Abstract:
An array substrate, a manufacturing method thereof and a display device are disclosed. The array substrate comprises: a base substrate (1), thin-film transistors (TFTs), an isolation layer (10) and an organic resin layer (8) formed on the base substrate (1), and a common electrode layer (12) formed on the organic resin layer (8). The isolation layer (10) covers source electrodes (6) and drain electrodes (7) of the TFTs; the organic resin layer (8) covers the isolation layer (10) and is provided with first through holes (9) corresponding to the drain electrodes (7) of the TFTs; the isolation layer (10) is provided with second through holes (11) communicated with the first through holes (9) to expose partial drain electrodes (7); and the dimension of the second through holes (11) is greater than that of the first through holes (9). The array substrate, the manufacturing method thereof and the display device resolve the problem of forming dark dots, ensure the product quality, reduce the waste of production materials, and reduce the production cost.
Abstract:
A circuit board includes a substrate, a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer includes a plurality of first conductive portions. The second conductive layer includes a plurality of second conductive portions. A second conductive portion passes through a first via hole in the first insulating layer to be in electrical contact with a first conductive portion. The first conductive layer and the second conductive layer each include at least one main conductive layer, which is capable of creating a first intermetallic compound with solder. At least one of the first conductive layer and the second conductive layer further includes a stop layer capable of creating a second intermetallic compound with the solder. A rate of a reaction between the stop layer and the solder is lower than a rate of a reaction between the main conductive layer and the solder.
Abstract:
A display device, a gamma voltage data group switching method and module. The display device includes a display-driver integrated circuit and a first storage unit. The display-driver integrated circuit includes a second storage unit, and the display device includes a gamma voltage data group switching module. The gamma voltage data group switching module is configured to pre-store, in the first storage unit, multiple groups of gamma voltage data groups respectively applied to various application scenarios; when switching of an application scenario of the display device, load a gamma voltage data group corresponding to the current application scenario and stored in the first storage unit into the second storage unit.
Abstract:
A display module includes a display panel having a fingerprint identification area and a light-transmitting protective film located on a back surface of the display panel. The light-transmitting protective film includes a protective layer, a light-shielding pattern located on a side of the protective layer, and a light-transmitting adhesive layer located on a side of the light-shielding pattern away from the protective layer. The protective layer has a target area. At least the target area is a light-transmitting area, and the target area at least partially overlaps with the fingerprint identification area. The light-shielding pattern defines a plurality of imaging apertures, the plurality of imaging apertures are arranged at intervals, and orthogonal projection of the plurality of imaging apertures on the protective layer are at least located in the target area. A surface of the light-transmitting adhesive layer away from the light-shielding pattern is in contact with the display panel.
Abstract:
A printed circuit board and a fabricating method thereof, and a displaying device. The printed circuit board includes a hard-board region (30) and a soft-board region (31), the soft-board region (31) is located at the periphery of the first edge (30a) of the hard-board region (30), the printed circuit board within the hard-board region (30) includes a base plate (301), and an adhesive film (302), a covering film (303) and a first metal layer (304) that are arranged in layer configuration on one side of the base plate (301), the adhesive film (302) is closest to the base plate (301), a flow guiding groove (3030) is disposed on the surface of the side of the covering film (303) that is closer to the adhesive film (302), and the flow guiding groove (3030) extends to a second edge (30b) of the hard-board region (30). By disposing the flow guiding groove on the surface of the side of the covering film that is closer to the adhesive film, and disposing that the flow guiding groove extends to the second edge of the hard-board region, the overflowing adhesive of the adhesive film can be effectively guided to flow to the periphery of the second edge via the flow guiding groove, and because the soft-board region is located at the periphery of the first edge, the method can effectively reduce the overflowing adhesive to flow to the soft-board region, reduce the reserved overflowing-adhesive room of the printed circuit board, and reduce the size of the printed circuit board.
Abstract:
The present disclosure relates to the technical field of display, and discloses a display device. The display device includes: a display module having a module body and a first bonding portion located on one side of a first long edge of the module body, where the first bonding portion is bent to the back face of the module body; and a first flexible printed circuit located on the back face of the module body, where the first flexible printed circuit has a second bonding portion, and the second bonding portion is fixedly connected to the first bonding portion of the display module; the length of the second bonding portion along an extending direction of the first long edge is substantially identical with the length of the first bonding portion along the extending direction of the first long edge.
Abstract:
The invention relates to a display panel, a preparation method thereof and a display device. The display panel comprises: a substrate comprising a display area and a non-display area at least positioned on one side of the display area, one or more via holes are formed in the non-display area; a circuit layer positioned on one side of the substrate and comprising a plurality of traces which extend from the display area of the substrate to the non-display area; and bonding pads positioned on one side of the substrate away from the circuit layer, an orthographic projection of the bonding pads on the substrate covers an orthographic projection of the one or more via holes on the substrate, and the circuit layer is connected with the bonding pads through the one or more via holes.
Abstract:
A display substrate, a manufacturing method thereof, and a display device are provided. The manufacturing method of the display substrate includes: forming a pattern of first transparent conductive layer, forming a passivation layer and forming a second transparent conductive layer on the passivation layer, forming a pattern of second transparent conductive layer, i.e., a slit electrode, the pattern of second transparent conductive layer including a plurality of sub-electrodes arranged at intervals and located in a display region of the display substrate; and removing a portion of the passivation layer which is in the display region and is not covered by the sub-electrodes, forming a pattern of passivation layer. The second transparent conductive layer is polycrystalline ITO.
Abstract:
Embodiments of the disclosure provide an array substrate and a fabrication method thereof, and a display device. The array substrate includes: a base substrate and a switch unit disposed on the base substrate. The array substrate further includes: a passivation layer disposed on the base substrate and a spacer disposed on the passivation layer; and the spacer corresponds to the switch unit.
Abstract:
Provided is a display device. The display device includes a display panel and a circuit board. The display panel includes a display region and a non-display region. A first wiring is distributed in the non-display region. A second wiring is distributed in the circuit board. The circuit board is bonded to the non-display region, and the second wiring is connected to the first wiring to form a near-field communication antenna.