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    Systems and methods for transfer of micro-devices
    12.
    发明授权
    Systems and methods for transfer of micro-devices 有权

    公开(公告)号：US10692923B2

    公开(公告)日：2020-06-23

    申请号：US16020692

    申请日：2018-06-27

    Applicant: Applied Materials, Inc.

    Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

    IPC: H01L21/66 ,  H01L33/48 ,  H01L27/15 ,  H01L33/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/075

    Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

    SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES
    14.
    发明申请
    SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES 审中-公开

    公开(公告)号：US20180315793A1

    公开(公告)日：2018-11-01

    申请号：US16020692

    申请日：2018-06-27

    Applicant: Applied Materials, Inc.

    Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

    IPC: H01L27/15 ,  H01L23/00 ,  H01L33/48 ,  H01L21/66

    Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

    Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
    15.
    发明授权
    Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process 有权

    公开(公告)号：US11772229B2

    公开(公告)日：2023-10-03

    申请号：US16298802

    申请日：2019-03-11

    Applicant: Applied Materials, Inc.

    Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

    IPC: B24B37/24

    CPC classification number: B24B37/24

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

    Precursor formulations for polishing pads produced by an additive manufacturing process
    17.
    发明授权
    Precursor formulations for polishing pads produced by an additive manufacturing process 有权

    公开(公告)号：US11446788B2

    公开(公告)日：2022-09-20

    申请号：US16541641

    申请日：2019-08-15

    Applicant: Applied Materials, Inc.

    Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Ashwin Chockalingam ,  Ashavani Kumar ,  Fred C. Redeker ,  Nag B. Patibandla

    IPC: B24D18/00 ,  B24D3/28 ,  B33Y80/00 ,  B33Y10/00

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

    ADVANCED POLISHING PAD MATERIALS AND FORMULATIONS
    19.
    发明申请
    ADVANCED POLISHING PAD MATERIALS AND FORMULATIONS 审中-公开
    高级抛光垫材料和配方

    公开(公告)号：US20160136787A1

    公开(公告)日：2016-05-19

    申请号：US15002384

    申请日：2016-01-20

    Applicant: Applied Materials, Inc.

    Inventor： Rajeev Bajaj ,  Daniel Redfield ,  Mahendra C. Orilall ,  Boyi Fu ,  Ashwin Chockalingam

    IPC: B24D11/00 ,  B24B37/24 ,  B24D3/28

    CPC classification number: B24D11/001 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D11/04 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

    Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。

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