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公开(公告)号：US11502389B2
公开(公告)日：2022-11-15
申请号：US16976495
申请日：2018-04-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Ting Lin , Chi Hao Chang , Kuan-Ting Wu
Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.
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公开(公告)号：US11475805B2
公开(公告)日：2022-10-18
申请号：US17042383
申请日：2018-09-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Xuan Shi
Abstract: In an example, a switchable display may include a movable pixel unit having a rotatable motive element. The movable pixel unit may further include a first display unit having a first display characteristic and disposed on a first side of the rotatable motive element. The movable pixel unit may further include a second display unit having a second display characteristic and disposed on a second side of the rotatable motive unit, different from the first side.
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公开(公告)号：US20220137680A1
公开(公告)日：2022-05-05
申请号：US17297146
申请日：2019-07-25
Applicant: Hewlett- Packard Development Company, L.P.
Inventor： Chien-Ting Lin , Kuan-Ting Wu , Chi Hao Chang
Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a substrate having an opening therethrough, or an outer edge, or both. A thermoplastic insert molding can include a metal oxide dopant, the thermoplastic insert molding positioned on the substrate. A paint coating can be included on the thermoplastic insert molding. A chamfered edge can be present on the substrate at a location that defines the opening, the outer edge, or both, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge. A metal layer can be formed using laser direct structuring masking a portion of the metal oxide dopant exposed at the chamfered edge. A second metal layer can be formed over the metal layer.
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公开(公告)号：US20220119971A1
公开(公告)日：2022-04-21
申请号：US17425146
申请日：2019-05-09
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Chienchih Chiu
IPC: C25D1/14 , C25D13/20 , C25D13/02 , H01M50/124
Abstract: In one example, a method for manufacturing an electronic device housing is described. A coating layer may be formed on a surface of a metal substrate. Further, an edge region of the metal substrate may be chamfered by applying water-based anti-corrosion cutting fluid to form an exposed surface portion of the metal substrate. On the exposed surface portion, a transparent protective passivation layer may be formed. Furthermore, a first electrophoretic deposition layer may be formed on the transparent protective passivation layer.
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15.发明申请公开(公告)号：US20220112607A1
公开(公告)日：2022-04-14
申请号：US17297210
申请日：2019-06-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Hsing-Hung Hsieh
Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.
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Patent Agency Ranking
公开(公告)号：US20210143524A1
公开(公告)日：2021-05-13
申请号：US16976495
申请日：2018-04-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Ting Lin , Chi Hao Chang , Kuan-Ting Wu
Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.
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17.发明授权公开(公告)号：US11939677B2
公开(公告)日：2024-03-26
申请号：US17297210
申请日：2019-06-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Hsing-Hung Hsieh
CPC classification number: C23C22/57 , C09D5/4411 , C09D5/4419 , C23C22/78 , C25D13/12
Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.
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18.发明申请公开(公告)号：US20220162766A1
公开(公告)日：2022-05-26
申请号：US17296784
申请日：2019-08-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Hslng-Hung Hsieh
Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.
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公开(公告)号：US20220147118A1
公开(公告)日：2022-05-12
申请号：US17298582
申请日：2019-07-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chi Hao Chang , Kuan-Ting Wu , Hui He
Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate with an opening therethrough, and a first protective coating covering the light metal substrate. A second protective coating is on the first protective coating, and a chamfered edge is present along the opening where the chamfer cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge. In one example, a transparent passivation layer is included along the chamfered edge.
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公开(公告)号：US20220016869A1
公开(公告)日：2022-01-20
申请号：US17054565
申请日：2019-03-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chien-Ting Lin , Kuan-Ting Wu , Chi Hao Chang
IPC: B32B7/12 , C09K5/14 , C08J5/18 , C09J11/04 , C09J5/00 , B32B5/02 , B32B17/06 , B32B15/20 , B32B27/36 , B32B27/30 , B32B27/40 , B32B27/38 , B32B27/06
Abstract: The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.
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