Ink jet printhead having integral filter
    11.
    发明授权
    Ink jet printhead having integral filter 失效
    具有整体式过滤器的喷墨打印头

    公开(公告)号:US5124717A

    公开(公告)日:1992-06-23

    申请号:US624390

    申请日:1990-12-06

    IPC分类号: B41J2/05 B41J2/16

    摘要: An ink jet printhead having an integral membrane filter fabricated over the surface of the printhead containing the ink inlet is disclosed. The individual printheads are obtained by a sectioning operation which cuts aligned and bonded channel and heater wafers. The mated wafers contain a plurality of printheads and must be separated. The integral membrane filter is formed on the channel wafer after it is anisotropically etched incorporating the etch resistant mask layer and prior to mating with the heater wafer. A patternable layer is deposited over the etch resistant masking layer and exposed, patterned and developed to establish the mesh filter. In one embodiment, the side of the channel wafer not patterned and etched is heavily doped to form an etch stop which increases the robustness of the membrane filter by ensuring that the masking layer remains intact during subsequent fabricating steps. This doped region beneath the patternable layer is then etched using the membrane filter as a mask to open the filter pores through the doped layer of the channel wafer, thereby increasing the filter thickness and its overall strength.

    摘要翻译: 公开了一种在包含墨水入口的打印头的表面上制造的具有整体膜过滤器的喷墨打印头。 单个打印头通过切割对准和粘合的通道和加热器晶片的切片操作获得。 配对的晶片包含多个打印头,必须分开。 整体膜过滤器在其各向异性蚀刻之后形成在通道晶片上,其包含耐蚀刻掩模层并且在与加热器晶片配合之前。 将可图案层沉积在抗蚀刻掩模层上,并进行曝光,图案化和显影以建立网状过滤器。 在一个实施例中,未图案化和蚀刻的沟道晶片的侧面被重掺杂以形成蚀刻停止件,其通过确保掩模层在随后的制造步骤期间保持完整而增加了膜过滤器的鲁棒性。 然后使用膜过滤器作为掩模蚀刻可图案层下面的该掺杂区域,以通过通道晶片的掺杂层打开过滤器孔,从而增加过滤器厚度及其整体强度。

    Thermal ink jet printhead with increased drop generation rate
    12.
    发明授权
    Thermal ink jet printhead with increased drop generation rate 失效
    热喷墨打印头具有增加的液滴产生率

    公开(公告)号:US4835553A

    公开(公告)日:1989-05-30

    申请号:US236430

    申请日:1988-08-25

    IPC分类号: B41J2/05 B41J2/14

    CPC分类号: B41J2/1404 B41J2002/14379

    摘要: An improved ink jet printhead comprising upper and lower substrates that are mated and bonded together with a thick film insulative layer sandwiched therebetween. One surface of the upper substrate has etched therein one or more grooves and a recess which when mated with the lower substrate will serve as capillary filled ink channels and ink supply manifold, respectively. The grooves are open at one end and closed at the other. The open ends serve as nozzles. The manifold recess is adjacent the grooved closed ends. Each channel has a heating element located upstream of the nozzle. The heating elements are selectively addressable by input signals representing digitized data signals to produce ink vapor bubbles. The growth and collapse of the bubbles expel ink droplets from the nozzles and propel them to a recording medium. A recess patterned in the thick layer provides a flow path for the ink from the manifold to the channels by enabling the ink to flow around the closed ends of the channels and increase the flow area to the heating elements. Thus, the heating elements lie at the distal end of the recesses so that a vertical wall of elongated recess prevents air ingestion while it increases the ink channel flow area and increases refill time, resulting in an increase in bubble generation rate.

    摘要翻译: 一种改进的喷墨打印头,其包括上下基板,其与夹在其间的厚膜绝缘层配合并结合在一起。 上基板的一个表面在其中蚀刻有一个或多个凹槽和与下基板配合的凹槽,分别用作毛细管填充的墨水通道和墨水供应歧管。 槽在一端敞开,另一端封闭。 开口端作为喷嘴。 歧管凹槽与凹槽的封闭端相邻。 每个通道具有位于喷嘴上游的加热元件。 加热元件可以通过表示数字化数据信号的输入信号来选择寻址,以产生油墨蒸气泡。 气泡的生长和坍塌从喷嘴中排出墨滴并推动它们到记录介质上。 在厚层中图案化的凹槽通过使墨水能够围绕通道的封闭端流动并且增加到加热元件的流动面积而提供用于从歧管到通道的墨水的流动路径。 因此,加热元件位于凹部的远端,使得细长凹槽的垂直壁防止空气摄取,同时增加墨通道流动面积并增加再填充时间,导致气泡产生速率的增加。

    Electric field concentration minimization for MEMS
    13.
    发明授权
    Electric field concentration minimization for MEMS 有权
    MEMS的电场浓度最小化

    公开(公告)号:US07718458B2

    公开(公告)日:2010-05-18

    申请号:US11853469

    申请日:2007-09-11

    IPC分类号: H01L21/00 H01L31/00 H01G5/16

    CPC分类号: B81B3/0086

    摘要: A method and resulting device for reducing an electrical field at an isolation gap in a capacitive actuator includes providing a bottom electrode layer and forming a pattern in the bottom electrode layer having an isolation gap between center and outer electrode components of the patterned electrode. A spacing material is deposited in the isolation gap, the spacing material having a greater height than a remainder of the patterned electrode, and a sacrificial material is deposited conformably on a surface of the patterned electrode and spacing material. The method also includes applying a deformable electrode to a surface of the sacrificial material, whereby removal of the sacrificial and spacing materials results in a greater spacing between the deformable electrode and the electrode layer at a region of the isolation gap than over a remainder of the spacing between the patterned electrode layer and deformable surface.

    摘要翻译: 用于减小电容式致动器中的隔离间隙处的电场的方法和所得装置包括提供底部电极层并在底部电极层中形成图案,该图案在图案化电极的中心和外部电极组件之间具有隔离间隙。 间隔材料沉积在隔离间隙中,间隔材料具有比图案化电极的其余部分更大的高度,并且将牺牲材料顺应地沉积在图案化电极和间隔材料的表面上。 该方法还包括将可变形电极施加到牺牲材料的表面,由此去除牺牲和间隔材料导致在隔离间隙的区域处的可变形电极和电极层之间的间隔比在其余部分 图案化电极层和可变形表面之间的间距。

    Electric Field Concentration Minimization for MEMS
    15.
    发明申请
    Electric Field Concentration Minimization for MEMS 有权
    MEMS的电场浓度最小化

    公开(公告)号:US20090065881A1

    公开(公告)日:2009-03-12

    申请号:US11853469

    申请日:2007-09-11

    IPC分类号: H01L29/82 H01L21/00

    CPC分类号: B81B3/0086

    摘要: A method and resulting device for reducing an electrical field at an isolation gap in a capacitive actuator includes providing a bottom electrode layer and forming a pattern in the bottom electrode layer having an isolation gap between center and outer electrode components of the patterned electrode. A spacing material is deposited in the isolation gap, the spacing material having a greater height than a remainder of the patterned electrode, and a sacrificial material is deposited conformably on a surface of the patterned electrode and spacing material. The method also includes applying a deformable electrode to a surface of the sacrificial material, whereby removal of the sacrificial and spacing materials results in a greater spacing between the deformable electrode and the electrode layer at a region of the isolation gap than over a remainder of the spacing between the patterned electrode layer and deformable surface.

    摘要翻译: 用于减小电容式致动器中的隔离间隙处的电场的方法和所得装置包括提供底部电极层并在底部电极层中形成图案,该图案在图案化电极的中心和外部电极组件之间具有隔离间隙。 间隔材料沉积在隔离间隙中,间隔材料具有比图案化电极的其余部分更大的高度,并且将牺牲材料顺应地沉积在图案化电极和间隔材料的表面上。 该方法还包括将可变形电极施加到牺牲材料的表面,由此去除牺牲和间隔材料导致在隔离间隙的区域处的可变形电极和电极层之间的间隔比在其余部分 图案化电极层和可变形表面之间的间距。

    Printhead element butting
    16.
    发明授权
    Printhead element butting 失效
    打印头元件对接

    公开(公告)号:US5755024A

    公开(公告)日:1998-05-26

    申请号:US573733

    申请日:1995-12-18

    IPC分类号: B41J2/05 B41J2/16 H05B3/00

    摘要: A large array or pagewidth printhead fabricated from printhead elements or subunits. The printhead subunits are butted together at either adjacent channel elements or adjacent heater elements to form a pagewidth printhead. The butting element, either heater or channel element, is slightly wider than the non-butting element thereby providing gaps between the non-butting elements of a printhead element array. Where channel elements are used as the butting element, gaps between the heater elements provide for reduction or elimination of potentially damaging thermal compressive forces between adjacent heater elements. Where heater elements are used as the butting element, structural strength is increased since the heater wafer is stronger than the channel wafer. In addition, the width of the polyimide wall at the edges of the heater wafer is increased providing greater protection for thermal transducers located at the edges of individual heater elements.

    摘要翻译: 由打印头元件或子单元制造的大阵列或页宽打印头。 打印头子单元在相邻的通道元件或相邻的加热器元件对接在一起以形成页宽打印头。 对接元件(加热器或通道元件)比非对接元件稍宽,从而在打印头元件阵列的非对接元件之间提供间隙。 在使用通道元件作为对接元件的情况下,加热器元件之间的间隙用于减少或消除相邻加热器元件之间潜在的有害的热压缩力。 当加热器元件用作对接元件时,由于加热器晶片比通道晶片更强,所以结构强度增加。 此外,加热器晶片边缘处的聚酰亚胺壁的宽度增加,为位于各个加热器元件边缘的热传感器提供更大的保护。

    Pagewidth thermal ink jet printhead
    17.
    发明授权
    Pagewidth thermal ink jet printhead 失效
    PAGEWIDTH THERMAL INK JET PRINTHEAD

    公开(公告)号:US5160945A

    公开(公告)日:1992-11-03

    申请号:US698206

    申请日:1991-05-10

    申请人: Donald J. Drake

    发明人: Donald J. Drake

    IPC分类号: B41J2/05 B41J2/155

    CPC分类号: B41J2/155 B41J2202/20

    摘要: A pagewidth thermal ink jet printhead for an ink jet printer is disclosed. The printhead is the type assembled from fully functional roofshooter type printhead subunits fixedly mounted on the surface of one side of a structural bar. A passageway is formed adjacent the bar side surface containing the printhead subunits with openings provided between the passageway and the ink inlets of the printhead subunits, mounted thereon so that ink supplied to the passageway in the bar will maintain the individual subunits full of ink. The size of the printing zone for color printing is minimized because the roofshooter printhead subunits are mounted on one edge of the structural bar and may be stacked one on top of the other without need to provide space for the printhead subunits and/or ink supply lines. In addition, the structural bar thickness enables the bar to be massive enough to prevent warping because of printhead operating temperatures.

    Method of fabricating precision pagewidth assemblies of ink jet subunits
    18.
    发明授权
    Method of fabricating precision pagewidth assemblies of ink jet subunits 失效
    制造喷墨亚单位精密页面宽度装配的方法

    公开(公告)号:US5098503A

    公开(公告)日:1992-03-24

    申请号:US517178

    申请日:1990-05-01

    申请人: Donald J. Drake

    发明人: Donald J. Drake

    IPC分类号: B41J2/05 B41J2/16

    摘要: A method of fabricating extended arrays of image reading or writing subunits and in particular a pagewidth thermal ink jet printhead from a plurality of discrete thermal ink jet printhead subunits is disclosed. Each thermal ink jet printhead subunit includes a heater plate subunit having a plurality of resistive elements on an upper surface thereof and a channel plate subunit having a plurality of channels corresponding in number and position to the resistive elements on a base surface thereof, the upper surface of the heater plate subunit being attached to the base surface of the channel plate subunit to define a thermal ink jet printhead subunit having a plurality of channels forming nozzles with a resistive element in communication with each channel. The method includes the steps of forming a precision alignment structure such as a notch with, for example, a precision dicing saw, on an upper surface of each channel plate subunit, placing the upper surface of each discrete thermal ink jet printhead subunit on an elongated alignment substrate having a plurality of corresponding alignment structures, and engaging the upper surface of each discrete thermal ink jet printhead subunit with one of the corresponding alignment structures on the alignment substrate. These steps are repeated with subsequent thermal ink jet printhead subunits until an extended array having the length of, for example, a pagewidth is formed. The array of thermal ink jet printhead subunits are then bonded to, for example, a base substrate to form an integral pagewidth printhead.

    摘要翻译: 公开了一种制造图像读取或写入子单元的扩展阵列的方法,特别是从多个分立的热喷墨打印头子单元的页宽热喷墨打印头。 每个热喷墨打印头子单元包括在其上表面上具有多个电阻元件的加热板子单元和通道板子单元,该多个通道的数量和位置与其基面上的电阻元件相对应,上表面 所述加热器板子单元附接到所述通道板子单元的基底表面以限定具有多个通道的热喷墨打印头子单元,所述多个通道形成具有与每个通道连通的电阻元件的喷嘴。 该方法包括以下步骤:在每个通道板子单元的上表面上形成诸如具有例如精密切割锯的切口的精密对准结构,将每个离散热喷墨打印头单元的上表面放置在细长的 对准基板具有多个对应的对准结构,并且使每个分立的热喷墨打印头子单元的上表面与对准基板上的对应对准结构之一接合。 随后的热喷墨打印头子单元重复这些步骤,直到形成具有例如页面宽度的长度的扩展阵列。 然后将热喷墨打印头子单元阵列结合到例如基底基板上以形成整体的页宽打印头。

    Method of making RIS or ROS array bars using replaceable subunits
    19.
    发明授权
    Method of making RIS or ROS array bars using replaceable subunits 失效
    使用可替换子单元制作RIS或ROS阵列条的方法

    公开(公告)号:US5079189A

    公开(公告)日:1992-01-07

    申请号:US539340

    申请日:1990-06-18

    摘要: Overlapping chip replaceable subunits for RIS or ROS array bars are disclosed. The subunits include a planar semiconductive substrate having at least one component and supporting circuitry on a surface thereof. The semiconductive substrate has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The planar semiconductive substrate is mounted on a planar support which can be, for example, a daughterboard/heat sink assembly having at least one electrode having a terminal at one end thereof. The planar support also has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The width of the support is less than the width of the semiconductive substrate so that the first and second side edges of the planar semiconductive substrate extend outwardly beyond the first and second side edges, respectively, of the support. The structure of the present invention enables extended arrays of subunits to be accurately placed on one surface of a substrate, while permitting individual subunits to be removed from the substrate easily and without damaging adjacent subunits or their electrical connections to the host machine.

    摘要翻译: 公开了用于RIS或ROS阵列的重叠芯片可替换子单元。 该子单元包括在其表面上具有至少一个部件和支撑电路的平面半导体基板。 半导体衬底具有第一和第二侧边缘,前边缘和宽度等于第一和第二侧边缘之间的距离。 平面半导体基板安装在平面支撑件上,该平面支撑件可以是例如具有在其一端具有端子的至少一个电极的子板/散热器组件。 平面支撑件还具有第一和第二侧边缘,前边缘和宽度等于第一和第二侧边缘之间的距离。 支撑件的宽度小于半导体基板的宽度,使得平面半导体基板的第一和第二侧边缘分别向外延伸超过支撑件的第一和第二侧边缘。 本发明的结构使得能够将扩展的亚基阵列精确地放置在基底的一个表面上,同时允许单独的亚单元从基底中轻松地移除而不会损坏相邻的子单元或者它们与主机的电连接。

    Stand-off structure for flipped chip butting
    20.
    发明授权
    Stand-off structure for flipped chip butting 失效
    用于倒装芯片对接的支架结构

    公开(公告)号:US5045142A

    公开(公告)日:1991-09-03

    申请号:US440269

    申请日:1989-11-22

    IPC分类号: H01L25/18 B41J2/16 H01L25/04

    摘要: A pagewidth array is fabricated to include a plurality of heating element subunits of the same or differing thicknesses, each subunit having a circuit surface and an opposite base surface. The plurality of subunits is inverted with each of the circuit surfaces facing toward a support surface to expose the base surfaces of each subunit. Each of said subunits is butted against an adjacent subunit to form an end-to-end array of butted subunits, and a conformal adhesive is applied to a bonding substrate which is then applied to the base surfaces of the array of butted substrates to form a coplanar adhesive layer across each of said subunits. The circuit surfaces are protected from damage due to contact with said support surface by applying a stand-off layer of substantially uniform thickness to at least a portion of the circuit surfaces prior to inverting the plurality of subunits. The stand-off layer preferably is polyimide.

    摘要翻译: 制造页宽阵列以包括相同或不同厚度的多个加热元件子单元,每个子单元具有电路表面和相对的基面。 多个子单元被倒置,每个电路表面面向支撑表面以暴露每个子单元的基面。 每个所述子单元对接邻近的子单元以形成对接子单元的端对端阵列,并且将共形粘合剂施加到键合衬底,然后将其施加到对接衬底阵列的基底表面以形成 跨越每个所述亚单位的共面粘合剂层。 在反转多个子单元之前,通过在至少一部分电路表面上施加基本上均匀的厚度的支撑层,保护电路表面免受与所述支撑表面的接触的损害。 间隔层优选为聚酰亚胺。