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公开(公告)号：US09745220B2
公开(公告)日：2017-08-29
申请号：US14899602
申请日：2014-06-20
Applicant: Corning Incorporated
CPC classification number: C03C15/00
Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3,and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.
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公开(公告)号：US09296646B2
公开(公告)日：2016-03-29
申请号：US14464851
申请日：2014-08-21
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。
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公开(公告)号：US20150060402A1
公开(公告)日：2015-03-05
申请号：US14464851
申请日：2014-08-21
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burkett , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。
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公开(公告)号：US09982322B2
公开(公告)日：2018-05-29
申请号：US14423870
申请日：2013-08-29
Applicant: CORNING INCORPORATED
Inventor： Benedict Yorke Johnson , Samuel Odei Owusu
CPC classification number: C22B11/02 , B22F1/0018 , B22F9/20 , B82Y30/00 , C22C5/06
Abstract: Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.
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公开(公告)号：US20160207777A1
公开(公告)日：2016-07-21
申请号：US14908680
申请日：2014-07-23
Applicant: CORNING INCORPORATED
Inventor： James Gerard Fagan , Kishor Purushottam Gadkaree , Atul Kumar , Samuel Odei Owusu , Kamjula Pattabhirami Reddy
CPC classification number: H01G11/34 , C01B32/342 , C01B32/348
Abstract: The disclosure relates, in various embodiments, to methods for forming activated carbon comprising (a) providing a feedstock mixture comprising a carbon feedstock, at least one activating agent chosen from alkali metal hydroxides, and at least one additive chosen from fats, oils, fatty acids, fatty acid esters, and polyhydroxylated compounds to form a feedstock mixture; (b) optionally heating the feedstock mixture to a first temperature, and when a step of heating the feedstock mixture to a first temperature is performed, optionally holding the feedstock mixture at the first temperature for a time sufficient to react the at least one activating agent with the at least one additive; (c) optionally milling and/or grinding the feedstock mixture; (d) heating the feedstock mixture to an activation temperature; and (e) holding the feedstock mixture at the activation temperature for a time sufficient to form activated carbon.
Abstract translation: 在各种实施方案中，本公开涉及形成活性炭的方法，其包括（a）提供包含碳原料的原料混合物，至少一种选自碱金属氢氧化物的活化剂和至少一种选自脂肪，油，脂肪的添加剂 酸，脂肪酸酯和多羟基化合物以形成原料混合物; （b）任选地将原料混合物加热至第一温度，并且当进行将原料混合物加热至第一温度的步骤时，任选地将原料混合物在第一温度下保持足以使至少一种活化剂 与至少一种添加剂; （c）任选研磨和/或研磨原料混合物; （d）将原料混合物加热至活化温度; 和（e）将原料混合物在活化温度下保持足以形成活性炭的时间。
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Patent Agency Ranking
6.发明申请CHITOSAN-FUNCTIONALIZED CORDIERITE MONOLITHS AS HEAVY METAL SORBENTS 审中-公开作为重金属分子的CHITOSAN官能化的CORDIERITE单体公开(公告)号：US20150306567A1
公开(公告)日：2015-10-29
申请号：US14647840
申请日：2013-11-26
Applicant: Benedict Yorke JOHNSON , Li LIU , Samuel Odei OWUSU , CORNING INCORPORATED
Inventor： Benedict Yorke Johnson , Li Liu , Samuel Odei Owusu
CPC classification number: B01J20/24 , B01J20/103 , B01J20/28042 , B01J20/28045 , B01J20/3204 , B01J20/3234 , B01J20/3236 , B01J20/3274 , B01J20/3289 , C02F1/281 , C02F1/286 , C02F1/288 , C02F2101/20 , C02F2101/206 , C02F2101/22
Abstract: Embodiments of a method of making a sorbent comprise providing a monolith having a plurality of internal channels, providing at least one silica coating onto walls of the plurality of internal channels by applying a silica coating solution, and providing at least one chitosan coating on the silica coating by applying a chitosan coating solution.
Abstract translation: 制备吸附剂的方法的实施方案包括提供具有多个内部通道的整料，通过施加二氧化硅涂覆溶液在多个内部通道的壁上提供至少一种二氧化硅涂层，并在二氧化硅上提供至少一种壳聚糖涂层 通过涂覆壳聚糖涂层溶液进行涂布。
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公开(公告)号：US09656909B2
公开(公告)日：2017-05-23
申请号：US14972284
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
IPC: C03C15/00 , H05K1/03 , H05K3/00 , B23K26/00 , C03C23/00 , B23K26/384 , B23K26/362 , B23K26/302 , B23K26/364 , C03B33/02
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
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公开(公告)号：US20150307961A1
公开(公告)日：2015-10-29
申请号：US14423870
申请日：2013-08-29
Applicant: CORNING INCORPORATED
Inventor： Benedict Yorke Johnson , Samuel Odei Owusu
CPC classification number: C22B11/02 , B22F1/0018 , B22F9/20 , B82Y30/00 , C22C5/06
Abstract: Described herein are methods of making metallic or elemental silver in the solid state. These methods generally include a step of forming an at least substantially solvent-free solid state reaction mixture that includes a silver-containing compound and an organic acid, followed by heating the reaction mixture at a temperature and for a time effective to form metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.
Abstract translation: 这里描述的是制备固态金属或元素银的方法。 这些方法通常包括形成至少基本上无溶剂的固态反应混合物的步骤，该固体反应混合物包括含银化合物和有机酸，然后在有效形成金属银的温度和时间的温度下加热反应混合物， 含银化合物的阳离子银种类。 本文还描述了通过这些方法生产的金属或元素银。
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9.发明申请公开(公告)号：US20150211090A1
公开(公告)日：2015-07-30
申请号：US14424241
申请日：2013-08-29
Applicant: CORNING INCORPORATED
Inventor： Benedict Yorke Johnson , Samuel Odei Owusu
Abstract: Described herein are methods of making metallic or elemental silver. These methods generally include a step of forming a reaction dispersion that includes a silver-containing compound, an organic acid, and a solvent that includes an alcohol, followed by mixing the reaction dispersion for a time and at a temperature effective to form a reaction product that includes metallic silver from a cationic silver species of the silver-containing compound. Also described herein are metallic or elemental silver produced by these methods.
Abstract translation: 这里描述的是制备金属或元素银的方法。 这些方法通常包括形成包含含银化合物，有机酸和包含醇的溶剂的反应分散体的步骤，然后将反应分散体混合一段时间并且在有效形成反应产物的温度下 其包括来自含银化合物的阳离子银种类的金属银。 本文还描述了通过这些方法生产的金属或元素银。
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公开(公告)号：US20240288350A1
公开(公告)日：2024-08-29
申请号：US18586507
申请日：2024-02-25
Applicant: CORNING INCORPORATED
Inventor： Nicholas Robert Bonham , Yu Cheng , Rachid Gafsi , Kurt Edward Gerber , Paul M Giglio , Suresh Thakordas Gulati , Fang-Yu Hsu , Te Heng Hung , Weirong Jiang , Cheng Yu Lai , Peter Joseph Lezzi , Jody Paul Markley, JR. , Arpita Mitra , Douglas Miles Noni , Samuel Odei Owusu , Timothy Paul Smith , Ryan Christopher Sutton , Jamie Todd Westbrook
Abstract: Disclosed herein are testing apparatuses for testing stresses in substrates. The testing apparatus includes a base, a first plate coupled to the base, the first plate being movable relative to the base along a first axis, a second plate coupled to the base, the second plate being movable relative to the base and relative to the first plate along a second axis that is perpendicular to the first axis, a first actuator operable to move the first plate along the first axis towards or away from the second plate, a second actuator operable to move the second plate along the second axis relative to the first plate, and a controller operatively connected to the first actuator and the second actuator operable to control movement of the first plate and the second plate.
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