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公开(公告)号:US10168037B1
公开(公告)日:2019-01-01
申请号:US15171328
申请日:2016-06-02
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: David Neuman , Scott Lindblad , Pat Connolly
IPC: F21K9/90 , F21V23/00 , F21Y101/02
Abstract: A disclosed lighting apparatus includes a first dielectric sheet disposed on the first electrically conductive sheet and a second electrically conductive sheet disposed on the first dielectric sheet. A plurality of solid-state lighting (SSL) elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet. The first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet have bends that configure the first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet in a three-dimensional shape.
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公开(公告)号:US09606285B1
公开(公告)日:2017-03-28
申请号:US14575648
申请日:2014-12-18
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman , Matthew Odden
IPC: F21V8/00 , F21Y101/02 , F21Y105/00
CPC classification number: G02B6/0083 , F21V23/002 , F21Y2103/10 , F21Y2115/10 , G02B6/0081 , H01L2224/49109
Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of light-emitting diodes (LEDs) have light emitting portions that face a portion of the light-diffusive plate. The LEDs are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.
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公开(公告)号:US09431363B1
公开(公告)日:2016-08-30
申请号:US14553519
申请日:2014-11-25
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman , Robert Neuman
CPC classification number: H01L24/46 , G06K19/07749 , G06K19/0775 , G06K19/07783 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L33/62 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48472 , H01L2224/48997 , H01L2224/4903 , H01L2224/4905 , H01L2224/4911 , H01L2224/494 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/0782 , H01L2924/12041 , H01L2924/14 , H01L2924/19107 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
Abstract: A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.
Abstract translation: 电路装置包括衬底,附着到衬底的集成电路(IC)部件和附接到衬底的一个或多个圆形线段。 一个或多个圆形线段具有用于连接到IC部件的第一和第二部分,并且每个第一和第二部分具有沿着线纵向延伸的平面着陆区域。 电路装置还包括将着陆区域连接到IC部件的接合线。
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公开(公告)号:US08893976B1
公开(公告)日:2014-11-25
申请号:US13945016
申请日:2013-07-18
Applicant: Automated Assembly Corporation
Inventor: Scott Lindblad , David Neuman , Robert Neuman
IPC: G06K19/02 , G06K19/077
CPC classification number: G06K19/07798 , B60R2325/105 , G08G1/017 , G09F3/0292 , G09F3/0297
Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.
Abstract translation: 防篡改电子系统包括具有设置在DV基板的第一表面上的导电布线的可破坏乙烯基(DV)基板。 RFID设备具有机械地和电连接到DV基板的第一表面上的布线的引脚。 板具有第一表面,并且板的第一表面的一部分粘附到DV基板的第一表面的一部分。 该板具有包围RFID装置的空腔。 背衬粘附到板的与板的第一表面相对的第二表面。
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公开(公告)号:US10169698B1
公开(公告)日:2019-01-01
申请号:US14067527
申请日:2013-10-30
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman , Robert Neuman
IPC: G06K19/00 , G06K19/077
Abstract: The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna.
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公开(公告)号:US10168038B1
公开(公告)日:2019-01-01
申请号:US15469773
申请日:2017-03-27
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman
Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of solid-state lighting (SSL) elements have light emitting portions that face a portion of the light-diffusive plate. The SSL elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.
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公开(公告)号:US09897292B1
公开(公告)日:2018-02-20
申请号:US15146411
申请日:2016-05-04
Applicant: Automated Assembly Corporation
Inventor: Scott Lindblad , David Neuman , Robert Neuman
IPC: H01L31/00 , H01L31/18 , H01L33/36 , H01L33/00 , F21V19/00 , F21V23/00 , F21V17/10 , F21S4/24 , G06K19/077 , H01L27/00 , F21Y101/02 , F21Y103/00
CPC classification number: F21V19/0015 , F21K9/00 , F21S4/24 , F21V17/101 , F21V19/005 , F21V23/001 , F21Y2101/02 , F21Y2101/025 , F21Y2103/003 , F21Y2103/10 , F21Y2115/30 , G06K19/07758 , H01L24/00 , H01L25/167 , H01L33/486
Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and solid state lighting elements are disposed on the adhesive layer and coupled to the power wires.
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公开(公告)号:US09151454B1
公开(公告)日:2015-10-06
申请号:US14021864
申请日:2013-09-09
Applicant: AUTOMATED ASSEMBLY CORPORATION
Inventor: Scott Lindblad , David Neuman , Robert Neuman
IPC: F21K99/00
CPC classification number: F21K9/30 , F21K9/20 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , G09F9/33 , G09F2013/222
Abstract: A lighting module is disclosed and includes a light emitting diode (LED) panel having a plurality of LEDs and two or more conductive contacts. A boxlike member has a base and sidewalls. The sidewalls have passages that provide ingress to and egress from the boxlike member for power wires. One or more mounting members are attached to the boxlike member for removably attaching the LED panel. A circuit board is disposed in the boxlike member, and the circuit board includes two or more insertion force connectors for connecting to power wires. The circuit board further includes two or more board connectors that engage the conductive contacts of the LED panel and electrically couple the conductive contacts of the LED panel to the insertion force connectors.
Abstract translation: 公开了一种照明模块,并且包括具有多个LED和两个或多个导电触点的发光二极管(LED)面板。 盒状构件具有基部和侧壁。 侧壁具有通向电源线的盒状构件的入口和出口。 一个或多个安装构件附接到盒状构件以可拆卸地附接LED面板。 电路板设置在盒状构件中,并且电路板包括用于连接到电源线的两个或更多个插入力连接器。 电路板还包括两个或更多个板连接器,其接合LED面板的导电触点并将LED面板的导电触点电耦合到插入力连接器。
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