Resist developing method by magnetic field controlling, resist developing apparatus and method of fabricating semiconductor device
    11.
    发明授权
    Resist developing method by magnetic field controlling, resist developing apparatus and method of fabricating semiconductor device 有权
    通过磁场控制的抗蚀显影方法,抗蚀剂显影装置和制造半导体器件的方法

    公开(公告)号:US06279502B1

    公开(公告)日:2001-08-28

    申请号:US09182631

    申请日:1998-10-30

    申请人: Tsukasa Azuma

    发明人: Tsukasa Azuma

    IPC分类号: B05C1102

    CPC分类号: G03F7/3021 Y10S204/05

    摘要: A semiconductor device is fabricated by the steps of coating an underlayer formed on a semiconductor substrate with chemically amplified resist, exposing the resist to light, bringing the resist into contact with an alkaline developing solution with applying a magnetic field to the alkaline developing solution for conducting development to form a resist pattern, and etching the underlayer on the semiconductor substrate using the resist pattern as a mask.

    摘要翻译: 通过以下步骤制造半导体器件:通过化学放大抗蚀剂涂覆在半导体衬底上形成的底层,将抗蚀剂曝光,使抗蚀剂与碱性显影溶液接触,同时向碱性显影液施加磁场,以进行导电 显影以形成抗蚀剂图案,并且使用抗蚀剂图案作为掩模来蚀刻半导体衬底上的底层。

    Lithography process using one or more anti-reflective coating films and
fabrication process using the lithography process
    12.
    发明授权
    Lithography process using one or more anti-reflective coating films and fabrication process using the lithography process 失效
    使用一种或多种抗反射涂膜的光刻工艺和使用光刻工艺的制造工艺

    公开(公告)号:US6051369A

    公开(公告)日:2000-04-18

    申请号:US4390

    申请日:1998-01-08

    摘要: A lithography process includes a step of forming an antireflective coating film on a substrate. A film is formed on the antireflective film and a radiation sensitive film is formed on the film. The radiation sensitive film is selectively exposed. During the selective exposing, the antireflective film covers the lower surface of the portion of film on which the radiation sensitive film is formed, and the antireflective coating film reduces reflections of radiation during the selective exposing of the radiation sensitive film. A fabrication process using the lithography process is also described.

    摘要翻译: 光刻工艺包括在衬底上形成抗反射涂层的步骤。 在抗反射膜上形成膜,在膜上形成辐射敏感膜。 曝光敏感膜被选择性曝光。 在选择性曝光期间,防反射膜覆盖其上形成有辐射敏感膜的膜的部分的下表面,并且抗反射涂膜在放射敏感膜的选择性曝光期间减少了辐射的反射。 还描述了使用光刻工艺的制造工艺。

    Pattern forming method
    13.
    发明授权
    Pattern forming method 失效
    图案形成方法

    公开(公告)号:US5879863A

    公开(公告)日:1999-03-09

    申请号:US787390

    申请日:1997-01-22

    CPC分类号: G03F7/11 G03F7/0045 G03F7/085

    摘要: Disclosed is a method of forming a pattern, comprising the steps of forming an underlying film on a semiconductor substrate, bringing a vapor of a neutralizer, which generates an acid upon exposure to light, into contact with the surface of the underlying film so as to form a primer layer, coating the primer layer with a chemical amplification resist, and selectively exposing the resist layer to light, followed by developing to form a resist pattern.

    摘要翻译: 公开了一种形成图案的方法,包括以下步骤:在半导体衬底上形成下面的膜,使在暴露于光时产生酸的中和剂的蒸汽与下面的膜的表面接触,从而 形成底漆层,用化学放大抗蚀剂涂覆底漆层,并将抗蚀剂层选择性地曝光,随后显影以形成抗蚀剂图案。

    Avoidance of pattern shortening by using off axis illumination with
dipole and polarizing apertures
    14.
    发明授权
    Avoidance of pattern shortening by using off axis illumination with dipole and polarizing apertures 失效
    通过使用偶极和偏光孔的离轴照明来避免图案缩短

    公开(公告)号:US5815247A

    公开(公告)日:1998-09-29

    申请号:US531767

    申请日:1995-09-21

    摘要: A system and method of avoiding pattern shortening without resorting to generating a mask with a bias solve the direction dependent differences in exposure behavior in photolithography processes in the manufacture of semiconductor devices. Instead of designing a biased mask to solve the exposure problem, the pattern shortening effect is avoided by influencing the exposure process itself. By using an off axis illumination technique, the exposure is separated into different directions. In one embodiment, off axis illumination is applied in combination with special dipole apertures (i.e., two openings). The exposure is done in two or more parts, whereby the aperture is twisted between exposures. In another embodiment, off axis illumination is used in combination with special polarizer apertures. As with the first embodiment, the exposure is done in two or more parts, but in this case with differently polarized light.

    摘要翻译: 避免图案缩短的系统和方法,而不用借助于产生具有偏置的掩模来解决半导体器件的制造中光刻工艺中的曝光行为的方向相关差异。 不是设计偏置掩模来解决曝光问题,而是通过影响曝光过程本身来避免图案缩短效果。 通过使用离轴照明技术,将曝光分离成不同的方向。 在一个实施例中,离轴照明与特殊偶极子孔(即两个开口)组合施加。 曝光是在两个或更多部分进行的,由此孔径在曝光之间扭转。 在另一个实施例中,离轴照明与特殊的偏振器孔组合使用。 与第一实施例一样,曝光在两个或更多个部分中进行,但是在这种情况下以不同的偏振光进行曝光。

    Heat resisting steels
    15.
    发明授权
    Heat resisting steels 失效
    耐热钢

    公开(公告)号:US5560788A

    公开(公告)日:1996-10-01

    申请号:US461404

    申请日:1995-06-05

    CPC分类号: C22C38/30 C22C38/22

    摘要: A heat resisting steels comprising, on percentage by weight basis, 0.05 to 0.2% of C, not more than 1.0% of Ni, 9 to 13% of Cr, 0.05 to 1% of Mo, 0.05 to 0.3% of V, 1 to 3% of W, 1 to 5% of Co, 0.01 to 0.1% of N, at least one member selected from 0.01 to 0.15% of Nb, 0.01 to 0.15% of Ta, 0.003 to 0.03% of a rare earth element, 0.003 to 0.03% of Ca and 0.003 to 0.03% of B, and the remainder of Fe and unavoidable impurities have enhanced high temperature characteristics and are suitable for use in parts of turbine such as turbine rotors, turbine blades, turbine disks and bolts.

    摘要翻译: 一种耐热钢,其以重量%计含有0.05%至0.2%的C,不超过1.0%的Ni,9至13%的Cr,0.05至1%的Mo,0.05至0.3%的V,1至 3%的W,1〜5%的Co,0.01〜0.1%的N,选自0.01〜0.15%的Nb,0.01〜0.15%的Ta,0.003〜0.03%的稀土元素,0.003 至0.03%的Ca和0.003〜0.03%的B,其余的Fe和不可避免的杂质具有提高的高温特性,并且适用于涡轮机的部件,例如涡轮转子,涡轮叶片,涡轮盘和螺栓。

    HIGH STRENGTH AND HIGH TOUGHNESS CAST STEEL MATERIAL AND METHOD FOR PRODUCING THE SAME
    18.
    发明申请
    HIGH STRENGTH AND HIGH TOUGHNESS CAST STEEL MATERIAL AND METHOD FOR PRODUCING THE SAME 有权
    高强度和高韧性铸钢材料及其制造方法

    公开(公告)号:US20120180912A1

    公开(公告)日:2012-07-19

    申请号:US13498057

    申请日:2010-09-24

    IPC分类号: C21D6/00 C22C38/44

    摘要: A high strength and high toughness cast steel material of the invention has a composition comprising 0.10 to 0.20% by mass of C, 0.10 to 0.50% by mass of Si, 0.40 to 1.20% by mass of Mn, 2.00 to 3.00% by mass of Ni, 0.20 to 0.70% by mass of Cr, and 0.10 to 0.50% by mass of Mo, and further comprising Fe and unavoidable impurities. The high strength and high toughness cast steel material of the invention is produced by subjecting an ingot having the above composition to annealing at 1,000 to 1,100° C., quenching at 850 to 950° C., tempering at 610 to 670° C., and then, if desired, stress-relief annealing at less than 610° C.

    摘要翻译: 本发明的高强度,高韧性的铸钢材料,具有C:0.10〜0.20质量%,Si:0.10〜0.50质量%,Mn:0.40〜1.20质量%,2.00〜3.00质量% Ni,0.20〜0.70质量%的Cr和0.10〜0.50质量%的Mo,还含有Fe和不可避免的杂质。 本发明的高强度高韧性铸钢材料是通过对上述组成的锭进行1000〜1100℃的退火,在850〜950℃淬火,在610〜670℃回火, 然后如果需要,在小于610℃的应力消除退火

    Photomask
    19.
    发明授权
    Photomask 有权
    光掩模

    公开(公告)号:US06576375B1

    公开(公告)日:2003-06-10

    申请号:US09671678

    申请日:2000-09-28

    IPC分类号: G03F900

    摘要: A photomask comprises a transparent substrate, a anti-reflection structure having a chromium oxide film, a chromium film and a chromium oxide film laminated in order on the major surface of the transparent substrate, an LiF film as a anti-reflection film formed on the surface of the first chromium oxide and at the interface between the chromium oxide film and the transparent substrate, and a spin-on-glass film formed on the surface of the chromium oxide film.

    摘要翻译: 光掩模包括透明基板,在透明基板的主表面上依次层叠有氧化铬膜,铬膜和氧化铬膜的防反射结构,形成在透明基板上的防反射膜的LiF膜 第一氧化铬的表面和氧化铬膜与透明基板的界面,以及在氧化铬膜的表面上形成的旋涂玻璃膜。

    Pattern forming method using chemically amplified resist and apparatus
for treating chemically amplified resist
    20.
    发明授权
    Pattern forming method using chemically amplified resist and apparatus for treating chemically amplified resist 失效
    使用化学放大抗蚀剂的图案形成方法和用于处理化学放大抗蚀剂的装置

    公开(公告)号:US6096484A

    公开(公告)日:2000-08-01

    申请号:US951112

    申请日:1997-10-15

    申请人: Tsukasa Azuma

    发明人: Tsukasa Azuma

    CPC分类号: G03F7/265

    摘要: A chemically amplified resist is applied to a semiconductor substrate and subjected to post-apply bake, and exposed to light, then, the resist is treated with a vapor of an organic solvent such as PGMEA. By treating with the vapor of the organic solvent, acid diffusion in the resist in the post-exposure bake is suppressed, and a resist pattern having an excellent profile is obtained by development.

    摘要翻译: 将化学放大抗蚀剂施加到半导体衬底上并进行后施加烘烤并曝光,然后用有机溶剂如PGMEA的蒸气处理抗蚀剂。 通过用有机溶剂的蒸气处理,抑制后曝光烘烤中的抗蚀剂中的酸扩散,并且通过显影获得具有优异外形的抗蚀剂图案。