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    Underhood electronic interior integration
    13.
    发明授权
    Underhood electronic interior integration 失效
    冥想电子内部整合

    公开(公告)号：US07070229B2

    公开(公告)日：2006-07-04

    申请号：US10371465

    申请日：2003-02-21

    申请人： Andrew Glovatsky ,  Jay Baker ,  Myron Lemecha ,  Lawrence Kneisel

    发明人： Andrew Glovatsky ,  Jay Baker ,  Myron Lemecha ,  Lawrence Kneisel

    IPC分类号： B62D25/08

    CPC分类号： B60R16/0207 ,  B62D25/081

    摘要： An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.

    摘要翻译： 电子系统通常包括扁平电子站点和将扁线电子站点电连接到发动机室中的电子设备的扁平总线。 扁线电子站点具有柔性基板，电子元件附接到基板上用于电子设备的操作。 扁线电子站点安装在舱壁的乘客位置进行热冷却，同时防止发动机舱的恶劣环境。 隔板具有一个孔口，其尺寸允许扁线总线通过舱壁进入发动机舱室。 通过使用扁线总线，该孔径尺寸小，并且提高了隔板的完整性。

    Electronically integrated vehicle structure
    14.
    发明申请
    Electronically integrated vehicle structure 有权
    电子集成车辆结构

    公开(公告)号：US20050231907A1

    公开(公告)日：2005-10-20

    申请号：US10828396

    申请日：2004-04-20

    申请人： Andrew Glovatsky ,  Jay Baker ,  Richard McMillan ,  Myron Lemecha ,  Daniel Vander Sluis

    发明人： Andrew Glovatsky ,  Jay Baker ,  Richard McMillan ,  Myron Lemecha ,  Daniel Vander Sluis

    IPC分类号： B60R16/02 ,  H05K7/20

    CPC分类号： B60R16/0207

    摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

    摘要翻译： 集成车辆结构包括塑料支撑结构中的电子位置。 该电子站点具有安装在其上的电子部件的柔性基板。 塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。 每个肋具有形成塑料安装表面的一部分的侧边缘。 柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。 也可以提供限定金属安装表面的方法支撑结构。 一个或多个电子侧可以附接到金属和塑料安装表面。

    Method for laser soldering a three dimensional component
    15.
    发明授权
    Method for laser soldering a three dimensional component 失效
    激光焊接三维元件的方法

    公开(公告)号：US06284998B1

    公开(公告)日：2001-09-04

    申请号：US09452241

    申请日：1999-12-01

    申请人： Peter Joseph Sinkunas ,  Andrew Zachary Glovatsky ,  Bernard Allen Meyer ,  Zhong-You Joe Shi ,  Myron Lemecha ,  Rexanne M. Coyner

    发明人： Peter Joseph Sinkunas ,  Andrew Zachary Glovatsky ,  Bernard Allen Meyer ,  Zhong-You Joe Shi ,  Myron Lemecha ,  Rexanne M. Coyner

    IPC分类号： B23K2620

    CPC分类号： B23K26/20 ,  B23K1/0056 ,  B23K2101/40 ,  H01L2224/75253 ,  H01L2224/81224 ,  H01L2924/01087 ,  H01L2924/01322 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2203/107

    摘要： There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.

    摘要翻译： 这里公开了一种用于激光焊接的方法，包括以下步骤：（a）提供其上具有至少两个终端的电子部件10; 电介质基板14，其第一面上具有第一表面16，在其第二侧上具有第二表面，以及至少两个安装焊盘24，其布置在第一表面16上，与电子部件10的端接部相配合; 和二极管激光器50; （b）在安装焊盘24的上方沉积焊膏; （c）将电子部件10放置在基板14的顶部，使得每个端子大致位于其相应的安装焊盘24的顶部; 以及（d）将来自二极管激光器50的激光能量70从衬底14的第二侧引导到至少一个安装焊盘24预定的时间，使得焊膏位于至少一个安装焊盘24的顶部 被融化

    Soldering process with minimal thermal impact on substrate
    16.
    发明授权
    Soldering process with minimal thermal impact on substrate 失效
    焊接工艺，对基材的热冲击最小

    公开(公告)号：US5996222A

    公开(公告)日：1999-12-07

    申请号：US84867

    申请日：1998-05-26

    申请人： Dongkai Shangguan ,  Myron Lemecha ,  Achyuta Achari

    发明人： Dongkai Shangguan ,  Myron Lemecha ,  Achyuta Achari

    IPC分类号： H05K1/00 ,  H05K3/34

    CPC分类号： H05K3/3494 ,  H05K1/0284 ,  H05K2201/0129 ,  H05K2201/0999 ,  H05K2203/111 ,  Y10T29/49144

    摘要： A soldering process is suitable for use with low cost, low heat distortion temperature thermoplastic substrates without distortion or damage to the substrate yet having the mass production capability exhibited by wave and reflow soldering techniques. The process allows integration of consumer products and, in particular, vehicle components such as integrated instrument panel or other such assemblies, without the redundancy of separate printed circuit boards.

    摘要翻译： 焊接工艺适用于低成本，低热变形温度的热塑性基材，而不会对基材产生变形或损坏，但具有通过波浪和回流焊接技术显示的大规模生产能力。 该过程允许消费产品，特别是集成仪表板或其他这样的组件的车辆部件的集成，而不需要单独的印刷电路板的冗余。

    INTEGRATED PLASTIC THROTTLE BODY, ELECTRONIC CONTROL UNIT, AND SENSORS FOR SMALL ENGINE
    17.
    发明申请
    INTEGRATED PLASTIC THROTTLE BODY, ELECTRONIC CONTROL UNIT, AND SENSORS FOR SMALL ENGINE 审中-公开
    集成塑料节流体，电子控制单元和小型发动机传感器

    公开(公告)号：US20120240898A1

    公开(公告)日：2012-09-27

    申请号：US13069910

    申请日：2011-03-23

    申请人： Myron Lemecha ,  Diane Marie Gietzen-Jett ,  Thomas Edward Brefeld ,  Robert Edward Belke ,  Gary Spring ,  Terry Joyce

    发明人： Myron Lemecha ,  Diane Marie Gietzen-Jett ,  Thomas Edward Brefeld ,  Robert Edward Belke ,  Gary Spring ,  Terry Joyce

    IPC分类号： F02D41/00

    CPC分类号： F02D9/1065 ,  F02D9/105 ,  F02D2009/0294

    摘要： An electronic control assembly for a throttle body includes a lower housing portion having a plurality of apertures formed therethrough, a circuit board disposed adjacent at least a portion of the lower housing portion, a pressure sensor disposed adjacent the lower housing portion and electrically coupled to the circuit board, wherein a sensing portion of the pressure sensor extends into a first one of the apertures formed in the lower housing portion, a temperature sensor disposed adjacent the lower housing portion and electrically coupled to the circuit board, wherein a sensing portion of the temperature sensor extends into a second one of the apertures formed in the lower housing portion, and an upper housing portion coupled to the throttle body and cooperating with the lower housing portion to substantially enclose the circuit board, the pressure sensor, and the temperature sensor.

    摘要翻译： 一种用于节流阀主体的电子控制组件，包括一个下部壳体部分，其具有穿过其中形成的多个孔，邻近下部壳体部分的至少一部分设置的电路板，邻近下部壳体部分设置并电耦合到 电路板，其中所述压力传感器的感测部分延伸到形成在所述下壳体部分中的第一孔中;温度传感器，其布置成邻近所述下壳体部分并电耦合到所述电路板，其中所述温度的感测部分 传感器延伸到形成在下壳体部分中的第二个孔中，以及上壳体部分，其联接到节气门体并与下壳体部分协作以基本上包围电路板，压力传感器和温度传感器。