公开(公告)号：US09431267B2

公开(公告)日：2016-08-30

申请号：US14093503

申请日：2013-12-01

Applicant: Applied Materials, Inc.

Inventor： Mayur Trivedi ,  Sushil Padiyar ,  Lakshmanan Karuppiah ,  Randhir Thakur

IPC: H01L21/311 ,  H01L21/308 ,  H01L21/67

CPC classification number: H01L21/3088 ,  H01L21/3086 ,  H01L21/67184 ,  H01L21/67207

Abstract: In some embodiments, an electronic device processing system is provided that includes a processing tool having a first subsystem configured to carry out a first subset of processes on a substrate having pattern features, the first subsystem including a first conformal deposition chamber and a first etch chamber. The processing tool includes a second subsystem coupled to the first subsystem and configured to carry out a second subset of processes on the substrate, the second subsystem including a second conformal deposition chamber and a second etch chamber. The processing tool is configured to employ the first and second subsystems to perform pitch division on the substrate within the processing tool so as to form a reduced-pitch pattern on the substrate. Numerous other embodiments are provided.

Abstract translation: 在一些实施例中，提供一种电子设备处理系统，其包括具有第一子系统的处理工具，第一子系统被配置为在具有图案特征的基板上执行第一子进程，第一子系统包括第一共形沉积室和第一蚀刻室 。 所述处理工具包括耦合到所述第一子系统并被配置为在所述衬底上执行第二子进程的第二子系统，所述第二子系统包括第二共形沉积室和第二蚀刻室。 处理工具被配置为使用第一和第二子系统在处理工具内的基板上执行螺距分割，以便在基板上形成减小的间距图案。 提供了许多其他实施例。

公开(公告)号：US20240017371A1

公开(公告)日：2024-01-18

申请号：US18352432

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US20220181179A1

公开(公告)日：2022-06-09

申请号：US17677402

申请日：2022-02-22

Applicant: Applied Materials, Inc.

Inventor： Ramesh Krishnamurthy ,  Lakshmanan Karuppiah

IPC: H01L21/67 ,  G05B19/418 ,  G01N21/84 ,  G01J5/00 ,  G01B11/06 ,  G01N21/3563 ,  H01L21/687

Abstract: Methods and apparatus for the in-situ measurement of metrology parameters are disclosed herein. Some embodiments of the disclosure further provide for the real-time adjustment of process parameters based on the measure metrology parameters. Some embodiments of the disclosure provide for a multi-stage processing chamber top plate with one or more sensors between process stations.

公开(公告)号：US20140039660A1

公开(公告)日：2014-02-06

申请号：US14046237

申请日：2013-10-04

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC: G05B15/02

CPC classification number: G05B15/02 ,  B24B37/013 ,  B24B49/12

Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

Abstract translation: 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。