Abstract:
In this invention a double data rate (DDR) DRAM is read and written with data coherence. The data is in the form of a data burst either interleaved or sequential and of any length. The data is read from the DDR DRAM depending on whether the starting address is even or odd and taking into consideration CAS latency. Both edges of the clock are used to transfer data in and out of the DDR DRAM. To write data only the starting address of the data burst is used to maintain data coherence. Data coherence is assured by a write followed by a read of the same data to and from the same memory cell.
Abstract:
In this invention a booster circuit is driven with two complimentary boost signals. The two boost signals produce two complimentary boosted signals that are connected to a pump circuit output by means of two pass gate circuits. The transistors in each pass gate are controlled such that one pass gate circuit conducts in a first half of a clock cycle and the second pass gate circuit conducts in a second half of a clock period. Each pass gate is driven such that the full boosted signal is transferred to the output of the pump circuit and is not diminished by a threshold voltage of the pass gate circuit. The efficiency of this design keeps the output capacitor charged to a value close to the average value of boosted signal.
Abstract:
A multiple phase latched type synchronized clock circuit that will create a multiple phases of an internal clock signal in an integrated circuit that is synchronized with an external system clock signal is disclosed. A latched type clock synchronizer circuit has an input buffer circuit to receive the external input clock to create a first timing clock. The input buffer is connected to a delay monitor circuit to delay the first timing clock by a first delay factor to create a second timing clock. A delay measurement latch array is connected to the input buffer circuit and the delay monitor circuit to create a latched measurement signal, which indicates a period of time between a second pulse of the first timing clock and a first pulse of the second timing clock. A multiple delay array is connected to the input buffer to receive the first timing clock and will create multiple pluralities of incrementally delayed timing clocks. The multiple pluralities of incrementally delay timing clocks and the latched measurement signal are the inputs to a plurality of phase generators that create a plurality of third timing clocks. Each of a plurality of internal buffers is connected to each of the phase generators to receive one of the third timing clocks. The third timing clock is shaped to create one of the multiple phases of the internal clocks which are then buffered, amplified and transmitted to the integrated circuit.
Abstract:
A semiconductor chip set with double-sided off-chip bonding structure in the disclosure comprises at least one first off-chip bonding structure formed above a first surface of the semiconductor chip set, and at least one second off-chip bonding structure formed above a second surface of the semiconductor chip set, wherein the first surface is opposite to the second surface and each of the first off-chip bonding structure and the second off-chip bonding structure is used for connecting to an electrical connecting point external to the semiconductor chip set through bonding wire, through-silicon via (TSV) or micro bump.
Abstract:
A high speed test circuit receives a tester clock from a tester and it conducts a test on a circuit under test. The high speed test circuit generates a high frequency clock according to the tester clock, so it is capable of operating in two frequencies. The high speed test circuit tests the circuit under test according to the high frequency clock, and it performs a low speed operation according to a low frequency clock, which is for example the tester clock.
Abstract:
An integrated circuit formed on a semiconductor substrate having multiple input/output signal paths such that the semiconductor substrate can be mounted to more than one package type. The integrated circuit formed on the semiconductor substrate has at least three pluralities of input output connector pads. The first plurality of input/output connector pads is placed on the semiconductor substrate and is attached to a first functional circuit of the integrated circuit. The second and third pluralities of input/output connector pads are placed on the semiconductor substrate and are attached to a second functional circuit of the integrated circuit. The third plurality of input/output connector pads is placed in an area separated from the first and second pluralities of input/output connector pads. Each input/output connector pads of the third plurality of input/output connector pads is connected to a corresponding input/output connector pad of the second plurality of input/output connector pads and thus to the second functional circuit. If the semiconductor substrate is mounted in a first package type, the second plurality of input/output connector pads is bonded to pins of the first package type to connect the second functional circuit to the external circuit, and the third plurality of input/output connector pads remain unbonded. If the semiconductor substrate is mounted in a second package type, the third plurality of input/output connector pads is bonded to pins of the second package type to connect the second functional circuit to the external circuit and the second plurality of input/output connector pads remain unbonded.
Abstract:
Circuits and a method are disclosed for a semiconductor memory which decode from a system supplied input address two outputs which are either adjacent or boundary adjacent to each other. The two decoded outputs derived from the input address select then, in one cycle, two locations in a Double Data Rate Synchronous Dynamic Random Access Memory (DDR SDRAM). The circuits producing the two decoded outputs allow for sequential and interleaved mode, for data bursts of various lengths, and for addressing of redundant columns.
Abstract:
A fast CMOS sense amplifier for semiconductor memories is disclosed. The memory sense amplifier configuration is comprised of differential pre-sense amplifier stage and a sense amplifier second stage. The pre-sense amplifier stage is composed of two sections with feedback between the sections which reduces the output swing by means of a clamping action, therefore improving output switching recovery time in response to differential input. The feedback between the sections is provided by cross connecting the sub outputs of each section to the gate of a clamping transistor at each section. The reduced recovery time produces reduced delay at the output which speeds up the operation of the sense amplifier. Additionally, the clamping devices have the effect of reducing the average DC current in the pre-sense amplifier.