公开(公告)号：US11774233B2

公开(公告)日：2023-10-03

申请号：US17004092

申请日：2020-08-27

Applicant: CORNING INCORPORATED

Inventor： Uta-Barbara Goers ,  Robert Wendell Sharps

IPC: G01B7/12 ,  G01B11/12 ,  G01B7/13 ,  G01B11/08 ,  B60R1/12

CPC classification number: G01B7/12 ,  G01B7/13 ,  G01B11/12 ,  B60R2001/1253 ,  G01B11/08 ,  G06T2207/10028

Abstract: A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

公开(公告)号：US10794679B2

公开(公告)日：2020-10-06

申请号：US15632919

申请日：2017-06-26

Applicant: CORNING INCORPORATED

Inventor： Uta-Barbara Goers ,  Robert Wendell Sharps

IPC: G01B7/12 ,  G01B11/12 ,  G01B7/13 ,  B60R1/12

Abstract: A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

公开(公告)号：US20180204792A1

公开(公告)日：2018-07-19

申请号：US15921989

申请日：2018-03-15

Applicant: CORNING INCORPORATED

Inventor： Uta-Barbara Goers

IPC: H01L23/498 ,  B23K26/382 ,  B23K26/0622 ,  B23K26/18 ,  H01L21/48 ,  H05K3/00 ,  H05K3/40

CPC classification number: H01L23/49827 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/382 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49894 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/4038 ,  H05K2203/1383

Abstract: Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.

公开(公告)号：US20180003477A1

公开(公告)日：2018-01-04

申请号：US15632919

申请日：2017-06-26

Applicant: CORNING INCORPORATED

Inventor： Uta-Barbara Goers ,  Robert Wendell Sharps

IPC: G01B7/12 ,  G01B7/13 ,  B60R1/12

Abstract: A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

公开(公告)号：US09296646B2

公开(公告)日：2016-03-29

申请号：US14464851

申请日：2014-08-21

Applicant: CORNING INCORPORATED

Inventor： Robert Carl Burket ,  Uta-Barbara Goers ,  Samuel Odei Owusu ,  Tammy Lynn Petriwsky

IPC: C03C15/00 ,  H05K1/03 ,  H05K3/00 ,  B23K26/00 ,  B23K26/36 ,  B23K26/38 ,  C03C23/00

CPC classification number: C03C15/00 ,  B23K26/302 ,  B23K26/362 ,  B23K26/364 ,  B23K26/382 ,  B23K26/384 ,  B23K26/402 ,  B23K26/55 ,  B23K2103/54 ,  C03B33/0222 ,  C03C23/00 ,  C03C23/0025 ,  C03C2218/34 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0029 ,  H05K2203/0285

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。

公开(公告)号：US20150060402A1

公开(公告)日：2015-03-05

申请号：US14464851

申请日：2014-08-21

Applicant: CORNING INCORPORATED

Inventor： Robert Carl Burkett ,  Uta-Barbara Goers ,  Samuel Odei Owusu ,  Tammy Lynn Petriwsky

IPC: H05K3/00 ,  C03C15/00

CPC classification number: C03C15/00 ,  B23K26/302 ,  B23K26/362 ,  B23K26/364 ,  B23K26/382 ,  B23K26/384 ,  B23K26/402 ,  B23K26/55 ,  B23K2103/54 ,  C03B33/0222 ,  C03C23/00 ,  C03C23/0025 ,  C03C2218/34 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0029 ,  H05K2203/0285

Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。