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    JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTRONIC DEVICES
    12.
    发明申请
    JOINING MATERIAL FOR BONDING OVERLAPPING COMPONENTS OF POWER ELECTRONIC DEVICES 有权

    公开(公告)号：US20220230984A1

    公开(公告)日：2022-07-21

    申请号：US17153057

    申请日：2021-01-20

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Ming Liu ,  Wenying Yang

    IPC: H01L23/00 ,  B22F7/06 ,  B22F3/10

    Abstract: A joining material for bonding overlapping components of a power electronic device together via a liquid phase sintering process. The joining material includes a mixture of composite particles. Each of the composite particles exhibits a core-shell structure having a core made of a copper-based material and a shell surrounding the core that is made of a low melting point material having a melting temperature or a solidus temperature less than that of the copper-based material of the core. The mixture of composite particles includes a first particulate fraction having a first median particle size and a second particulate fraction having a second median particle size. The first median particle size is at least one order of magnitude larger than the second median particle size.

    POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM
    13.
    发明申请
    POWER MODULE WITH VASCULAR JET IMPINGEMENT COOLING SYSTEM 有权

    公开(公告)号：US20220230938A1

    公开(公告)日：2022-07-21

    申请号：US17152084

    申请日：2021-01-19

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Anthony M. Coppola ,  Alireza Fatemi ,  Ronald O. Grover, JR. ,  Ming Liu ,  Chih-hung Yen

    IPC: H01L23/473 ,  H01L21/48

    Abstract: A vascular jet cooling system for use with a planar power module and a coolant supply includes a manifold housing and one or more jet impingement plates. The manifold housing is constructed of a dielectric polymer molding material, and defines a coolant inlet port configured to fluidly connect to the coolant supply, an internal cavity in fluid communication with the coolant inlet port and containing the power module, and a coolant outlet port in fluid communication with the internal cavity. The jet impingement plate(s) is arranged in the internal cavity. Openings of the plates direct coolant passing through the coolant inlet port onto a respective major surface of the power module. A power module assembly includes a planar power module and the vascular jet cooling system. A method of constructing the power module assembly uses sacrificial materials and overmolding of the jet impingement plates.

    PLANAR POWER MODULE WITH HIGH POWER DENSITY PACKAGING
    14.
    发明申请
    PLANAR POWER MODULE WITH HIGH POWER DENSITY PACKAGING 有权

    公开(公告)号：US20220224206A1

    公开(公告)日：2022-07-14

    申请号：US17149152

    申请日：2021-01-14

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Ming Liu ,  Anthony M. Coppola ,  Muhammad H. Alvi

    IPC: H02K11/33 ,  H01L25/07 ,  H01L23/31 ,  H01L23/34 ,  H01L23/373 ,  H01L23/473 ,  H01L23/50 ,  H02K7/00 ,  H02K11/00 ,  B60L50/60

    Abstract: A planar power module includes a second substrate arranged parallel to a first substrate, with the substrates respectively having a dielectric layer interposed between two conductive layers, such that one of the conductive layers of each substrate together forms parallel external conductive surfaces of the power module. The power module includes direct current (DC) bus bars, alternating current (AC) bus bars, and semiconductor switching dies arranged between the substrates. The dies are electrically connected to the bus bars, with each respective die electrically connected to a conductive layers of the first or second substrates. A polymer molding material partially surrounds the substrates and the switching dies. An electric powertrain system includes an electric machine, a propulsion battery pack, and a traction power inverter module (TPIM) having the power module. The power module is a three-phase full-bridge inverter circuit. An electric powertrain and motor vehicle use the power module.

    PACKAGE FOR POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    15.
    发明申请
    PACKAGE FOR POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220130735A1

    公开(公告)日：2022-04-28

    申请号：US17078690

    申请日：2020-10-23

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Anthony M. Coppola ,  Alireza Fatemi ,  Erik B. Golm ,  Ming Liu

    IPC: H01L23/46 ,  H01L21/48

    Abstract: A package for a power semiconductor device includes a housing, a power semiconductor module disposed within the housing, first and second fluidic channels extending through the housing on opposite sides of the power semiconductor module, and first and second arrays of heat transfer elements respectively disposed within the first and second fluidic channels. The first and second arrays of heat transfer elements are respectively physically bonded to first and second major surfaces of the power semiconductor module. A method of manufacturing a package for a power semiconductor device includes (i) respectively bonding first and second arrays of heat transfer elements to first and second major surfaces of a power semiconductor module, (ii) encapsulating the heat transfer elements within a sacrificial material, (iii) forming a housing around the sacrificial material and the heat transfer elements, and (iv) removing the sacrificial material from the housing to form first and second fluidic channels.

    METHOD OF MANUFACTURING A ROAD WHEEL WITH GALVANIC CORROSION ISOLATION
    16.
    发明申请
    METHOD OF MANUFACTURING A ROAD WHEEL WITH GALVANIC CORROSION ISOLATION 有权

    公开(公告)号：US20210237507A1

    公开(公告)日：2021-08-05

    申请号：US16780303

    申请日：2020-02-03

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Steven J. Schuster ,  Ming Liu ,  Jianfeng Wang

    IPC: B60B3/00 ,  B60B3/12

    Abstract: A method of assembling a vehicle road wheel includes providing a tool fixture configured to support a press-fit load and arranging on the tool fixture an isolation plate defining a plate fastener aperture and having a locating projection. The method additionally includes arranging on the isolation plate a wheel subassembly having a hub surface and an opposing fastener surface and defining a hub aperture and a wheel fastener aperture, such that the hub surface rests against the isolation plate. The method also includes aligning the hub aperture with the locating projection and the wheel fastener aperture with the plate fastener aperture. The method additionally includes installing an insert into the wheel fastener aperture and engaging the insert with the plate fastener aperture. Furthermore, the method includes applying a load to the insert to press-fit the insert into the isolation plate at the plate fastener aperture and thereby assemble the wheel.

    ELECTRONIC POWER MODULE ASSEMBLIES AND CONTROL LOGIC WITH DIRECT-COOLING VAPOR CHAMBER SYSTEMS
    19.
    发明申请
    ELECTRONIC POWER MODULE ASSEMBLIES AND CONTROL LOGIC WITH DIRECT-COOLING VAPOR CHAMBER SYSTEMS 有权

    公开(公告)号：US20210195808A1

    公开(公告)日：2021-06-24

    申请号：US16724998

    申请日：2019-12-23

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Ming Liu ,  Anthony M. Coppola ,  Kestutis A. Sonta

    IPC: H05K7/20 ,  B60L50/51 ,  B60L50/60

    Abstract: Presented are electronic power module assemblies with direct-cooling vapor chamber systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A power semiconductor switching device is mounted to the module's housing, separated from the coolant chamber and isolated from the coolant fluid. The power device selectively modifies electric current transmitted between a power source and an electrical load. A two-phase, heat-spreading vapor chamber device includes an outer casing with a casing segment that is mounted to the module housing, fluidly sealed to the internal coolant chamber and exposed to the coolant fluid. Another casing segment includes an inboard-facing casing surface that is mounted to an outboard-facing surface of the power device, and an outboard-facing casing surface mounted to an inboard-facing surface of the power device.

    Corrosion-resistant magnesium-aluminum alloys including germanium
    20.
    发明授权
    Corrosion-resistant magnesium-aluminum alloys including germanium 有权

    公开(公告)号：US10711330B2

    公开(公告)日：2020-07-14

    申请号：US15792440

    申请日：2017-10-24

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Yang Guo ,  Ming Liu ,  Anil K. Sachdev

    IPC: C22C23/02

    Abstract: Magnesium-aluminum corrosion-resistant alloys are provided and include magnesium, aluminum, germanium, small amounts of cathodic reaction active site impurities such as iron, copper, nickel, and cobalt, manganese, and optionally tin. The alloy can include up to about 0.75% germanium, at least about 2.5% aluminum, up to about 2.25% tin, at most 0.0055% iron impurities, and at most 0.125% silicon impurities. The ratio of germanium to iron can be less than 150. The ratio of manganese to iron can be at least 75. The alloy can comprise one or more intermetallic complexes, including magnesium-germanium, magnesium-aluminum, and aluminum-manganese intermetallic complexes.

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