公开(公告)号：US09781839B1

公开(公告)日：2017-10-03

申请号：US14883302

申请日：2015-10-14

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： David Neuman ,  Robert Neuman ,  Pat Connolly ,  Brian Backes

IPC: H05K3/10 ,  H05K3/32

CPC classification number: H05K3/321 ,  H05K3/10 ,  H05K3/103 ,  H05K2201/10287

Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.

公开(公告)号：US20170200694A1

公开(公告)日：2017-07-13

申请号：US15427875

申请日：2017-02-08

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

公开(公告)号：US10438109B1

公开(公告)日：2019-10-08

申请号：US15416628

申请日：2017-01-26

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman

IPC: G06K19/077 ,  G06K19/07 ,  H05K3/30 ,  H05K1/18 ,  H05K1/09 ,  H05K1/03

Abstract: A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.

公开(公告)号：US09431363B1

公开(公告)日：2016-08-30

申请号：US14553519

申请日：2014-11-25

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC: H01L29/30 ,  H01L23/00

CPC classification number: H01L24/46 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07783 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/4905 ,  H01L2224/4911 ,  H01L2224/494 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0782 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.

Abstract translation: 电路装置包括衬底，附着到衬底的集成电路（IC）部件和附接到衬底的一个或多个圆形线段。 一个或多个圆形线段具有用于连接到IC部件的第一和第二部分，并且每个第一和第二部分具有沿着线纵向延伸的平面着陆区域。 电路装置还包括将着陆区域连接到IC部件的接合线。

公开(公告)号：US08893976B1

公开(公告)日：2014-11-25

申请号：US13945016

申请日：2013-07-18

Applicant: Automated Assembly Corporation

Inventor： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC: G06K19/02 ,  G06K19/077

CPC classification number: G06K19/07798 ,  B60R2325/105 ,  G08G1/017 ,  G09F3/0292 ,  G09F3/0297

Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.

Abstract translation: 防篡改电子系统包括具有设置在DV基板的第一表面上的导电布线的可破坏乙烯基（DV）基板。 RFID设备具有机械地和电连接到DV基板的第一表面上的布线的引脚。 板具有第一表面，并且板的第一表面的一部分粘附到DV基板的第一表面的一部分。 该板具有包围RFID装置的空腔。 背衬粘附到板的与板的第一表面相对的第二表面。

公开(公告)号：US10381325B1

公开(公告)日：2019-08-13

申请号：US15668870

申请日：2017-08-04

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Kimmo Kyllonen ,  Robert Neuman

IPC: H01L23/52 ,  H01L23/00 ,  B23K20/00

Abstract: A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.

公开(公告)号：US10169698B1

公开(公告)日：2019-01-01

申请号：US14067527

申请日：2013-10-30

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC: G06K19/00 ,  G06K19/077

Abstract: The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna.

公开(公告)号：US09897292B1

公开(公告)日：2018-02-20

申请号：US15146411

申请日：2016-05-04

Applicant: Automated Assembly Corporation

Inventor： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC: H01L31/00 ,  H01L31/18 ,  H01L33/36 ,  H01L33/00 ,  F21V19/00 ,  F21V23/00 ,  F21V17/10 ,  F21S4/24 ,  G06K19/077 ,  H01L27/00 ,  F21Y101/02 ,  F21Y103/00

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21S4/24 ,  F21V17/101 ,  F21V19/005 ,  F21V23/001 ,  F21Y2101/02 ,  F21Y2101/025 ,  F21Y2103/003 ,  F21Y2103/10 ,  F21Y2115/30 ,  G06K19/07758 ,  H01L24/00 ,  H01L25/167 ,  H01L33/486

Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and solid state lighting elements are disposed on the adhesive layer and coupled to the power wires.

公开(公告)号：US09151454B1

公开(公告)日：2015-10-06

申请号：US14021864

申请日：2013-09-09

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC: F21K99/00

CPC classification number: F21K9/30 ,  F21K9/20 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  G09F9/33 ,  G09F2013/222

Abstract: A lighting module is disclosed and includes a light emitting diode (LED) panel having a plurality of LEDs and two or more conductive contacts. A boxlike member has a base and sidewalls. The sidewalls have passages that provide ingress to and egress from the boxlike member for power wires. One or more mounting members are attached to the boxlike member for removably attaching the LED panel. A circuit board is disposed in the boxlike member, and the circuit board includes two or more insertion force connectors for connecting to power wires. The circuit board further includes two or more board connectors that engage the conductive contacts of the LED panel and electrically couple the conductive contacts of the LED panel to the insertion force connectors.

Abstract translation: 公开了一种照明模块，并且包括具有多个LED和两个或多个导电触点的发光二极管（LED）面板。 盒状构件具有基部和侧壁。 侧壁具有通向电源线的盒状构件的入口和出口。 一个或多个安装构件附接到盒状构件以可拆卸地附接LED面板。 电路板设置在盒状构件中，并且电路板包括用于连接到电源线的两个或更多个插入力连接器。 电路板还包括两个或更多个板连接器，其接合LED面板的导电触点并将LED面板的导电触点电耦合到插入力连接器。

公开(公告)号：US09900992B1

公开(公告)日：2018-02-20

申请号：US15401143

申请日：2017-01-09

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman

IPC: H01L33/62 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.