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    LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD USING THE SAME
    11.
    发明申请
    LITHOGRAPHIC PRINTING PLATE PRECURSOR AND PLATE MAKING METHOD USING THE SAME 审中-公开
    平版印刷机前面板和使用该板的制版方法

    公开(公告)号：US20130216950A1

    公开(公告)日：2013-08-22

    申请号：US13852537

    申请日：2013-03-28

    Applicant: FUJIFILM CORPORATION

    Inventor： Takashi SATO ,  Junya ABE ,  Yu IWAI

    IPC: G03F7/09 ,  G03F7/26

    CPC classification number: G03F7/033 ,  B41C1/1016 ,  B41C2201/02 ,  B41C2201/04 ,  B41C2201/06 ,  B41C2201/10 ,  B41C2201/14 ,  B41C2210/04 ,  B41C2210/08 ,  B41C2210/22 ,  B41C2210/24 ,  G03F7/11 ,  G03F7/3035

    Abstract: A lithographic printing plate precursor includes a support, an undercoat layer and an image-recording layer in this order, in which by exposing imagewise the image-recording layer with laser and then supplying at least any of printing ink and dampening water on a cylinder of a printing machine, an unexposed area of the image-recording layer can be removed, and the image-recording layer contains (A) a polymerization initiator, (B) a polymerizable compound and (C) a binder polymer, and the undercoat layer contains the copolymer (D1) as defined herein and the copolymer (D2) as defined herein and a weight of the copolymer (D1) is from 5 to 95% based on a total weight of the copolymers (D1) and (D2).

    Abstract translation: 平版印刷版原版依次包括支撑体，底涂层和图像记录层，其中通过用激光对图像记录层进行成像曝光，然后将至少任何印刷油墨和润版水供应到 可以除去印刷机，图像记录层的未曝光区域，图像记录层包含（A）聚合引发剂，（B）可聚合化合物和（C）粘合剂聚合物，底涂层含有 本文所定义的共聚物（D1）和本文所定义的共聚物（D2）和共聚物（D1）的重量相对于共聚物（D1）和（D2）的总重量为5至95％。

    KIT AND LAMINATE
    14.
    发明申请
    KIT AND LAMINATE 审中-公开

    公开(公告)号：US20180012751A1

    公开(公告)日：2018-01-11

    申请号：US15712595

    申请日：2017-09-22

    Applicant: FUJIFILM Corporation

    Inventor： Yoshitaka KAMOCHI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

    IPC: H01L21/02 ,  H01L21/304 ,  C09J125/04 ,  C09J5/06 ,  C09J153/00 ,  C09J121/00 ,  C09J201/00

    CPC classification number: H01L21/022 ,  C09J5/06 ,  C09J121/00 ,  C09J125/04 ,  C09J153/00 ,  C09J201/00 ,  H01L21/02057 ,  H01L21/02304 ,  H01L21/304 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

    Abstract: Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

    TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
    15.
    发明申请
    TEMPORARY BONDING LAMINATES FOR USED IN MANUFACTURE OF SEMICONDUCTOR DEVICES AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES 有权
    用于制造半导体器件的临时粘结层压板及制造半导体器件的方法

    公开(公告)号：US20160013088A1

    公开(公告)日：2016-01-14

    申请号：US14865755

    申请日：2015-09-25

    Applicant: FUJIFILM Corporation

    Inventor： Ichiro KOYAMA ,  Yu IWAI ,  Kazuhiro FUJIMAKI

    IPC: H01L21/683 ,  C09J123/16 ,  H01L21/324 ,  C09J125/14

    CPC classification number: H01L21/6835 ,  C09J4/00 ,  C09J123/16 ,  C09J125/14 ,  H01L21/324 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834

    Abstract: A temporary bonding laminate for use in the manufacture of semiconductor devices and a method for manufacturing semiconductor devices are provided. A member to be processed (a semiconductor wafer or the like) can be temporarily supported securely and readily during a mechanical or chemical process of the member, and then the processed member can be readily released from the temporary support without damaging the processed member even after a high temperature process. The laminate includes: (A) a release layer and (B) an adhesive layer. The release layer contains (a1) a compound being liquid at 25° C. and having a 5% mass reduction temperature of 250° C. or more when measured in a nitrogen gas stream under heating conditions of a constant heating rate of 20° C./min; and (a2) a binder having a 5% mass reduction temperature of 250° C. or more when measured under the same conditions.

    Abstract translation: 提供了用于制造半导体器件的临时粘接层压板和半导体器件的制造方法。 待加工构件（半导体晶片等）可以在构件的机械或化学过程中被牢固且容易地暂时支撑，然后即使在经过处理的构件之后，处理构件也可以容易地从临时支撑件释放而不损坏处理构件 高温过程。 层压体包括：（A）剥离层和（B）粘合剂层。 剥离层含有（a1）在25℃恒温下加热条件下在氮气流中测定时，在25℃下为5％的质量还原温度为5 5％ ./min; 和（a2）在相同条件下测定时，具有250℃以上5％质量降低温度的粘合剂。

    LAMINATE BODY
    20.
    发明申请
    LAMINATE BODY 有权
    层压体

    公开(公告)号：US20160170303A1

    公开(公告)日：2016-06-16

    申请号：US15048187

    申请日：2016-02-19

    Applicant: FUJIFILM CORPORATION

    Inventor： Yoshitaka KAMOCHI ,  Ichiro KOYAMA ,  Yu IWAI ,  Atsushi NAKAMURA

    IPC: G03F7/11 ,  G03F7/038

    CPC classification number: G03F7/11 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0382 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/325

    Abstract: There is provided a laminate body which is capable of forming an excellent pattern on an organic semiconductor.A laminate body includes at least a water-soluble resin film and a resist film formed of a chemically amplified photosensitive resin composition on a surface of an organic semiconductor film in this order, in which the chemically amplified photosensitive resin composition contains a photoacid generator which is decomposed in an amount of 80% by mole or greater when exposed to light under the condition of 100 mJ/cm2 or greater at a wavelength of 365 nm, a mask pattern is formed by an exposed portion being hardly soluble in a developer containing an organic solvent, and the formed mask pattern is used as an etching mask.

    Abstract translation: 提供能够在有机半导体上形成优异图案的层叠体。 层叠体依次包含至少一种水溶性树脂膜和由化学放大型感光性树脂组合物形成的抗蚀剂膜，其中化学增幅感光性树脂组合物含有光致酸产生剂，该光致酸性发生剂为 当在365nm的波长为100mJ / cm 2以上的条件下曝光时，以80摩尔％以上的量分解，掩模图案由几乎不溶于含有有机物的显影剂的露出部分形成 溶剂，并且将形成的掩模图案用作蚀刻掩模。

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