公开(公告)号：US09865780B2

公开(公告)日：2018-01-09

申请号：US14661874

申请日：2015-03-18

Applicant: CREE, INC.

Inventor： Theodore Lowes ,  Eric Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

IPC: F21V9/16 ,  H01L33/54 ,  H01L33/50 ,  F21V9/00 ,  H01L33/60

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.

公开(公告)号：US09818919B2

公开(公告)日：2017-11-14

申请号：US13649067

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/50 ,  F21V9/00 ,  H01L33/60

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

公开(公告)号：US20140167065A1

公开(公告)日：2014-06-19

申请号：US14185589

申请日：2014-02-20

Applicant: CREE, INC.

Inventor： Michael Bergmann ,  Matthew Donofrio ,  Sten Heikman ,  Kevin S. Schneider ,  Kevin W. Haberern ,  John A. Edmond

IPC: H01L33/60 ,  H01L33/32 ,  H01L33/08

CPC classification number: H01L33/60 ,  H01L33/08 ,  H01L33/32 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2924/00014

Abstract: Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror. The barrier layer is smaller than the mirror, such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact is provided on the active region. In a further embodiment, the barrier layer is smaller than the mirror such that the periphery of the mirror is at least 40% free of the barrier layer, and the second contact is below the first contact and accessible from the bottom of the chip.

Abstract translation: 本发明的实施例通常涉及通过减少与镜接触相邻的阻挡层的光吸收效果来改进总发射的LED芯片。 在一个实施例中，LED芯片包括一个或多个LED，其中每个LED具有有源区，在有源区下方的第一接触具有高反射镜，以及邻近反射镜的阻挡层。 阻挡层比镜子小，使得其不延伸超出反射镜的周边。 在另一个可能的实施例中，进一步提供绝缘体，其中绝缘体邻近阻挡层并且反射镜的相邻部分未被有源区域或阻挡层接触。 在另一个实施例中，在有源区上提供第二接触。 在另一个实施例中，阻挡层小于反射镜，使得反射镜的周边至少不含阻挡层40％，并且第二触点位于第一触点下方并且可从芯片的底部接近。

公开(公告)号：US10439107B2

公开(公告)日：2019-10-08

申请号：US14053404

申请日：2013-10-14

Applicant: CREE, INC.

Inventor： Sten Heikman ,  James Ibbetson ,  Zhimin Jamie Yao ,  Fan Zhang ,  Matthew Donofrio ,  Christopher P. Hussell ,  John A. Edmond

IPC: H01L33/44 ,  H01L33/50 ,  H01L33/00 ,  H01L33/20 ,  H01L33/48

Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

公开(公告)号：US09048396B2

公开(公告)日：2015-06-02

申请号：US13649052

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

IPC: F21V9/16 ,  H01L33/50 ,  H01L33/54 ,  F21V9/00

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

公开(公告)号：US20140217443A1

公开(公告)日：2014-08-07

申请号：US14053404

申请日：2013-10-14

Applicant: CREE, INC.

Inventor： Sten Heikman ,  James Ibbetson ,  Zhimin Jamie Yao ,  Fan Zhang ,  Matthew Donofrio ,  Christopher P. Hussell ,  John A. Edmond

IPC: H01L33/50 ,  H01L33/60

CPC classification number: H01L33/50 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/44 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract translation: 本公开涉及发光器件及其制造方法，包括侧面和/或多面发光器件。 根据本公开的实施例包括使用功能层，其可以包括与发光器的一个或多个部分的间隔距离，以在进一步的器件处理期间提高功能层的稳定性。 功能层可以进一步包括翼状部分，允许光发射器的下侧部分的涂覆进一步与发射的光和功能层上的反射层涂层相互作用，以进一步改善光提取和发光均匀性。 还公开了包括使用虚拟晶片结构的方法的制造方法。