公开(公告)号：US20060251361A1

公开(公告)日：2006-11-09

申请号：US11381115

申请日：2006-05-01

Applicant: Donald Ice

Inventor： Donald Ice

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/4256 ,  G02B6/4271 ,  G02B6/428 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: Discloses is a transceiver module having a box optical subassembly, a printed circuit board, and a connector extending from the box optical subassembly to the printed circuit board. The box optical subassembly includes a laser diode, a laser driver, and at least one pin receiving a driver signal for said laser driver. Optionally, the box optical subassembly includes a thermal electric cooler to cool one or more components within the box optical subassembly. The connector mounts to the at least one pin and is receivable by a pin header mounted to the printed circuit board to accommodate for variations in the orientation of the optical subassembly relative to the printed circuit board during optical alignment of the optical subassembly.

Abstract translation: 公开了一种收发器模块，其具有盒子光学子组件，印刷电路板和从盒子光学子组件延伸到印刷电路板的连接器。 盒式光学子组件包括激光二极管，激光驱动器和至少一个接收用于所述激光驱动器的驱动器信号的引脚。 可选地，盒式光学子组件包括用于冷却盒子光学子组件内的一个或多个部件的热电冷却器。 连接器安装到至少一个引脚，并且可以通过安装到印刷电路板的引脚插座来接收，以适应在光学子组件的光学对准期间光学子组件相对于印刷电路板的取向的变化。

公开(公告)号：US20070036490A1

公开(公告)日：2007-02-15

申请号：US11426298

申请日：2006-06-23

Applicant: Donald Ice ,  Darin Douma

Inventor： Donald Ice ,  Darin Douma

IPC: G02B6/36

CPC classification number: G02B6/4246 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/302

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。

公开(公告)号：US20060249820A1

公开(公告)日：2006-11-09

申请号：US11381108

申请日：2006-05-01

Applicant: Donald Ice ,  Darin Douma ,  Phillip Kiely

Inventor： Donald Ice ,  Darin Douma ,  Phillip Kiely

IPC: H01L23/495

CPC classification number: H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract translation: 本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装在多个聚合物壳体中的导电引线结构。 聚合物壳体为引线框架中的导体提供电绝缘以及用于成品部件的机械支撑。 一个或多个无源部件可以安装到引线框架连接器的导体，以有助于光学子组件，引线框架连接器和印刷电路板之间的阻抗匹配。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。

公开(公告)号：US20060032665A1

公开(公告)日：2006-02-16

申请号：US11179223

申请日：2005-07-11

Applicant: Donald Ice

Inventor： Donald Ice

IPC: H05K1/11

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K3/281 ,  H05K3/3447 ,  H05K2201/10121

Abstract: Novel single-layer flexible circuits are provided including a top flexible substrate, a bottom flexible substrate, and a conductive layer disposed therebetween. Signal traces and ground traces can be located in the conductive layer.

Abstract translation: 提供了新的单层柔性电路，其包括顶部柔性基板，底部柔性基板和设置在其间的导电层。 信号迹线和接地迹线可以位于导电层中。

公开(公告)号：US20060002666A1

公开(公告)日：2006-01-05

申请号：US11173464

申请日：2005-06-30

Applicant: Donald Ice

Inventor： Donald Ice

IPC: G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/4245 ,  G02B6/4278 ,  G02B6/428 ,  H05K1/182 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10757 ,  Y10T29/49117 ,  Y10T29/49131 ,  Y10T29/49133

Abstract: A shaped lead configuration for use with optoelectronic packages, such as optical subassemblies, is disclosed. The lead configuration enables the shaped leads to electrically connect with through-hole vias defined in a printed circuit board while minimizing space requirements and providing stress relief for the leads. In one embodiment, an optical subassembly is disclosed, comprising a header containing optoelectronic components, and a plurality of conductive leads that are in operable communication with the optoelectronic components. Each lead includes a straight portion extending from a surface of the header, an end portion oriented so as to be received by a through-hole via defined in a printed circuit board, and a shaped portion interposed between the straight and end portions and having at least one bend defined in a first plane. The optical subassembly further includes a clip assembly having a plurality of cavities that each receive a corresponding one of the leads.

Abstract translation: 公开了一种用于光电封装（例如光学组件）的成形引线配置。 引线配置使得成形引线能够与限定在印刷电路板中的通孔通孔电连接，同时最小化空间要求并为引线提供应力消除。 在一个实施例中，公开了一种光学子组件，其包括包含光电子部件的头部以及可与光电子部件可操作地连通的多个导电引线。 每个引线包括从集管的表面延伸的直线部分，端部被定向成由印刷电路板中限定的通孔通道接收，以及插入在直线部分和端部之间的成形部分，并且具有 在第一平面中限定的至少一个弯曲。 光学子组件还包括具有多个空腔的夹子组件，每个腔体接收相应的一个引线。

公开(公告)号：US20050188535A1

公开(公告)日：2005-09-01

申请号：US10810041

申请日：2004-03-26

Applicant: Donald Ice

Inventor： Donald Ice

IPC: H01L21/44 ,  H01L21/48 ,  H01R12/16 ,  H04B10/00 ,  H05K1/14 ,  H05K3/20 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H01R12/7076 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  Y10T29/49121 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. The conductors are bent as necessary and passed in a reel-to-reel manner through an insert injection molding process to form an electrically insulating casing about the conductors. After the molding process, the ribbon is singulated to obtain individual lead frame connectors. The individual conductors encased in the casing can be electrically separated by punching out a connecting conductive structure through a hole formed in the casing. The connecting conductive structure mechanically secures the conductors to each other during the molding process and, when punched out, substantially eliminate stubs that could otherwise degrade the RF performance of the lead frame connectors.

Abstract translation: 制造用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器的方法。 引线框架连接器通过在导电带中首先冲压导体的选定配置而形成。 导体根据需要弯曲，并通过插入式注射成型工艺以卷到盘的方式通过，以形成围绕导体的电绝缘壳体。 在模制过程之后，将色带切割成单个引线框架连接器。 封装在壳体中的各个导体可以通过形成在壳体中的孔冲出连接的导电结构而被电隔离。 连接导电结构在成型过程中将导体彼此机械地固定，并且当冲压时，基本上消除了否则会降低引线框架连接器的RF性能的短截线。

公开(公告)号：US20060024005A1

公开(公告)日：2006-02-02

申请号：US11236123

申请日：2005-09-26

Applicant: Donald Ice ,  Stephen Nelson ,  Darin Douma

Inventor： Donald Ice ,  Stephen Nelson ,  Darin Douma

IPC: G02B6/36

CPC classification number: H05K3/3405 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/4292 ,  H01R13/6315 ,  H05K1/0278 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2203/302

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

公开(公告)号：US20050191879A1

公开(公告)日：2005-09-01

申请号：US10809992

申请日：2004-03-26

Applicant: Donald Ice

Inventor： Donald Ice

IPC: G02B6/42 ,  H01R12/00

CPC classification number: G02B6/4201

Abstract: Lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical sub-assemblies and transceiver printed circuit boards.

Abstract translation: 用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装并弯曲的导电引线结构，其被封装在插入式注塑塑料外壳中。 塑料外壳为引线框架中的导体提供电绝缘以及成品部件的机械支撑。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。 引线框架组件通常比使用柔性印刷电路板结构来建立光学子组件和收发器印刷电路板之间的电连接更可靠和更便宜。

公开(公告)号：US20050189400A1

公开(公告)日：2005-09-01

申请号：US10810040

申请日：2004-03-26

Applicant: Donald Ice

Inventor： Donald Ice

IPC: B23K31/00 ,  B23K31/02 ,  H05K1/14 ,  H05K3/20 ,  H05K3/34

CPC classification number: H05K3/3405 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead structure that is encased in an insert injection molded plastic casing. The lead frame connector is aligned with the leads that protrude from the back end of the corresponding optical sub-assembly (OSA). The leads pass through corresponding holes in the lead frame connector and are soldered to the conductors of the lead frame assembly. Once the soldering has been performed, the combined OSA and lead frame connector becomes a surface mount device that can then be mounted to the PCB. Assembling an optical transceiver using the lead frame connectors is generally less expensive and more reliable compared to the use of conventional flexible printed circuit board connectors.

Abstract translation: 使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括被封装在插入式注模塑料外壳中的导电引线结构。 引线框架连接器与从相应的光学子组件（OSA）的后端突出的引线对准。 引线穿过引线框架连接器中的相应的孔，并被焊接到引线框架组件的导体。 一旦执行了焊接，组合的OSA和引线框架连接器就成为一个表面贴装器件，然后可以安装到PCB上。 与使用常规柔性印刷电路板连接器相比，组装使用引线框连接器的光收发器通常更便宜并且更可靠。

公开(公告)号：US20060245698A1

公开(公告)日：2006-11-02

申请号：US11412377

申请日：2006-04-27

Applicant: Donald Ice ,  Ricardo Saad

Inventor： Donald Ice ,  Ricardo Saad

IPC: G02B6/36

CPC classification number: G02B6/4292

Abstract: In one example, an optical transceiver is provided that includes a ROSA and a TOSA received within a block portion of an OSA block. The OSA block also includes two groups of adjustable elements, one group for each of the ROSA and the TOSA. The adjustable elements of the first group engage the block portion so as to contact the ROSA, and the adjustable elements of the second group engage the block portion so as to contact the TOSA. The position of the adjustable elements in each respective group can then be varied as necessary to locate and/or maintain the ROSA and TOSA in desired positions and orientations relative to, for example, respective optical connector ports of the optical transceiver.

Abstract translation: 在一个示例中，提供了一种光收发器，其包括在OSA块的块部分内接收的ROSA和TOSA。 OSA块还包括两组可调节元素，一组用于ROSA和TOSA。 第一组的可调节元件接合块部分以接触ROSA，并且第二组的可调节元件接合块部分以便接触TOSA。 然后可以根据需要改变每个相应组中的可调整元件的位置，以将ROSA和TOSA定位和/或维持在相对于例如光收发器的相应光学连接器端口的期望位置和取向。