公开(公告)号：US12253893B2

公开(公告)日：2025-03-18

申请号：US17733364

申请日：2022-04-29

Applicant: Delta Electronics, Inc.

Inventor： Tao Wang ,  Min Zhou ,  Yuliang Zhang ,  Jianhong Zeng

IPC: G06F1/26 ,  G06F1/20

Abstract: Disclosed herein is a power supply apparatus. The power supply apparatus includes at least one power unit and a magnetic unit. The magnetic unit is stacked with and electrically connected to the at least one power unit. The magnetic unit comprises a plurality of pins and a magnetic core. The at least part of the plurality of pins extends out of a projection of the magnetic core in a connection plane of the at least one power unit and the magnetic unit to connect to the at least one power unit.

公开(公告)号：US11183323B2

公开(公告)日：2021-11-23

申请号：US16104961

申请日：2018-08-20

Applicant: Delta Electronics,Inc.

Inventor： Haibin Xu ,  Tao Wang ,  Shouyu Hong ,  Zhenqing Zhao ,  Yicong Xie ,  Zengsheng Wang

IPC: H01F3/14 ,  H01F3/10 ,  H01F3/12 ,  H01F27/28

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

公开(公告)号：US20180122562A1

公开(公告)日：2018-05-03

申请号：US15784864

申请日：2017-10-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Jinping Zhou ,  Shouyu Hong ,  Tao Wang ,  Jianhong Zeng ,  Zhangnan Xin

IPC: H01F27/29 ,  H05K1/18 ,  H01F27/24 ,  H05K1/11

CPC classification number: H01F27/29 ,  H01F27/24 ,  H01F27/2847 ,  H01F27/306 ,  H01L27/02 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1003

Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.

公开(公告)号：US09892998B2

公开(公告)日：2018-02-13

申请号：US14918837

申请日：2015-10-21

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Tao Wang ,  Le Liang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

公开(公告)号：US09748205B2

公开(公告)日：2017-08-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai Lu ,  Zhenqing Zhao ,  Tao Wang ,  Le Liang

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/31 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

公开(公告)号：US10276522B2

公开(公告)日：2019-04-30

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Zhen-Qing Zhao ,  Kai Lu ,  Zheng-Fen Wan ,  Hai-Bin Xu

IPC: H05K3/34 ,  H01L23/00

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

公开(公告)号：US10104813B2

公开(公告)日：2018-10-16

申请号：US15165273

申请日：2016-05-26

Applicant: DELTA ELECTRONICS, INC.

Inventor： Wei Cheng ,  Shouyu Hong ,  Zhenqing Zhao ,  Tao Wang

IPC: H05K7/20 ,  H01L23/373 ,  H01L23/40 ,  H01L23/498 ,  H05K1/02 ,  H01L23/053 ,  H01L23/473 ,  H01L23/24

Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.

公开(公告)号：US20170339798A1

公开(公告)日：2017-11-23

申请号：US15486591

申请日：2017-04-13

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Wei Cheng

IPC: H05K7/14 ,  H05K5/03 ,  H05K1/18

CPC classification number: H05K7/1432 ,  H01L23/04 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/181 ,  H05K5/03 ,  H05K7/1401 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.

公开(公告)号：US10062499B2

公开(公告)日：2018-08-28

申请号：US15784864

申请日：2017-10-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Jinping Zhou ,  Shouyu Hong ,  Tao Wang ,  Jianhong Zeng ,  Zhangnan Xin

IPC: H01F27/29 ,  H05K1/18 ,  H05K1/11 ,  H01F27/24 ,  H01L27/02

CPC classification number: H01F27/29 ,  H01F27/24 ,  H01F27/2847 ,  H01F27/306 ,  H01L27/02 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1003

Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.

公开(公告)号：US09887183B2

公开(公告)日：2018-02-06

申请号：US15151730

申请日：2016-05-11

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao Wang ,  Zhenqing Zhao ,  Zeng Li ,  Kai Lu

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07 ,  H01L23/24

CPC classification number: H01L25/162 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/12035 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13023 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.