公开(公告)号：US20220243331A1

公开(公告)日：2022-08-04

申请号：US17166762

申请日：2021-02-03

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Ganesh SUBBUSWAMY ,  Devi Raghavee VEERAPPAN ,  Thomas BREZOCZKY

IPC: C23C16/455 ,  C23C14/34 ,  C23C14/22

Abstract: Aspects of the present disclosure provide systems and apparatuses for a substrate processing assembly with a laminar flow cavity gas injection for high and low pressure. A dual gas reservoir assembly is provided in a substrate processing chamber, positioned within a lower shield assembly. A first gas reservoir is in fluid communication with a processing volume of the substrate processing assembly via a plurality of gas inlet, positioned circumferentially about the processing volume. A second gas reservoir is positioned circumferentially about the first gas reservoir, coupled therewith via one or more reservoir ports. The second gas reservoir is in fluid communication with a first gas source. A recursive path gas assembly is positioned in an upper shield body adjacent to an electrode to provide one or more gases to a dark space gap.

公开(公告)号：US20220068690A1

公开(公告)日：2022-03-03

申请号：US17008940

申请日：2020-09-01

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/67

Abstract: A method and apparatus for processing substrates is described herein. In one embodiment, a transfer apparatus is described that includes a blade, a plurality of support arms coupled to the blade, a plurality of grippers coupled to each of the support arms, and a grip actuator operably coupled to the support arms or one or more of the plurality of grippers.

公开(公告)号：US20210381101A1

公开(公告)日：2021-12-09

申请号：US16892173

申请日：2020-06-03

Applicant: Applied Materials, Inc.

Inventor： Nagabhushana NANJUNDAPPA ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY ,  Bhaskar PRASAD

IPC: C23C14/54 ,  H01L21/683 ,  C23C14/34

Abstract: Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

公开(公告)号：US20210358797A1

公开(公告)日：2021-11-18

申请号：US16875750

申请日：2020-05-15

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

公开(公告)号：US20140273752A1

公开(公告)日：2014-09-18

申请号：US14200149

申请日：2014-03-07

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Rixin PENG ,  Mario CORNEJO ,  Thomas BREZOCZKY ,  Fred REDEKER ,  Thomas H. OSTERHELD

IPC: B24B53/017 ,  B24B37/04

CPC classification number: B24B49/18 ,  B24B37/042 ,  B24B53/017

Abstract: A method and apparatus for conditioning a polishing pad used in a substrate polishing process. In one embodiment, a method for conditioning a polishing pad utilized to polish a substrate is provided. The method includes providing relative motion between an optical device and a polishing pad having a polishing medium disposed thereon, and scanning a processing surface of the polishing pad with a laser beam to condition the processing surface, wherein the laser beam has a wavelength that is substantially transparent to the polishing medium, but is reactive with the material of the polishing pad.

Abstract translation: 一种用于调整用于衬底抛光工艺中的抛光垫的方法和装置。 在一个实施例中，提供了一种用于调节用于抛光衬底的抛光垫的方法。 该方法包括提供光学装置与其上布置有抛光介质的抛光垫之间的相对运动，以及用激光束扫描抛光垫的处理表面以调节处理表面，其中激光束具有基本上 对抛光介质透明，但与抛光垫的材料反应。

公开(公告)号：US20250118583A1

公开(公告)日：2025-04-10

申请号：US18377572

申请日：2023-10-06

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Shankar KODLE ,  Thomas BREZOCZKY

IPC: H01L21/677 ,  H01L21/67

Abstract: A method including processing substrates in two stations on separate processing lines. In the first station of the first processing line, the method may include: loading a first substrate, and delivering a resource for a first configurable period, during which the resource is locked out from the first station of the second processing line. In the first station of the second processing line, the method may include: loading a second substrate, and delivering a resource for a second configurable period, during which the resource is locked out from the first station of the first processing line.

公开(公告)号：US20250069915A1

公开(公告)日：2025-02-27

申请号：US18811911

申请日：2024-08-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/677 ,  H01L21/687

Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The method includes magnetically levitating a carrier with a substrate disposed thereon in a first position between a reflector assembly and a heater assembly disposed within a housing of the station. The method further includes moving both the reflector assembly and the heater assembly from a retracted position to an extended position while the carrier is disposed between the reflector assembly and heater assembly. The method further includes degassing the substrate disposed on the carrier with the heater assembly while the reflector assembly and heater assembly are each in the extended position, wherein the degassing includes pumping a purge gas through a gas port formed in at least one of the reflector assembly or the heater assembly towards the substrate.

公开(公告)号：US20240153803A1

公开(公告)日：2024-05-09

申请号：US18141931

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/677 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  C23C16/458 ,  H01F7/20 ,  H01L21/687

CPC classification number: H01L21/67709 ,  C23C14/34 ,  C23C14/50 ,  C23C14/566 ,  C23C16/4583 ,  H01F7/206 ,  H01L21/67712 ,  H01L21/68742

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20230178416A1

公开(公告)日：2023-06-08

申请号：US17923908

申请日：2021-04-12

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

公开(公告)号：US20220415635A1

公开(公告)日：2022-12-29

申请号：US17359348

申请日：2021-06-25

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao YEDLA ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Hari Prasath RAJENDRAN

IPC: H01J37/34 ,  C23C14/54 ,  C23C14/35

Abstract: Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.