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19 条记录 (耗时 0.023 秒)

    Hook interconnect
    13.
    发明授权
    Hook interconnect 失效
    钩互连

    公开(公告)号：US07128579B1

    公开(公告)日：2006-10-31

    申请号：US11161858

    申请日：2005-08-19

    申请人： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Robin A. Susko ,  James R. Wilcox

    发明人： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Robin A. Susko ,  James R. Wilcox

    IPC分类号： H01R12/00

    CPC分类号： H01R12/523 ,  H01R12/58 ,  Y10S439/907 ,  Y10S439/908

    摘要： Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.

    摘要翻译： 公开了一种半导体封装结构，其结合使用导电引脚来电和机械地连接半导体模块和基板（例如，印刷线路板）。 具体地，销的一端或两端被钩住并且适于允许与半导体模块和衬底中的一个或两者的电镀通孔的壁压合连接。 销的钩形端可以具有一个或多个钩以建立连接。 此外，销可以由温度诱导的形状变化材料形成，该材料弯曲以允许钩状端部与电镀通孔的壁接合和/或脱离。

    Thermal/electrical break for printed circuit boards
    14.
    发明授权
    Thermal/electrical break for printed circuit boards 失效
    印刷电路板的热/电断裂

    公开(公告)号：US06235994B1

    公开(公告)日：2001-05-22

    申请号：US09106909

    申请日：1998-06-29

    申请人： Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Randall J. Stutzman ,  George H. Thiel

    发明人： Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  Randall J. Stutzman ,  George H. Thiel

    IPC分类号： H05K100

    CPC分类号： H05K1/0201 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0969

    摘要： A multi-layer printed circuit board including at least one layer of an electrically conducting material and at least one layer of an electrically insulating material. At least one through hole formed at least through the at least one layer of electrically conducting material. The at least one through hole includes a material plated on an interior surface thereof. At least one thermal break is provided in the at least one layer of electrically conducting material, such that heat passing between the through hole and the at least one layer of electrically conducting material passes through the at least one thermal break. At least one electrical connection provided in the at least one layer of electrically conducting material between the material plated on the interior surface of the through hole and the at least one layer of electrically conducting material. At least a portion of the at least one electrical connection is between the through hole and the at least one thermal break.

    摘要翻译： 一种多层印刷电路板，包括至少一层导电材料层和至少一层电绝缘材料层。 至少一个至少通过至少一层导电材料形成的通孔。 所述至少一个通孔包括镀在其内表面上的材料。 在所述至少一层导电材料中提供至少一个热断裂，使得在所述通孔和所述至少一层导电材料之间通过的热量通过所述至少一个热断裂。 在所述至少一层导电材料中的至少一个电连接处，所述至少一层电导材料涂覆在所述通孔的内表面上的所述材料与所述至少一层导电材料之间。 至少一个电连接的至少一部分在通孔和至少一个热断裂之间。

    Heat sink
    15.
    发明授权
    Heat sink 有权
    散热器

    公开(公告)号：US07856341B2

    公开(公告)日：2010-12-21

    申请号：US12033200

    申请日：2008-02-19

    申请人： Brian L. Carlson ,  Bruce J. Chamberlin ,  Mark K. Hoffmeyer ,  Ahmad D. Katnani ,  Matthew S. Kelly ,  Gregory S. Killinger ,  Eric V. Kline ,  Wayne J. Rothschild ,  Jeffrey A. Taylor

    发明人： Brian L. Carlson ,  Bruce J. Chamberlin ,  Mark K. Hoffmeyer ,  Ahmad D. Katnani ,  Matthew S. Kelly ,  Gregory S. Killinger ,  Eric V. Kline ,  Wayne J. Rothschild ,  Jeffrey A. Taylor

    IPC分类号： G06F11/30

    CPC分类号： G01K1/14 ,  G01K3/005

    摘要： Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on the component or the attachment with a portion of the attachment disposed between the third sensor and the first and second heat sink region sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment portion, and the component with respect to heat conduction, which includes identifying the interposed heat sink portion as failing in response to a divergence between temperature inputs from the first and second heat sink region sensors. Rate-of-rise temperature readings may also be observed and compared, including to historical values.

    摘要翻译： 传感器位于散热器的第一和第二区域上，散热片的一部分置于第一和第二区域传感器之间。 散热器通过附件将部件连接到部件上，所述附件将热量从部件传导到散热器，并且第三传感器位于部件或附件上，附件的一部分设置在第三传感器与第一和第二传感器之间 散热片区域传感器。 将来自传感器的温度读数进行比较，以识别相对于热传导的散热器，附接部分和部件中的故障之一，其包括将插入的散热器部分识别为响应于来自 第一和第二散热片区域传感器。 还可以观察和比较升温速率读数，包括历史值。

    Sandwiched organic LGA structure
    16.
    发明授权
    Sandwiched organic LGA structure 失效
    三明治有机LGA结构

    公开(公告)号：US07795724B2

    公开(公告)日：2010-09-14

    申请号：US11847606

    申请日：2007-08-30

    申请人： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  David L. Questad ,  Robin A. Susko

    发明人： William L. Brodsky ,  James A. Busby ,  Bruce J. Chamberlin ,  Mitchell G. Ferrill ,  David L. Questad ,  Robin A. Susko

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3121 ,  H01L23/4006 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2023/4081 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/05599

    摘要： An LGA structure is provided having at least one semiconductor device over a substrate and a mechanical load apparatus over the semiconductor device. The structure includes a load-distributing material between the mechanical load apparatus and the substrate. Specifically, the load-distributing material is proximate a first side of the semiconductor device and a second side of the semiconductor device opposite the first side of the semiconductor device. Furthermore, the load-distributing material completely surrounds the semiconductor device and contacts the mechanical load apparatus, the substrate, and the semiconductor device. The load-distributing material can be thermally conductive and comprises an elastomer and/or a liquid. The load-distributing material comprises a LGA interposer adapted to connect the substrate to a PCB below the substrate and/or a second substrate. Moreover, the load-distributing material comprises compressible material layers and rigid material layers. The load-distributing material comprises a rigid material incased in a compressible material.

    摘要翻译： 提供LGA结构，其具有在衬底上的至少一个半导体器件和半导体器件上的机械负载设备。 该结构包括在机械负载装置和基板之间的负载分配材料。 具体地，负载分布材料靠近半导体器件的第一侧，并且半导体器件的与半导体器件的第一侧相对的第二侧。 此外，负载分布材料完全围绕半导体器件并接触机械负载装置，衬底和半导体器件。 载荷分布材料可以是导热的并且包括弹性体和/或液体。 负载分配材料包括适于将衬底连接到衬底下面的PCB和/或第二衬底的LGA插入器。 此外，载荷分布材料包括可压缩材料层和刚性材料层。 载荷分配材料包括浸在可压缩材料中的刚性材料。

    HEAT SINK METHOD, SYSTEM, AND PROGRAM PRODUCT
    18.
    发明申请
    HEAT SINK METHOD, SYSTEM, AND PROGRAM PRODUCT 有权
    散热方法，系统和程序产品

    公开(公告)号：US20090210190A1

    公开(公告)日：2009-08-20

    申请号：US12033200

    申请日：2008-02-19

    申请人： Brian L. Carlson ,  Bruce J. Chamberlin ,  Mark K. Hoffmeyer ,  Ahmad D. Katnani ,  Matthew S. Kelly ,  Gregory S. Killinger ,  Eric V. Kline ,  Wayne J. Rothschild ,  Jeffrey A. Taylor

    发明人： Brian L. Carlson ,  Bruce J. Chamberlin ,  Mark K. Hoffmeyer ,  Ahmad D. Katnani ,  Matthew S. Kelly ,  Gregory S. Killinger ,  Eric V. Kline ,  Wayne J. Rothschild ,  Jeffrey A. Taylor

    IPC分类号： G01K1/00

    CPC分类号： G01K1/14 ,  G01K3/005

    摘要： Where an attachment means connects a heat sink to a system component, heat is thereby conducted to the heat sink from the component, a temperature sensor is located on the heat sink and another on the component or the attachment means, a portion of the attachment means is disposed between the sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment means portion, and the component, with respect to heat conduction. Corrective action may be identified, and self-power means may also be provided to supply operative power. A wireless output circuit may be provided. Multiple heat sink sensors may be provided in any element. Rate-of-rise temperature readings may be observed and compared, including to historical values.

    摘要翻译： 在附接装置将散热器连接到系统部件的地方，热量从部件传导到散热器，温度传感器位于散热器上，另一个位于部件或附接装置上，一部分连接装置 设置在传感器之间。 对来自传感器的温度读数进行比较，以识别相对于热传导的散热器，附接装置部分和部件中的故障之一。 可以确定纠正措施，并且也可以提供自动装置来提供操作电力。 可以提供无线输出电路。 可以在任何元件中提供多个散热器传感器。 可以观察和比较升温速率读数，包括历史值。