公开(公告)号：US20220005631A1

公开(公告)日：2022-01-06

申请号：US17279187

申请日：2019-09-17

Applicant: HITACHI, LTD.

Inventor： Hideki TANAKA ,  Takaaki SUZUKI ,  Motomune KODAMA ,  Manabu AOKI

IPC: H01B12/04 ,  H01F6/06 ,  H01L39/24 ,  H01L39/14 ,  G01R33/34

Abstract: The present invention addresses a problem of providing an MgB2 wire material having a small reversible bending radius, a superconducting coil using the same, and an MRI without lowering a critical current value and a critical current density of the MgB2 wire material to an extreme. To solve the problem, provided are a superconducting wire having a plurality of MgB2 strands and a first base metal, a superconducting coil using the same, and an MRI, the superconducting wire being characterized in that in a cross section orthogonal to a wire longitudinal direction, a center point of an area surrounded by the plurality of MgB2 strands and a center axis of a cross section of the superconducting wire are disposed in separated positions.

公开(公告)号：US20210233685A1

公开(公告)日：2021-07-29

申请号：US17053839

申请日：2019-02-27

Applicant: HITACHI, LTD.

Inventor： Takaaki SUZUKI ,  Hideki TANAKA ,  Motomune KODAMA

IPC: H01B12/08 ,  H01F6/06

Abstract: Provided are: a superconducting wire rod in which the non-uniform deformation of the shape of an MgB2 core material has been controlled; a superconducting coil; a magnetic generator; and a method for producing a superconducting wire rod. A superconducting wire rod (100A) according to the present invention comprises: a center material (106) of which at least the outer circumferential surface is formed of a metal that does not react with Mg; a plurality of single-core wires (103) disposed around the center material (106), each of the single-core wires having an MgB2 superconductor core material (101) coated with a first coating material (102) made of a metal that does not react with Mg; and an outer shell material (105) disposed outside the plurality of single-core wires (103), wherein at least the inner circumferential surface of the outer shell material (105) is formed of a metal that does not react with Mg.

公开(公告)号：US20160005671A1

公开(公告)日：2016-01-07

申请号：US14769231

申请日：2013-02-22

Applicant: HITACHI, LTD.

Inventor： Nobutake TSUYUNO ,  Hiroshi HOZOJI ,  Takashi NAITO ,  Motomune KODAMA ,  Masanori MIYAGI ,  Takuya AOYAGI

IPC: H01L23/29 ,  H01L25/16 ,  H01L23/31 ,  H01L25/07

CPC classification number: H01L23/291 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/564 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/37124 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8389 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/8489 ,  H01L2224/8592 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.

Abstract translation: 本发明旨在提高树脂密封电子控制装置的耐湿性。 树脂密封电子控制装置包括：半导体芯片; 片式电容器; 芯片电阻; 接合部件; 底物; 一个案例; 散热板; 玻璃涂层; 和第一密封材料。 玻璃涂层直接覆盖由元件组成的电子电路，包括：半导体芯片; 片式电容器; 芯片电阻，接合部件和基板，并由第一密封材料密封。 通过不透水，玻璃涂层防止元件组附近的吸水，并且可以防止由于吸水引起的半导体芯片的泄漏电流的增加，以及由迁移引起的绝缘电阻降低等绝缘性能下降 在元素组内。

公开(公告)号：US20150337106A1

公开(公告)日：2015-11-26

申请号：US14655522

申请日：2012-12-26

Applicant: HITACHI, LTD.

Inventor： Yuri KAJIHARA ,  Satoru AMOU ,  Takashi NAITO ,  Yuichi SAWAI ,  Motomune KODAMA

IPC: C08K3/22

CPC classification number: C08K3/22 ,  C03C3/122 ,  C03C3/21 ,  C03C8/14 ,  C08K3/40 ,  C08K2003/2286

Abstract: The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag2O, V2O5, and TeO2, and in which the total content of Ag2O, V2O5, and TeO2 is 75 mass % or more; and a resin composition having a 5% thermal weight reduction temperature equal to or greater than a softening point temperature of the low-melting-point glass composition.

Abstract translation: 本发明的目的是提供一种能够提高绝缘树脂的耐热性和导热性的低熔点玻璃树脂复合材料。 低熔点玻璃树脂复合材料包括：含有Ag2O，V2O5和TeO2的无铅低熔点玻璃组合物，其中Ag2O，V2O5和TeO2的总含量为75质量％，或 更多; 以及具有等于或高于低熔点玻璃组合物的软化点温度的5％热重量还原温度的树脂组合物。

公开(公告)号：US20140285039A1

公开(公告)日：2014-09-25

申请号：US14177988

申请日：2014-02-11

Applicant: Hitachi, Ltd.

Inventor： Takuya AOYAGI ,  Motomune KODAMA ,  Takashi NAITO ,  Tadashi FUJIEDA ,  Yuichi SAWAI ,  Masanori MIYAGI ,  Haruo AKAHOSHI ,  Norihisa IWASAKI

IPC: B23K35/02 ,  H02K3/02 ,  H01R4/02 ,  H02K5/00

CPC classification number: B23K35/025 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/282 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/32 ,  B23K35/3602 ,  H01R4/023 ,  H01R4/625 ,  H02K3/02

Abstract: An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag2O in terms of oxides and the glass transition point is 180° C. or less.

Abstract translation: 一种铝线体，其中铝或铝合金电线和待接合的金属通过焊料接合，其中焊料包括包含钒和导电颗粒的氧化物玻璃。 焊料中所含的导电粒子优选为90体积％以下，氧化物玻璃为20体积％〜90体积％。 进一步优选地，氧化物玻璃的氧化物含有40质量％以上的Ag 2 O，玻璃化转变点为180℃以下。

公开(公告)号：US20230317318A1

公开(公告)日：2023-10-05

申请号：US18022328

申请日：2021-08-06

Applicant: HITACHI, LTD.

Inventor： Shinji FUJITA ,  Yota ICHIKI ,  Motomune KODAMA ,  Tsuyoshi WAKUDA

IPC: H01B12/08 ,  H01B1/02

CPC classification number: H01B12/08 ,  H01B1/02

Abstract: In the connection portion for a superconducting wire, a plurality of superconducting wires are integrated by a sintered body containing MgB2, end portions of the superconducting wires each having an outer peripheral surface of a superconducting filament exposed are inserted into a container in parallel. The container has an opening having a diameter larger than a wire diameter of the superconducting wires on at least one side in a longitudinal direction of the superconducting wires, and the sintered body is in contact with the outer peripheral surfaces of the superconducting filaments. The method for connecting a superconducting wire includes: exposing the outer peripheral surfaces of the superconducting filaments; inserting the superconducting wires into the container; filling the container with a raw material; and heat-treating the raw material to generate the sintered body. The raw material is pressurized in parallel to the longitudinal direction of the superconducting wires and then heat-treated.

公开(公告)号：US20190385766A1

公开(公告)日：2019-12-19

申请号：US16479274

申请日：2018-02-26

Applicant: HITACHI, LTD.

Inventor： Motomune KODAMA ,  Hideki TANAKA ,  Takaaki SUZUKI ,  Junichi SHIMOYAMA

IPC: H01B12/02 ,  C01B35/04

Abstract: The following two problems arise when carbon is added to a starting material powder in the process of production of an MgB2 superconductor: (1) an impurity phase increases; and (2) the degree of substitution of carbon at boron sites is spatially non-uniform. This superconductor production method comprises: a mixing step of mixing a starting material powder and an additive; and a heat treatment step of heat-treating the mixture prepared in the mixing step. The starting material powder is MgB2 powder or a mixed powder of magnesium and boron, and the additive is an Mg—B—C compound containing three elements of magnesium, boron and carbon.

公开(公告)号：US20160293296A1

公开(公告)日：2016-10-06

申请号：US15038346

申请日：2013-12-10

Applicant: HITACHI, LTD.

Inventor： Youta ICHIKI ,  Kazuhide TANAKA ,  Motomune KODAMA

IPC: H01B12/04 ,  H01B13/00 ,  H01B1/02 ,  H01F6/00

CPC classification number: H01B12/04 ,  H01B1/02 ,  H01B13/0036 ,  H01F6/00 ,  H01L39/141 ,  H01L39/2487

Abstract: An MgB2 superconducting wire includes a core containing MgB2 and a metal sheath which surrounds the core. The core includes at least a first MgB2 core positioned on the center side, and a second MgB2 core positioned outside the first MgB2 core, and the density of the second MgB2 core is lower than the density of the first MgB2 core.

Abstract translation: MgB2超导线包括含有MgB 2的芯和围绕芯的金属护套。 核心包括位于中心侧的至少第一MgB 2核和位于第一MgB 2核之外的第二MgB 2核，并且第二MgB 2核的密度低于第一MgB 2核的密度。

公开(公告)号：US20160155521A1

公开(公告)日：2016-06-02

申请号：US14904211

申请日：2013-07-19

Applicant: HITACHI, LTD.

Inventor： Takashi NAITO ,  Takuya AOYAGI ,  Motomune KODAMA ,  Ryo ISHIBASHI

IPC: G21C9/033 ,  C03C3/155 ,  C03C3/15 ,  G21F1/06 ,  G21F9/30

CPC classification number: G21C9/033 ,  C03C3/064 ,  C03C3/066 ,  C03C3/089 ,  C03C3/14 ,  C03C3/145 ,  C03C3/15 ,  C03C3/155 ,  C03C12/00 ,  G21C9/016 ,  G21C9/02 ,  G21F1/06 ,  G21F9/30 ,  G21F9/305 ,  Y02E30/40

Abstract: Neutron-absorbing glass that can be input into water, wherein gadolinium oxide, boron oxide, and zinc oxide are contained and B2O3 is contained 42 to 65 mol % in terms of oxide above.

Abstract translation: 可以输入到水中的中子吸收玻璃，其中含有氧化钆，氧化硼和氧化锌，B2O3含量以上述氧化物为42〜65摩尔％。

公开(公告)号：US20140066313A1

公开(公告)日：2014-03-06

申请号：US13758579

申请日：2013-02-04

Applicant: HITACHI, LTD.

Inventor： Kazuhide TANAKA ,  Motomune KODAMA ,  Yota ICHIKI

IPC: H01B12/16 ,  H01F6/04

CPC classification number: H01B12/16 ,  H01F6/04 ,  H01F6/06 ,  H01L39/141 ,  H01L39/2487 ,  Y02E40/647

Abstract: The present invention provides a MgB2 multi-core wire including a plurality of MgB2 single-core wires having a MgB2 superconducting core part and a metal sheath part the metal sheath part is provided on the outer surface of the MgB2 superconducting core part, wherein a plurality of the MgB2 single-core wires is bound with each other, and a gap is provided between a plurality of the MgB2 single-core wires, and a refrigerant for flowing in the gap in a direction of a longitudinal axis of the MgB2 single-core wires.

Abstract translation: 本发明提供了一种MgB2多芯线，其包括多个具有MgB 2超导芯部的MgB2单芯线和金属鞘部，该金属鞘部设置在MgB 2超导芯部的外表面上，其中，多个 的MgB 2单芯线彼此结合，并且在多个MgB 2单芯线之间设置有间隙，并且在间隙中沿MgB2单芯的纵轴方向流动的制冷剂 电线