laminated ceramic capacitor 10 divided into a first laminate 11, a second laminate 12, a third laminate 13, and a fourth laminate 14. The first laminate 11 includes a ceramic layer 15 serving as a dielectric layer. The ceramic layer 15 is thicker than a ceramic layer 17 sandwiched between internal electrodes 16a in the second laminate 12 or the fourth laminate 14, and thinner than 20 times the thickness of the ceramic layer 17. The third laminate 13 includes dielectric layers, which serve as the ceramic layers 17, and has a thickness of 5% of the total thickness of the second laminate 12 and the fourth laminate 14. Accordingly, the third laminate 13 achieves the function of absorbing an electrode-induced thickness differential. Also, by means of regulating the thickness of the first laminate 11, portions of via electrodes 18 that extend without being electrically connected to the internal electrodes 16b can be shortened.
摘要:
A laminated ceramic capacitor 10 divided into a first laminate 11, a second laminate 12, a third laminate 13, and a fourth laminate 14. The first laminate 11 includes a ceramic layer 15 serving as a dielectric layer. The ceramic layer 15 is thicker than a ceramic layer 17 sandwiched between internal electrodes 16a in the second laminate 12 or the fourth laminate 14, and thinner than 20 times the thickness of the ceramic layer 17. The third laminate 13 includes dielectric layers, which serve as the ceramic layers 17, and has a thickness of 5% of the total thickness of the second laminate 12 and the fourth laminate 14. Accordingly, the third laminate 13 achieves the function of absorbing an electrode-induced thickness differential. Also, by means of regulating the thickness of the first laminate 11, portions of via electrodes 18 that extend without being electrically connected to the internal electrodes 16b can be shortened.