ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
    11.
    发明申请
    ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE 有权
    阵列基板,其制造方法和显示装置

    公开(公告)号:US20160247835A1

    公开(公告)日:2016-08-25

    申请号:US14769658

    申请日:2014-10-24

    Abstract: An array substrate, a manufacturing method thereof and a display device are disclosed. The array substrate comprises: a base substrate (1), thin-film transistors (TFTs), an isolation layer (10) and an organic resin layer (8) formed on the base substrate (1), and a common electrode layer (12) formed on the organic resin layer (8). The isolation layer (10) covers source electrodes (6) and drain electrodes (7) of the TFTs; the organic resin layer (8) covers the isolation layer (10) and is provided with first through holes (9) corresponding to the drain electrodes (7) of the TFTs; the isolation layer (10) is provided with second through holes (11) communicated with the first through holes (9) to expose partial drain electrodes (7); and the dimension of the second through holes (11) is greater than that of the first through holes (9). The array substrate, the manufacturing method thereof and the display device resolve the problem of forming dark dots, ensure the product quality, reduce the waste of production materials, and reduce the production cost.

    Abstract translation: 公开了阵列基板,其制造方法和显示装置。 阵列基板包括:基底(1),薄膜晶体管(TFT),隔离层(10)和形成在基底基板(1)上的有机树脂层(8),以及公共电极层 )形成在有机树脂层(8)上。 隔离层(10)覆盖TFT的源电极(6)和漏极(7); 有机树脂层(8)覆盖隔离层(10)并且设置有与TFT的漏电极(7)对应的第一通孔(9) 所述隔离层(10)设置有与所述第一通孔(9)连通以暴露部分漏电极(7)的第二通孔(11)。 并且第二通孔(11)的尺寸大于第一通孔(9)的尺寸。 阵列基板及其制造方法和显示装置解决形成暗点的问题,确保产品质量,减少生产材料的浪费,降低生产成本。

    DISPLAY MODULE AND DISPLAY APPARATUS

    公开(公告)号:US20240389432A1

    公开(公告)日:2024-11-21

    申请号:US18250652

    申请日:2022-04-26

    Abstract: A display module includes a display panel having a fingerprint identification area and a light-transmitting protective film located on a back surface of the display panel. The light-transmitting protective film includes a protective layer, a light-shielding pattern located on a side of the protective layer, and a light-transmitting adhesive layer located on a side of the light-shielding pattern away from the protective layer. The protective layer has a target area. At least the target area is a light-transmitting area, and the target area at least partially overlaps with the fingerprint identification area. The light-shielding pattern defines a plurality of imaging apertures, the plurality of imaging apertures are arranged at intervals, and orthogonal projection of the plurality of imaging apertures on the protective layer are at least located in the target area. A surface of the light-transmitting adhesive layer away from the light-shielding pattern is in contact with the display panel.

    PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE

    公开(公告)号:US20240224416A1

    公开(公告)日:2024-07-04

    申请号:US17800660

    申请日:2021-11-02

    CPC classification number: H05K1/0272 H05K1/028 H05K3/386 H05K2201/10128

    Abstract: A printed circuit board and a fabricating method thereof, and a displaying device. The printed circuit board includes a hard-board region (30) and a soft-board region (31), the soft-board region (31) is located at the periphery of the first edge (30a) of the hard-board region (30), the printed circuit board within the hard-board region (30) includes a base plate (301), and an adhesive film (302), a covering film (303) and a first metal layer (304) that are arranged in layer configuration on one side of the base plate (301), the adhesive film (302) is closest to the base plate (301), a flow guiding groove (3030) is disposed on the surface of the side of the covering film (303) that is closer to the adhesive film (302), and the flow guiding groove (3030) extends to a second edge (30b) of the hard-board region (30). By disposing the flow guiding groove on the surface of the side of the covering film that is closer to the adhesive film, and disposing that the flow guiding groove extends to the second edge of the hard-board region, the overflowing adhesive of the adhesive film can be effectively guided to flow to the periphery of the second edge via the flow guiding groove, and because the soft-board region is located at the periphery of the first edge, the method can effectively reduce the overflowing adhesive to flow to the soft-board region, reduce the reserved overflowing-adhesive room of the printed circuit board, and reduce the size of the printed circuit board.

    DISPLAY DEVICE
    16.
    发明申请

    公开(公告)号:US20220192027A1

    公开(公告)日:2022-06-16

    申请号:US17270503

    申请日:2020-05-22

    Abstract: The present disclosure relates to the technical field of display, and discloses a display device. The display device includes: a display module having a module body and a first bonding portion located on one side of a first long edge of the module body, where the first bonding portion is bent to the back face of the module body; and a first flexible printed circuit located on the back face of the module body, where the first flexible printed circuit has a second bonding portion, and the second bonding portion is fixedly connected to the first bonding portion of the display module; the length of the second bonding portion along an extending direction of the first long edge is substantially identical with the length of the first bonding portion along the extending direction of the first long edge.

    DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE

    公开(公告)号:US20190115371A1

    公开(公告)日:2019-04-18

    申请号:US16092380

    申请日:2018-03-05

    Abstract: A display substrate, a manufacturing method thereof, and a display device are provided. The manufacturing method of the display substrate includes: forming a pattern of first transparent conductive layer, forming a passivation layer and forming a second transparent conductive layer on the passivation layer, forming a pattern of second transparent conductive layer, i.e., a slit electrode, the pattern of second transparent conductive layer including a plurality of sub-electrodes arranged at intervals and located in a display region of the display substrate; and removing a portion of the passivation layer which is in the display region and is not covered by the sub-electrodes, forming a pattern of passivation layer. The second transparent conductive layer is polycrystalline ITO.

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