公开(公告)号：US07436058B2

公开(公告)日：2008-10-14

申请号：US10141735

申请日：2002-05-09

申请人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

发明人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

IPC分类号： H01L23/12 ,  H01L23/10 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

摘要翻译： 反应性焊料。 反应性焊料材料可以焊接到半导体表面，例如晶片或晶片的背面。 反应性焊料材料包括与活性元素材料合金化的基底焊料。 反应性焊料材料也可以应用于热管理装置的一部分。 反应性焊料材料可用作半导体表面和热管理装置之间的导热界面。

公开(公告)号：US20080293188A1

公开(公告)日：2008-11-27

申请号：US12220218

申请日：2008-07-22

申请人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

发明人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

IPC分类号： H01L21/60

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

公开(公告)号：US20090093072A1

公开(公告)日：2009-04-09

申请号：US12330080

申请日：2008-12-08

申请人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

发明人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

IPC分类号： H01L21/66

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T428/249921 ,  H01L2924/00 ,  H01L2924/014

摘要： A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 将两个或多个热界面材料（“TIM”）的复合物放置在管芯和散热器之间，以改善集成电路封装中管芯的冷却。 根据模具热点的位置，两个或多个TIM的散热能力各不相同。 在一个实施例中，更多导热材料可以被定位在一个或多个管芯热点上方，并且较少的导热材料可以被定位成邻接和/或围绕更多导热材料。 两个或更多个TIM可以包括焊料和聚合物。 复合TIM可以作为一个单元或多个单元来执行。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US07256058B2

公开(公告)日：2007-08-14

申请号：US11470209

申请日：2006-09-05

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： G01R31/26 ,  H01L21/66 ,  G06F17/50

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

摘要翻译： 一种用于设计和制造集成散热器的装置和方法，使得集成的散热器将具有平坦表面，在将其组装成封装件并暴露于模具的热量之后，将散热器安装在该平面上。 这种用于设计和制造集成散热器的装置和方法将产生散热器，该散热器将补偿由（1）装配期间的物理操作（2）运行期间的热梯度和（3）不同的膨胀和收缩速率导致的变形 的包装材料在高温下与多个包装组装步骤相结合，使得一体式散热器的一个表面将具有平坦的形状。

公开(公告)号：US07036573B2

公开(公告)日：2006-05-02

申请号：US10071471

申请日：2002-02-08

申请人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

发明人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

IPC分类号： F28F7/00 ,  C08K9/10

CPC分类号： F28F13/00 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/905 ,  H01L2924/00

摘要： A thermal interface material made of a binder material and a fusible filler.

摘要翻译： 由粘合剂材料和易熔填料制成的热界面材料。

公开(公告)号：US06504723B1

公开(公告)日：2003-01-07

申请号：US09990489

申请日：2001-11-15

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H05K720

CPC分类号： H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

摘要翻译： 提供具有模具，散热器和固化的焊料材料的电子组件。 模具包括管芯基板和在管芯基板的底表面上的集成电路。 散热器位于模具上方，具有左右倾斜面。 左倾斜面从模具中心附近的点逐渐变细到上表面的上方和左侧。 右倾斜面从靠近中心的点向上和上表面上方逐渐变细。 固化的焊料材料填充下表面的上表面和倾斜面之间的区域。

公开(公告)号：US06867978B2

公开(公告)日：2005-03-15

申请号：US10266996

申请日：2002-10-08

申请人： Kris J. Whittenburg ,  Fay Hua ,  Carl L. Deppisch ,  Sabina J. Houle ,  Peter Brandenburger ,  Kim L. Phillippe

发明人： Kris J. Whittenburg ,  Fay Hua ,  Carl L. Deppisch ,  Sabina J. Houle ,  Peter Brandenburger ,  Kim L. Phillippe

IPC分类号： H01L23/373 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

公开(公告)号：US06504242B1

公开(公告)日：2003-01-07

申请号：US09990622

申请日：2001-11-15

申请人： Carl L. Deppisch ,  Sabina J. Houle ,  Thomas J. Fitzgerald ,  Kristopher E. Dayton ,  Fay Hua

发明人： Carl L. Deppisch ,  Sabina J. Houle ,  Thomas J. Fitzgerald ,  Kristopher E. Dayton ,  Fay Hua

IPC分类号： H01L2310

CPC分类号： H01L23/433 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/31 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00

摘要： An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

摘要翻译： 描述了一种包括其中形成有集成电路的模具，导热散热器和位于模具和散热器之间的铟的电子组件。 散热器有一层镍。 在镍层上形成金层，并且比镍提供更好的铟润湿。 提供铟和散热器之间更好的结构连接，特别是在热循环期间。

公开(公告)号：US20080111234A1

公开(公告)日：2008-05-15

申请号：US11558504

申请日：2006-11-10

申请人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

发明人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E. Xu

IPC分类号： H01L23/36 ,  H01L21/58 ,  B32B5/14

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T428/249921 ,  H01L2924/00 ,  H01L2924/014

摘要： A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 将两个或多个热界面材料（“TIM”）的复合物放置在管芯和散热器之间，以改善集成电路封装中管芯的冷却。 根据模具热点的位置，两个或多个TIM的散热能力各不相同。 在一个实施例中，更多导热材料可以被定位在一个或多个管芯热点上方，并且较少的导热材料可以被定位成邻接和/或围绕更多导热材料。 两个或更多个TIM可以包括焊料和聚合物。 复合TIM可以作为一个单元或多个单元来执行。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US07102226B2

公开(公告)日：2006-09-05

申请号：US11047811

申请日：2005-02-01

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H01L23/34

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.