公开(公告)号：US20190237444A1

公开(公告)日：2019-08-01

申请号：US16375614

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Jonathan S. Steckel ,  Jean-Jacques P. Drolet ,  Roland Van Gelder ,  Kelly C. McGroddy ,  Ion Bita ,  James Michael Perkins ,  Andreas Bibl ,  Sajjad A. Khan ,  James E. Pedder ,  Elmar Gehlen

IPC: H01L25/075 ,  H01L33/60 ,  G02F1/1335

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F2001/133614 ,  G02F2202/108 ,  H01L33/44 ,  H01L33/60

Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.

公开(公告)号：US10297581B2

公开(公告)日：2019-05-21

申请号：US15740739

申请日：2016-07-05

Applicant: Apple Inc.

Inventor： Jonathan S. Steckel ,  Jean-Jacques P. Drolet ,  Roland van Gelder ,  Kelly C. McGroddy ,  Ion Bita ,  James Michael Perkins ,  Andreas Bibl ,  Sajjad A. Khan ,  James E. Pedder ,  Elmar Gehlen

IPC: H01L29/18 ,  H01L33/00 ,  H01L25/075 ,  G02F1/1335 ,  H01L33/60 ,  H01L33/44

Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.

公开(公告)号：US10135034B1

公开(公告)日：2018-11-20

申请号：US15449348

申请日：2017-03-03

Applicant: Apple Inc.

Inventor： Ion Bita ,  Jean-Jacques P. Drolet ,  Enkhamgalan Dorjgotov ,  Michael J. Brown

IPC: H01L51/52 ,  G02B5/30 ,  G02B5/00 ,  G02B5/22 ,  G02B27/28 ,  H01L27/32

Abstract: Display panel configurations are described in which a pixel-level integrated black matrix layer is combined with an elliptical polarizer. The elliptical polarizer may allow for increased transmission of emissive LEDs in the display panel, while the black matrix layer may mitigate internal reflection of ambient light.

公开(公告)号：US20180292713A1

公开(公告)日：2018-10-11

申请号：US15693305

申请日：2017-08-31

Applicant: Apple Inc.

Inventor： Jean-Jacques P. Drolet ,  Yuan Chen ,  Jonathan S. Steckel ,  Ion Bita ,  Dmitry S. Sizov ,  Chia Hsuan Tai ,  John T. Leonard ,  Lai Wang ,  Ove Lyngnes ,  Xiaobin Xin ,  Zhibing Ge

IPC: G02F1/1335 ,  G02F1/1343

Abstract: A display may have display layers that form an array of pixels. The display layers may include a first layer that includes a light-blocking matrix and a second layer that overlaps the first layer. The first layer may include quantum dot elements formed in openings in the light-blocking matrix. The light-blocking matrix may be formed from a reflective material such as metal. The second layer may include color filter elements that overlap corresponding quantum dot elements in the first layer. Substrate layers may be used to support the first and second layers and to support thin-film transistor circuitry that is used in controlling light transmission through the array of pixels. The display layers may include a liquid crystal layer, polarizer layers, filter layers for reflecting red and green light and/or other light to enhance light recycling, and layers with angularly dependent transmission characteristics.

公开(公告)号：US20180190625A1

公开(公告)日：2018-07-05

申请号：US15740739

申请日：2016-07-05

Applicant: Apple Inc.

Inventor： Jonathan S. Steckel ,  Jean-Jacques P. Drolet ,  Roland van Gelder ,  Kelly C. McGroddy ,  Ion Bita ,  James Michael Perkins ,  Andreas Bibl ,  Sajjad A. Khan ,  James E. Pedder ,  Elmar Gehlen

IPC: H01L25/075 ,  G02F1/1335 ,  H01L33/60

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F2001/133614 ,  G02F2202/108 ,  H01L33/44 ,  H01L33/60

Abstract: Display panels and methods of manufacture are described for down converting a peak emission wavelength of a pump LED within a subpixel with a quantum dot layer. In some embodiments, pump LEDs with a peak emission wavelength below 500 nm, such as between 340 nm and 420 nm are used. QD layers in accordance with embodiments can be integrated into a variety of display panel structures including a wavelength conversion cover arrangement, QD patch arrangement, or QD layers patterned on the display substrate.

公开(公告)号：US20240347516A1

公开(公告)日：2024-10-17

申请号：US18611108

申请日：2024-03-20

Applicant: Apple Inc.

Inventor： Dmitry S. Sizov ,  Ion Bita ,  Jean-Jacques P. Drolet ,  John T. Leonard ,  Jonathan S. Steckel ,  Nathaniel T. Lawrence ,  Xiaobin Xin ,  Ranojoy Bose

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H01L33/00 ,  H01L33/38 ,  H01L33/60

CPC classification number: H01L25/0753 ,  H01L24/08 ,  H01L24/32 ,  H01L24/73 ,  H01L25/167 ,  H01L25/18 ,  H01L33/60 ,  H01L33/0008 ,  H01L33/0093 ,  H01L33/38 ,  H01L2224/08225 ,  H01L2224/32225

Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.

公开(公告)号：US11568789B2

公开(公告)日：2023-01-31

申请号：US17338475

申请日：2021-06-03

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Tore Nauta ,  Hopil Bae ,  Henry C. Jen ,  James E. Pedder ,  Sunggu Kang ,  Shingo Hatanaka ,  Xiang Lu ,  Mahdi Farrokh Baroughi ,  Hasan Akyol ,  Saif Choudhary ,  Ion Bita

IPC: G09G3/20 ,  G09G3/32

Abstract: Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

公开(公告)号：US11056041B2

公开(公告)日：2021-07-06

申请号：US16688750

申请日：2019-11-19

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Tore Nauta ,  Hopil Bae ,  Henry C. Jen ,  James E. Pedder ,  Sunggu Kang ,  Shingo Hatanaka ,  Xiang Lu ,  Mahdi Farrokh Baroughi ,  Hasan Akyol ,  Saif Choudhary ,  Ion Bita

IPC: G09G3/20 ,  G09G3/32

Abstract: Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

公开(公告)号：US10546796B2

公开(公告)日：2020-01-28

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：US20190115274A1

公开(公告)日：2019-04-18

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.