中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

21 records (took 0.019 seconds)

    Electronic Devices Comprising Two Encapsulant Films
    13.
    发明申请
    Electronic Devices Comprising Two Encapsulant Films 审中-公开
    包含两个密封膜的电子设备

    公开(公告)号：US20160276512A1

    公开(公告)日：2016-09-22

    申请号：US14777693

    申请日：2014-04-16

    Applicant: DOW GLOBAL TECHNOLOGIES LLC

    Inventor： Kumar Nanjundiah ,  John A. Naumovitz ,  Michael D. White

    IPC: H01L31/048 ,  H01L31/18 ,  H01L31/049

    CPC classification number: H01L31/0488 ,  H01L31/0481 ,  H01L31/049 ,  H01L31/18 ,  Y02E10/50

    Abstract: An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film.

    Abstract translation: 一种电子器件包括与光接收和透射膜直接接触的第一封装膜和与底片直接接触的第二封装膜。 第一包封膜的零剪切粘度大于第二包封膜的零剪切粘度。 电子设备的背板比具有零剪切粘度小于或等于第二封装膜的第一封装膜的类似电子设备的背板具有更少的凸起。

    Multilayer Down-Converting Encapsulant Films and Electronic Devices Including the Same
    14.
    发明申请
    Multilayer Down-Converting Encapsulant Films and Electronic Devices Including the Same 有权
    多层下转换封装薄膜和包括其的电子设备

    公开(公告)号：US20160260857A1

    公开(公告)日：2016-09-08

    申请号：US15032168

    申请日：2013-11-04

    Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  ROHM AND HAAS COMPANY

    Inventor： John A. Naumovitz ,  Hongyu Chen ,  Yan Huang ,  Ada Yu Zhang ,  Zhi Xu

    IPC: H01L31/055 ,  B32B27/20 ,  H01L31/0296 ,  B32B27/30 ,  H01L31/048 ,  H01L31/032 ,  B32B27/08 ,  B32B27/32

    Abstract: A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

    Abstract translation: 具有至少两层的多层包封膜包括包含密封剂树脂的第一层和包含密封剂树脂和至少一种下转换器如稀土有机金属络合物的第二层。 下转换器可以以基于密封剂膜的总重量的至少0.0001重量％的量存在。 多层密封剂膜的其它层可以包括或可以不包括下变频器。 优选地，多层密封剂膜包含至少一个具有至少一个下变换器的层和至少一个没有下变频器的层。 这种多层下转换膜可以用于诸如PV模块的电子设备中。

    Electronic device module comprising polyolefin copolymer
    15.
    发明授权
    Electronic device module comprising polyolefin copolymer 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号：US08592679B2

    公开(公告)日：2013-11-26

    申请号：US13667744

    申请日：2012-11-02

    Applicant: Dow Global Technologies LLC

    Inventor： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John A. Naumovitz

    IPC: H01L31/042 ,  H02N6/00 ,  H01L31/00

    CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

    Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    Abstract translation: 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点小于约95℃，（d）基于聚合物的重量，至少约15至小于约50重量％的烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

Patent Agency Ranking