公开(公告)号：US20220153900A1

公开(公告)日：2022-05-19

申请号：US17117490

申请日：2020-12-10

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08F283/00 ,  C08F4/80 ,  C08K3/16 ,  C08G61/02

Abstract: A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.

公开(公告)号：US20170342178A1

公开(公告)日：2017-11-30

申请号：US15353154

申请日：2016-11-16

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08F216/16 ,  C08J5/24 ,  C08K3/36 ,  C08L29/10

CPC classification number: C08F216/165 ,  C08J5/24 ,  C08J2329/10 ,  C08K3/36 ,  C08L29/10 ,  H05K1/00

Abstract: Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.

公开(公告)号：US20240294745A1

公开(公告)日：2024-09-05

申请号：US18193854

申请日：2023-03-31

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei YU ,  Ching-Huan LEE ,  Chen-Yu HSIEH

IPC: C08L51/00 ,  C08J5/24

CPC classification number: C08L51/003 ,  C08J5/244 ,  C08J2351/00 ,  C08J2471/12

Abstract: A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

公开(公告)号：US20230062178A1

公开(公告)日：2023-03-02

申请号：US17513979

申请日：2021-10-29

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH ,  Chih-Wei LIN ,  Ching LO

IPC: C08L71/00 ,  C08J5/24 ,  C09J7/30 ,  C09J171/00 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20

Abstract: A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

公开(公告)号：US20220380545A1

公开(公告)日：2022-12-01

申请号：US17354729

申请日：2021-06-22

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH ,  Chien-Hsiang CHEN ,  Yi-Fei YU

IPC: C08G73/12 ,  C08K5/18 ,  C08L79/08 ,  C08K5/00 ,  C08K3/013

Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dissipation factor, X-axis coefficient of thermal expansion, copper foil peeling strength, varnish precipitation property and resin compatibility.

公开(公告)号：US20220243046A1

公开(公告)日：2022-08-04

申请号：US17203318

申请日：2021-03-16

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08L27/18

Abstract: A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

公开(公告)号：US20180362715A1

公开(公告)日：2018-12-20

申请号：US15838506

申请日：2017-12-12

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08G73/12 ,  C08G73/10 ,  C09D179/08 ,  C08K7/18 ,  C08K3/36 ,  C08J5/24 ,  H05K1/03

Abstract: The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

公开(公告)号：US20240199791A1

公开(公告)日：2024-06-20

申请号：US18096169

申请日：2023-01-12

Applicant: Elite Material Co., Ltd.

Inventor： Chun-Hung CHEN ,  Chen-Yu HSIEH

IPC: C08G59/24 ,  C08G59/30 ,  C08G59/42 ,  C08J5/18 ,  C08J5/24 ,  C08K3/28 ,  C08K3/38

CPC classification number: C08G59/245 ,  C08G59/308 ,  C08G59/4223 ,  C08J5/18 ,  C08J5/24 ,  C08K3/28 ,  C08K3/38 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/005

Abstract: A resin composition includes: (A) 100 parts by weight of an epoxy resin; (B) 10 to 30 parts by weight of a phenoxy resin; (C) 30 to 50 parts by weight of hydrogenated trimellitic anhydride; and (D) 250 to 400 parts by weight of a co-sintered body of aluminum nitride and boron nitride. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including visible light reflectivity, routing distance, flame retardancy and copper foil peeling strength.

公开(公告)号：US20230279210A1

公开(公告)日：2023-09-07

申请号：US17724311

申请日：2022-04-19

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08L27/18

CPC classification number: C08L27/18 ,  C08L2205/025 ,  C08L2205/035

Abstract: A resin composition includes 100 parts by weight of a fluorine-containing compound, which includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane polymer or a combination thereof; 2 parts by weight to 6 parts by weight of a butyral copolymer, which includes a unit of Formula (I), a unit of Formula (II) and a unit of Formula (III), wherein 1 is an integer of 40 to 250, m is an integer of 5 to 380, n is an integer of 55 to 2500, and wherein the butyral copolymer has a content of hydroxyl group of 21 mol % to 80 mol %; and 20 parts by weight to 150 parts by weight of an inorganic filler. The resin composition may achieve improvements in at least one of the following properties of the article made therefrom including dielectric constant, dissipation factor, X-axis coefficient of thermal expansion, weight loss percentage, tensile strength and comparative tracking index.

公开(公告)号：US20230101478A1

公开(公告)日：2023-03-30

申请号：US17504970

申请日：2021-10-19

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei YU ,  Ching-Huan LEE ,  Chen-Yu HSIEH

IPC: C08L79/08 ,  C08L71/00 ,  C08J5/24 ,  B32B15/08 ,  B32B15/20 ,  H05K1/03

Abstract: A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.