公开(公告)号：US11112465B2

公开(公告)日：2021-09-07

申请号：US16267412

申请日：2019-02-05

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano

IPC: G01R31/14 ,  G01R31/50 ,  G01R31/28 ,  G01R31/12 ,  G01R31/52 ,  G01R31/40 ,  G01R31/42 ,  G01R27/18 ,  G01R31/00 ,  H02H3/16 ,  H02H3/33

Abstract: Methods and apparatus for monitoring the integrity of an insulative material. A monitoring module detects a leakage current corresponding to an injection signal into the insulative material by a signal source. An output can provide an insulation fault signal when the leakage current is greater than a given threshold.

公开(公告)号：US20210057330A1

公开(公告)日：2021-02-25

申请号：US16547823

申请日：2019-08-22

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Bruno Luis Uberti ,  Alejandro Gabriel Milesi ,  Gerardo A. Monreal

IPC: H01L23/522 ,  H01L23/66

Abstract: Methods and apparatus for a signal isolator IC package including a die having a first die portion isolated from a second die portion. The first die portion is surrounded on six sides by first insulative material and the second die portion is surrounded on six sides by second insulative material. The first die portion provides a first voltage domain and the second die portion provides a second voltage domain. The signal isolator comprises a first signal path between the first die portion and the second die portion, wherein the first signal path is isolated with respect to the first and second die portions.

公开(公告)号：US20200249264A1

公开(公告)日：2020-08-06

申请号：US16267412

申请日：2019-02-05

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano

IPC: G01R31/02 ,  G01R31/12 ,  G01R31/28

Abstract: Methods and apparatus for monitoring the integrity of an insulative material. A monitoring module detects a leakage current corresponding to an injection signal into the insulative material by a signal source. An output can provide an insulation fault signal when the leakage current is greater than a given threshold.

公开(公告)号：US20240234257A1

公开(公告)日：2024-07-11

申请号：US18618259

申请日：2024-03-27

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Shixi Louis Liu ,  William P. Taylor

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/06151 ,  H01L2224/48177

Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, an isolator includes a leadframe having first and second die paddles each having opposed first and second surfaces, a first die supported by the first surface of the first die paddle, and a second die supported by the first surface of the second die paddle. The first and second die paddles are configured enhanced creepage characteristics.

公开(公告)号：US11973008B2

公开(公告)日：2024-04-30

申请号：US17650874

申请日：2022-02-14

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Shixi Louis Liu ,  William P. Taylor

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/06151 ,  H01L2224/48177

Abstract: Methods and apparatus for a signal isolator having enhanced creepage characteristics. In embodiments, a signal isolator IC package comprises a leadframe including a die paddle having a first surface to support a die and an exposed second surface. A die is supported by a die paddle wherein a width of the second surface of the die paddle is less than a width of the die.

公开(公告)号：US11561112B2

公开(公告)日：2023-01-24

申请号：US16818199

申请日：2020-03-13

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Paul A. David

IPC: G01D5/14 ,  G01R33/07 ,  G01R33/09

Abstract: Methods and apparatus for a current sensor having an elongate current conductor having an input and an output and a longitudinal axis. First, second, third and fourth magnetic field sensing elements are coupled in a bridge configuration and positioned in a plane parallel to a surface of the current conductor such that the second and fourth magnetic field sensing elements comprise inner elements and the first and third magnetic field sensing elements comprise outer elements. Embodiments of the sensor reduce the effects of stray fields on the sensor.

公开(公告)号：US11029366B2

公开(公告)日：2021-06-08

申请号：US16539405

申请日：2019-08-13

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano

IPC: G01R31/50 ,  H02H5/10

Abstract: Methods and apparatus for an IC package having an impedance detector module configured to have: a first connection to a first external energy source via a first IO pin of the IC package and a second connection to a detection component. In embodiments, the detection component is configured for connection to a first ground for the first external energy source via a second IO pin of the IC package, and to a barrier component, which is configured for connection to a second ground for a second external energy source via a third IO pin of the IC package. The impedance detector module is configured to detect a disconnection or degradation of a connection to ground.

公开(公告)号：US20210083907A1

公开(公告)日：2021-03-18

申请号：US16809825

申请日：2020-03-05

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Pedram Sotoodeh Shahnani ,  Cory Voisine

IPC: H04L25/02 ,  H03K19/00 ,  H04B17/17

Abstract: A signal isolator integrated circuit package includes a first circuit having a first input and a first output, a second circuit having a second input and a second output, an isolation barrier layer between the first circuit and the second circuit, wherein the second output of the second circuit is coupled to the first input of the first circuit through the isolation barrier. The signal isolator includes a comparator configured to compare the first input of the first circuit to the second output of the second circuit. The second output can be configured to convey at least three states, including a first state indicative of a logical high of an input signal received at the first input, a second state indicative of a logical low of the input signal, and a third state indicative of a fault condition.

公开(公告)号：US10074939B1

公开(公告)日：2018-09-11

申请号：US15671357

申请日：2017-08-08

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano

IPC: H02M1/14 ,  H01R13/658 ,  H01L23/00 ,  H04B3/56 ,  H04L25/02 ,  H01L23/485 ,  H01L23/66

CPC classification number: H01R13/658 ,  H01F19/08 ,  H01F2019/085 ,  H01F2038/146 ,  H01L23/485 ,  H01L23/49575 ,  H01L23/5222 ,  H01L23/5227 ,  H01L23/66 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02255 ,  H01L2224/05554 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2924/00014 ,  H04B3/56 ,  H04L25/0268 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Methods and apparatus for a signal isolator having inductive and capacitive coupling. In embodiments, magnetic and electric fields are coupled by coils and capacitive plates. In embodiments, a floating plate can enable a top and bottom capacitive plate to be offset from each other.

公开(公告)号：US10074713B1

公开(公告)日：2018-09-11

申请号：US15705487

申请日：2017-09-15

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano

IPC: H01L29/00 ,  H01L49/02 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L28/40 ,  H01L23/48 ,  H01L23/642 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/48195 ,  H01L2224/48265 ,  H01L2924/19041 ,  H01L2924/19104

Abstract: A signal isolator integrated circuit package includes a first die in a first voltage domain and a second die in a second voltage domain. The integrated circuit package also includes a first signal path from the first die to the second die via a first isolation barrier supported by the first die. The first isolation barrier includes a first conductive layer disposed over a surface of the first die and a first insulating layer disposed over the first conductive layer. The first isolation barrier also includes a second insulating layer disposed over the first insulating layer and a second conductive layer disposed over the second insulating layer. A first floating conductive plate is disposed between the first insulating layer and the second insulating layer.