公开(公告)号：US20210081013A1

公开(公告)日：2021-03-18

申请号：US17105180

申请日：2020-11-25

Applicant: Delta Electronics, Inc.

Inventor： Tao Wang ,  Min Zhou ,  Yuliang Zhang ,  Jianhong Zeng

IPC: G06F1/26 ,  G06F1/20

Abstract: Disclosed herein is a power supply apparatus that includes a bearing plate, insulation material and a plurality of pins. The insulation material is formed on two opposite surfaces of the bearing plate. The plurality of pins are electrically connected to the bearing plate and allocated along lateral sides of the insulation material.

公开(公告)号：US20220261054A1

公开(公告)日：2022-08-18

申请号：US17733364

申请日：2022-04-29

Applicant: Delta Electronics, Inc.

Inventor： Tao Wang ,  Min Zhou ,  Yuliang Zhang ,  Jianhong Zeng

IPC: G06F1/26 ,  G06F1/20

Abstract: Disclosed herein is a power supply apparatus. The power supply apparatus includes at least one power unit and a magnetic unit. The magnetic unit is stacked with and electrically connected to the at least one power unit. The magnetic unit comprises a plurality of pins and a magnetic core. The at least part of the plurality of pins extends out of a projection of the magnetic core in a connection plane of the at least one power unit and the magnetic unit to connect to the at least one power unit.

公开(公告)号：US10886200B2

公开(公告)日：2021-01-05

申请号：US16258747

申请日：2019-01-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu Hong ,  Haibin Xu ,  Wei Cheng ,  Tao Wang ,  Zhenqing Zhao

IPC: H01L23/48 ,  H01L23/495 ,  H01L21/48 ,  H01L25/07 ,  H01L25/00 ,  H01L25/18

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

公开(公告)号：US10136545B2

公开(公告)日：2018-11-20

申请号：US15486591

申请日：2017-04-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

IPC: H05K7/14 ,  H05K1/18 ,  H05K5/03 ,  H01L23/04 ,  H01L25/07

Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.

公开(公告)号：US09698701B2

公开(公告)日：2017-07-04

申请号：US15168235

申请日：2016-05-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Zeng Li ,  Jun-Cheng Lu ,  Tao Wang ,  Zheng-Fen Wan ,  Zhen-Qing Zhao

IPC: H01L23/495 ,  H01L21/50 ,  H02M7/00 ,  H01L23/498 ,  H01L25/18 ,  H01L25/07 ,  H01L21/48 ,  H01L23/00

CPC classification number: H02M7/003 ,  H01L21/4846 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/2743 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.