公开(公告)号：US20220077251A1

公开(公告)日：2022-03-10

申请号：US17193321

申请日：2021-03-05

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a substrate, adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, inorganic overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material disposed over and in contact with the anode, a cathode disposed over the OLED material and extending under the inorganic overhang structures adjacent to each sub-pixel, and an encapsulation layer disposed over the cathode. The encapsulation layer extends under at least a portion of the inorganic overhang structures and along a sidewall of the inorganic overhang structures.

公开(公告)号：US20190226090A1

公开(公告)日：2019-07-25

申请号：US15552022

申请日：2016-09-22

Applicant: Andreas LOPP ,  Dieter HAAS ,  Applied Materials, Inc.

Inventor： Andreas LOPP ,  Dieter HAAS

IPC: C23C16/455

Abstract: A nozzle for being connected to a distribution assembly for guiding evaporated material from a material source into a vacuum chamber is described. The nozzle includes: a nozzle inlet for receiving the evaporated material; a nozzle outlet for releasing the evaporated material to the vacuum chamber; and a nozzle passage extending from the nozzle inlet the nozzle outlet in a flow direction, wherein the nozzle passage comprises an outlet section having an aperture angle which continuously increases in the flow direction. Further, a material deposition arrangement having such a nozzle, a vacuum deposition system with the material source arrangement, and a method for depositing evaporated material are provided.

公开(公告)号：US20190074343A1

公开(公告)日：2019-03-07

申请号：US16059995

申请日：2018-08-09

Applicant: Applied Materials, Inc.

Inventor： Dieter HAAS

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/00

Abstract: Aspects disclosed herein relate to apparatus having a combined common metal mask (CMM) and fine metal mask (FMM) used in the manufacture of organic light emitting diodes (OLEDs) and manufacturing methods thereof. In one aspect, a mask assembly is provided. The mask includes a common metal mask having one or more windows therethrough and at least one fine metal mask disposed within the at least one window. In another aspect, a distortion compensation master is disclosed. The mask includes a plurality of windows formed through the mask, the positions of the windows being located to compensate for any distortion, including positional distortion resulting from gravity. As one example, the windows may be positioned higher at or near the center of the mask and decreasingly lower near the edge of the mask.

公开(公告)号：US20180030596A1

公开(公告)日：2018-02-01

申请号：US15542891

申请日：2015-01-12

Applicant: Tommaso VERCESI ,  Dieter HAAS ,  Stefan BANGERT ,  Oliver HEIMEL ,  Daniele GISLON ,  Applied Materials, Inc.

Inventor： Tommaso VERCESI ,  Dieter HAAS ,  Stefan BANGERT ,  Oliver HEIMEL ,  Daniele GISLON

IPC: C23C16/458 ,  C23C14/50 ,  H01L21/68 ,  C23C14/04

CPC classification number: C23C16/4587 ,  C23C14/042 ,  C23C14/12 ,  C23C14/50 ,  C23C16/042 ,  H01L21/682 ,  H01L51/0011

Abstract: A holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber is provided. The holding arrangement includes two or more alignment actuators connectable to at least one of the substrate carrier and the mask carrier, wherein the holding arrangement is configured to support the substrate carrier in, or parallel to, a first plane, wherein a first alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in a first direction, wherein a second alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in the first direction and a second direction different from the first direction, and wherein the first direction and the second direction are in the first plane.

公开(公告)号：US20160319422A1

公开(公告)日：2016-11-03

申请号：US15108119

申请日：2015-01-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Shinichi KURITA ,  Jozef KUDELA ,  John M. WHITE ,  Dieter HAAS

IPC: C23C16/04 ,  H01L51/52 ,  H01J37/32 ,  H01L21/67 ,  H01L21/677 ,  H01L51/56 ,  H01L21/687

CPC classification number: C23C16/45548 ,  C23C16/042 ,  C23C16/4402 ,  C23C16/54 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32467 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/32834 ,  H01J37/32853 ,  H01J37/32899 ,  H01J2237/327 ,  H01J2237/3321 ,  H01L21/6719 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/68742 ,  H01L51/0011 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/56

Abstract: The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). A process kit for TFE is provided. The process kit is an assembly including a window, a mask parallel to the window, and a frame. The process kit further includes an inlet channel for flowing process gases into the volume between the window and the mask, an outlet channel for pumping effluent gases away from the volume between the window and the mask, and seals for inhibiting the flow of process gases and effluent gases to undesired locations. A method of performing TFE is provided, including placing a substrate under the mask of the above described process kit, flowing process gases into the process kit, and activating some of the process gases into reactive species by means of an energy source within a processing chamber.

Abstract translation: 本公开涉及薄膜封装（TFE）的方法和装置。 提供TFE的工艺套件。 处理套件是包括窗口，与窗口平行的掩模和框架的组件。 工艺组件还包括用于将工艺气体流入窗口和面罩之间的体积的入口通道，用于将流出气体从窗口和面罩之间的体积排出的出口通道，以及用于抑制工艺气体流动的密封件， 流出气体到不需要的位置。 提供了一种执行TFE的方法，包括将基底放置在上述处理试剂盒的掩模之下，将工艺气体流入工艺试剂盒，并通过处理室内的能量源将一些工艺气体活化成反应性物质 。

公开(公告)号：US20160043319A1

公开(公告)日：2016-02-11

申请号：US14782500

申请日：2014-04-21

Applicant: APPLIED MATERIALS, INC.

Inventor： John M. WHITE ,  Robert Jan VISSER ,  Dieter HAAS ,  Tommaso VERCESI ,  Andreas LOPP

IPC: H01L51/00 ,  H01L51/56 ,  G02B26/02

Abstract: The embodiments described herein generally relate to active alignment of a fine metal mask. The fine metal mask is connected with a frame through a plurality of microactuators. The microactuators can act on the fine metal mask to stretch the mask, reposition the mask or both. In this way, the position and size of the fine metal mask can be maintained in relation to the substrate.

Abstract translation: 本文描述的实施例通常涉及精细金属掩模的主动对准。 细金属掩模通过多个微致动器与框架连接。 微致动器可以作用在细金属掩模上以拉伸掩模，重新定位掩模或两者。 以这种方式，可以相对于衬底维持细金属掩模的位置和尺寸。

公开(公告)号：US20240065043A1

公开(公告)日：2024-02-22

申请号：US18498140

申请日：2023-10-31

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Jungmin LEE ,  Chung-chia CHEN ,  Yusin LIN ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K59/173

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

公开(公告)号：US20240023379A1

公开(公告)日：2024-01-18

申请号：US18352802

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Chung-chia CHEN ,  Yu-hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K71/16

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K71/16 ,  H10K2102/103

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US20230354649A1

公开(公告)日：2023-11-02

申请号：US18065124

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Jungmin LEE ,  Chung-chia CHEN ,  Yusin LIN ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H01L27/3246 ,  H01L51/5225 ,  H01L27/3283

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

公开(公告)号：US20230263014A1

公开(公告)日：2023-08-17

申请号：US18183822

申请日：2023-03-14

Applicant: Applied Materials, Inc.

Inventor： Yu-hsin LIN ,  Ji Young CHOUNG ,  Chung-chia CHEN ,  Jungmin LEE ,  Wen-Hao WU ,  Takashi ANJIKI ,  Takuji KATO ,  Dieter HAAS ,  Si Kyoung KIM ,  Stefan KELLER

IPC: H10K59/122 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K71/16

Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.