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11.发明申请公开(公告)号：US20050221637A1
公开(公告)日：2005-10-06
申请号：US11066079
申请日：2005-02-25
Applicant: Donald Ice , Darin Douma
Inventor： Donald Ice , Darin Douma
CPC classification number: H05K3/3405 , G02B6/4292 , H05K1/141 , H05K3/202 , H05K3/3447 , H05K2201/09118 , H05K2201/10121 , H05K2201/10446 , H05K2201/10924
Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in a plurality of insert injection molded plastic casings. The plastic casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.
Abstract translation: 本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在多个插入注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。
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公开(公告)号：US20050185963A1
公开(公告)日：2005-08-25
申请号：US11026439
申请日：2004-12-30
Applicant: Donald Ice
Inventor： Donald Ice
CPC classification number: G02B6/4292 , G02B6/4246
Abstract: An optical transceiver includes a transceiver housing configured to receive an optical sub-assembly insert. The optical sub-assembly insert includes duplex cavities configured to hold a transmit optical sub-assembly front end and a receive optical sub-assembly front end in a fixed spatial orientation for a given optical connector interface. The optical sub-assembly insert is configurable to fit inside a transceiver housing with a relatively wide range of X and Y dimensional tolerance. In one implementation, the X-Y position of the optical sub-assembly insert is dictated by the position of the transmit optical-sub assembly front end after its corresponding back end has been mounted to a heat dissipation element. Any gaps that form between the optical sub-assembly insert and the inside surface of the transceiver housing as a result of the transmit optical sub-assembly position can be accommodated with filler material.
Abstract translation: 光收发器包括被配置为接收光学子组件插入件的收发器壳体。 光学子组件插入件包括被配置为将光学子组件前端和接收光学子组件前端固定在用于给定光学连接器接口的固定空间取向中的双重空腔。 光学子组件插入件可配置为装配在具有相对较宽范围的X和Y尺寸公差的收发器壳体内。 在一个实施方案中，光学子组件插入件的X-Y位置由发射光学组件前端在其对应的后端已经被安装到散热元件之后的位置决定。 作为透射光学子组件位置的结果，在光学子组件插入件和收发器壳体的内表面之间形成的任何间隙可以用填充材料容纳。
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公开(公告)号：US20050135077A1
公开(公告)日：2005-06-23
申请号：US11047158
申请日：2005-01-31
Applicant: Donald Ice
Inventor： Donald Ice
CPC classification number: H05K9/0062 , H05K7/1404 , H05K7/1425
Abstract: This disclosure concerns EMI control in electronics systems. In one example, an electromagnetic radiation containment system is provided for use in connection with functional modules and an associated card cage disposed in the chassis of an electronic equipment enclosure. The electromagnetic radiation containment system includes conductive elements uniformly distributed about the perimeter of a functional module configured to be received within the card cage, and further includes grounding elements in electrical communication with the chassis so that when the functional module is positioned within a slot of the card cage, at least some of the conductive elements are in electrical communication with the grounding elements. Electrical communication between the conductive elements and circuitry of the functional module facilitates EMI control in the electronic equipment enclosure.
Abstract translation: 本公开涉及电子系统中的EMI控制。 在一个示例中，电磁辐射容纳系统被提供用于与功能模块和设置在电子设备外壳的底盘中的相关联的卡笼结合使用。 电磁辐射容纳系统包括均匀分布在功能模块周边的导电元件，该功能模块被配置为容纳在卡笼内，并且还包括与底盘电连通的接地元件，使得当功能模块位于 卡笼，至少一些导电元件与接地元件电连通。 导电元件和功能模块的电路之间的电气通信便于电子设备外壳中的EMI控制。
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公开(公告)号：US20050026469A1
公开(公告)日：2005-02-03
申请号：US10928414
申请日：2004-08-26
Applicant: Donald Ice , Stephen Nelson
Inventor： Donald Ice , Stephen Nelson
CPC classification number: H05K9/0058 , G02B6/4277 , H01R13/6595
Abstract: Presented is a detachable module connector comprising a main body with a first section, a second section, and a first opening extending through the first section and the second section, wherein the inner dimensions of the opening in the first section are different from the inner dimensions of the opening in the second section and the opening in the first section is sized to fit around a printed circuit board. The detachable connector is used to couple an electronic module that includes a printed circuit board to a host device. Also presented is a method of building a module using this detachable connector. The detachable connector simplifies the module manufacturing process because the module does not involve the costly hand-soldering and pcb-turning steps of the conventional methods.
Abstract translation: 提出了一种可拆卸模块连接器，包括具有第一部分的主体，第二部分和延伸穿过第一部分和第二部分的第一开口，其中第一部分中的开口的内部尺寸不同于内部尺寸 并且第一部分中的开口的尺寸适于围绕印刷电路板。 可拆卸连接器用于将包括印刷电路板的电子模块耦合到主机设备。 还介绍了使用该可拆卸连接器构建模块的方法。 可拆卸连接器简化了模块制造过程，因为该模块不涉及常规方法的昂贵的手工焊接和PCB转动步骤。
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公开(公告)号：US20050018177A1
公开(公告)日：2005-01-27
申请号：US10924135
申请日：2004-08-23
Applicant: Paul Rosenberg , Gary Sasser , Chris Togami , Donald Ice
Inventor： Paul Rosenberg , Gary Sasser , Chris Togami , Donald Ice
CPC classification number: G02B6/4292 , G02B6/42 , G02B6/4246
Abstract: Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.
Abstract translation: 装配光收发器的方法。 在一个示例中，该方法与包括发射机光学子组件和接收机光学子组件的光收发器相关联地执行，以及限定一对端口的结构，发射器光学子组件和接收器光学子组件分别与哪个端口 要对齐 该方法的该示例涉及将发射器光学子组件和接收器光学子组件相对于彼此定位在期望位置。 然后将发射机光学子组件和接收器光学子组件固定在期望的位置。 接下来，发射机光学子组件与其中一个端口对准，并且接收机光学子组件与另一个端口对准。 发射机光学子组件和接收器光学子组件与它们各自的端口的对准在一个操作中执行。
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Patent Agency Ranking
公开(公告)号：US20070251087A1
公开(公告)日：2007-11-01
申请号：US11537644
申请日：2006-09-30
Applicant: Donald Ice
Inventor： Donald Ice
CPC classification number: G02B6/4201 , G02B6/4245 , G02B6/4278 , G02B6/428 , H05K1/182 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K2201/10121 , H05K2201/10424 , H05K2201/10446 , H05K2201/10757 , Y10T29/49117 , Y10T29/49131 , Y10T29/49133
Abstract: An optoelectronic package is attached to a printed circuit board, in which optoelectronic package has a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.
Abstract translation: 光电封装连接到印刷电路板，其中光电封装具有成形引线配置。 引线配置使得成形引线能够与限定在印刷电路板中的通孔通孔电连接，同时最小化空间要求并为引线提供应力消除。 在一个实施例中，公开了一种光学子组件，其包括包含光电子部件的头部以及可与光电子部件可操作地连通的多个导电引线。 每个引线包括从集管的表面延伸的直线部分，端部被定向成由印刷电路板中限定的通孔通道接收，以及插入在直线部分和端部之间的成形部分，并且具有 在第一平面中限定的至少一个弯曲。 光学子组件还包括具有多个空腔的夹子组件，每个腔体接收相应的一个引线。
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公开(公告)号：US20070047882A1
公开(公告)日：2007-03-01
申请号：US11537645
申请日：2006-09-30
Applicant: Donald Ice
Inventor： Donald Ice
IPC: G02B6/36
CPC classification number: G02B6/4201 , G02B6/4245 , G02B6/4278 , G02B6/428 , H05K1/182 , H05K3/301 , H05K3/306 , H05K3/3447 , H05K2201/10121 , H05K2201/10424 , H05K2201/10446 , H05K2201/10757 , Y10T29/49117 , Y10T29/49131 , Y10T29/49133
Abstract: An optical subassembly is used in connection with an optoelectronic package with a shaped lead configuration. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.
Abstract translation: 光学子组件与具有成形引线配置的光电封装件结合使用。 引线配置使得成形引线能够与限定在印刷电路板中的通孔通孔电连接，同时最小化空间要求并为引线提供应力消除。 在一个实施例中，公开了一种光学子组件，其包括包含光电子部件的头部以及可与光电子部件可操作地连通的多个导电引线。 每个引线包括从集管的表面延伸的直线部分，端部被定向成由印刷电路板中限定的通孔通道接收，以及插入在直线部分和端部之间的成形部分，并且具有 在第一平面中限定的至少一个弯曲。 光学子组件还包括具有多个空腔的夹具组件，每个腔体接收相应的引线之一。
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公开(公告)号：US20070003195A1
公开(公告)日：2007-01-04
申请号：US11468752
申请日：2006-08-30
Applicant: Donald Ice , Stephen Nelson , Darin Douma
Inventor： Donald Ice , Stephen Nelson , Darin Douma
IPC: G02B6/36
CPC classification number: H05K3/3405 , G02B6/4201 , G02B6/4245 , G02B6/4246 , G02B6/4255 , G02B6/4292 , H01R13/6315 , H05K1/0278 , H05K1/141 , H05K3/202 , H05K3/3447 , H05K2201/0394 , H05K2201/049 , H05K2201/09118 , H05K2201/10121 , H05K2201/10446 , H05K2201/10757 , H05K2201/10924 , H05K2203/302
Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.
Abstract translation: 公开了一种具有多个光学子组件和印刷电路板的光收发器模块。 收发器模块包括用于将光学子组件连接到印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在插入式注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以建立光学子组件和印刷电路板之间的连接。 引线框架组件通常比使用柔性印刷电路板结构来建立光学子组件和收发器印刷电路板之间的电连接更可靠和更便宜。
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公开(公告)号：US20060252313A1
公开(公告)日：2006-11-09
申请号：US11381112
申请日：2006-05-01
Applicant: Donald Ice
Inventor： Donald Ice
IPC: H01R13/405
CPC classification number: H05K3/3405 , G02B6/3897 , H01R12/57 , H01R12/725 , H05K1/141 , H05K1/147 , H05K3/202 , H05K3/3421 , H05K2201/09118 , H05K2201/10121 , H05K2201/10446
Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include one or more stamped and bent conductors that are encased in a plurality of casings. The casings provide electrical insulation for the conductors in the lead frame connector as well as mechanical support for the finished component. The casing is also configured to extend between a top portion and a base portion of the transceiver module to direct forces applied to the transceiver module away from the optical sub-assembly and the printed circuit board.
Abstract translation: 本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装在多个壳体中的一个或多个冲压和弯曲的导体。 壳体为引线框架连接器中的导体提供电绝缘以及用于成品部件的机械支撑。 壳体还被配置为在收发器模块的顶部和基部之间延伸以将施加到收发器模块的力引导离开光学子组件和印刷电路板。
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公开(公告)号：US20050247759A1
公开(公告)日：2005-11-10
申请号：US11066056
申请日：2005-02-25
Applicant: Donald Ice , Darin Douma
Inventor： Donald Ice , Darin Douma
CPC classification number: G02B6/4246 , H05K1/0393 , H05K1/141 , H05K3/202 , H05K3/3405 , H05K3/3447 , H05K2201/0394 , H05K2201/09118 , H05K2201/10121 , H05K2201/10446 , H05K2201/10924 , H05K2203/302
Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.
Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。
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