公开(公告)号：US07672132B2

公开(公告)日：2010-03-02

申请号：US11566992

申请日：2006-12-05

申请人： Thomas J Fitzgerald ,  Carl L. Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew J. Schaenzer

发明人： Thomas J Fitzgerald ,  Carl L. Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew J. Schaenzer

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H01L23/42 ,  H01L21/4871 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

摘要： An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

摘要翻译： 电子组件包括衬底，附接到衬底的器件以及覆盖该器件和该衬底的至少一部分的导热散热器。 金属基本上填充了装置和导热散热器之间的空间。 一种方法包括将至少一个管芯附接到衬底，将热传导散热器放置在管芯上，以及将熔融金属材料注入到导热散热器和管芯之间的空间中。

公开(公告)号：US20090093072A1

公开(公告)日：2009-04-09

申请号：US12330080

申请日：2008-12-08

申请人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

发明人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

IPC分类号： H01L21/66

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T428/249921 ,  H01L2924/00 ,  H01L2924/014

摘要： A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 将两个或多个热界面材料（“TIM”）的复合物放置在管芯和散热器之间，以改善集成电路封装中管芯的冷却。 根据模具热点的位置，两个或多个TIM的散热能力各不相同。 在一个实施例中，更多导热材料可以被定位在一个或多个管芯热点上方，并且较少的导热材料可以被定位成邻接和/或围绕更多导热材料。 两个或更多个TIM可以包括焊料和聚合物。 复合TIM可以作为一个单元或多个单元来执行。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US07036573B2

公开(公告)日：2006-05-02

申请号：US10071471

申请日：2002-02-08

申请人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

发明人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

IPC分类号： F28F7/00 ,  C08K9/10

CPC分类号： F28F13/00 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/905 ,  H01L2924/00

摘要： A thermal interface material made of a binder material and a fusible filler.

摘要翻译： 由粘合剂材料和易熔填料制成的热界面材料。

公开(公告)号：US06751099B2

公开(公告)日：2004-06-15

申请号：US10023073

申请日：2001-12-20

申请人： Joan K. Vrtis ,  Joni G. Hansen ,  Thomas J. Fitzgerald ,  Carl L. Deppisch

发明人： Joan K. Vrtis ,  Joni G. Hansen ,  Thomas J. Fitzgerald ,  Carl L. Deppisch

IPC分类号： H05K720

CPC分类号： H01L23/3737 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

公开(公告)号：US20080111234A1

公开(公告)日：2008-05-15

申请号：US11558504

申请日：2006-11-10

申请人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

发明人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

IPC分类号： H01L23/36 ,  H01L21/58 ,  B32B5/14

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T428/249921 ,  H01L2924/00 ,  H01L2924/014

摘要： A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 将两个或多个热界面材料（“TIM”）的复合物放置在管芯和散热器之间，以改善集成电路封装中管芯的冷却。 根据模具热点的位置，两个或多个TIM的散热能力各不相同。 在一个实施例中，更多导热材料可以被定位在一个或多个管芯热点上方，并且较少的导热材料可以被定位成邻接和/或围绕更多导热材料。 两个或更多个TIM可以包括焊料和聚合物。 复合TIM可以作为一个单元或多个单元来执行。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US07219421B2

公开(公告)日：2007-05-22

申请号：US10799204

申请日：2004-03-11

申请人： Joan K. Vrtis ,  Joni G. Hansen ,  Thomas J. Fitzgerald ,  Carl L. Deppisch

发明人： Joan K. Vrtis ,  Joni G. Hansen ,  Thomas J. Fitzgerald ,  Carl L. Deppisch

IPC分类号： H01R43/00 ,  H05K7/20 ,  B05D5/12

CPC分类号： H01L23/3737 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

摘要翻译： 用于模具的涂覆式散热器包括主体和主体表面上的涂层，其中最外涂层是有机表面保护剂。 IC封装包括与涂覆有有机表面保护剂的散热器热耦合的模具。 一种PCB组件，其包括热耦合到涂覆有有机表面保护剂的散热器的管芯，其中管芯是IC封装的一部分或直接附接到PCB。 制造涂布式散热器的方法包括将有机表面保护剂涂覆在散热器的表面上。

公开(公告)号：US07160758B2

公开(公告)日：2007-01-09

申请号：US10815185

申请日：2004-03-31

申请人： Thomas J Fitzgerald ,  Carl L. Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew J. Schaenzer

发明人： Thomas J Fitzgerald ,  Carl L. Deppisch ,  Manjit Dhindsa ,  Mark Norwil ,  Matthew J. Schaenzer

IPC分类号： H01L21/44 ,  H01L21/50

CPC分类号： H01L23/42 ,  H01L21/4871 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

摘要： An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.

摘要翻译： 电子组件包括衬底，附接到衬底的器件以及覆盖该器件和该衬底的至少一部分的导热散热器。 金属基本上填充了装置和导热散热器之间的空间。 一种方法包括将至少一个管芯附接到衬底，将热传导散热器放置在管芯上，以及将熔融金属材料注入到导热散热器和管芯之间的空间中。

公开(公告)号：US07489033B2

公开(公告)日：2009-02-10

申请号：US11558504

申请日：2006-11-10

申请人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

发明人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

IPC分类号： H01L23/10

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T428/249921 ,  H01L2924/00 ,  H01L2924/014

摘要： A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 将两个或多个热界面材料（“TIM”）的复合物放置在管芯和散热器之间，以改善集成电路封装中管芯的冷却。 根据模具热点的位置，两个或多个TIM的散热能力各不相同。 在一个实施例中，更多导热材料可以被定位在一个或多个管芯热点上方，并且较少的导热材料可以被定位成邻接和/或围绕更多导热材料。 两个或更多个TIM可以包括焊料和聚合物。 复合TIM可以作为一个单元或多个单元来执行。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US07436058B2

公开(公告)日：2008-10-14

申请号：US10141735

申请日：2002-05-09

申请人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

发明人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

IPC分类号： H01L23/12 ,  H01L23/10 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

摘要翻译： 反应性焊料。 反应性焊料材料可以焊接到半导体表面，例如晶片或晶片的背面。 反应性焊料材料包括与活性元素材料合金化的基底焊料。 反应性焊料材料也可以应用于热管理装置的一部分。 反应性焊料材料可用作半导体表面和热管理装置之间的导热界面。

公开(公告)号：US06471792B1

公开(公告)日：2002-10-29

申请号：US09429871

申请日：1999-10-29

申请人： John F. Breedis ,  Ronald N. Caron ,  Carl L. Deppisch

发明人： John F. Breedis ,  Ronald N. Caron ,  Carl L. Deppisch

IPC分类号： C22C902

CPC分类号： C22C9/04 ,  C22F1/08

摘要： An alpha brass (copper/zinc alloy with less than 39%, by weight, of zinc) stock alloy has controlled additions of nickel, tin and phosphorous. The combination of nickel and tin increase resistance of the alloy to elevated temperature stress relaxation. As a result, spring contacts formed from alloys of the invention maintain a higher percentage of initially imposed stress at elevated temperatures, in the range of 125° C. to 150° C., for significantly longer times than other brass alloys of comparable strength.

摘要翻译： 一种阿尔法黄铜（铜/锌合金，小于39％重量的锌）原料合金可控制添加镍，锡和磷。 镍和锡的组合增加了合金对高温应力松弛的抵抗力。 结果，由本发明的合金形成的弹簧触点在升高的温度下在125℃至150℃的范围内保持较高的初始应力的百分比，比其他具有相当强度的黄铜合金的时间要长得多。