公开(公告)号：US20060279940A1

公开(公告)日：2006-12-14

申请号：US11466351

申请日：2006-08-22

申请人： Kishore Chakravorty ,  Paul Wermer ,  David Figueroa ,  Debabrata Gupta

发明人： Kishore Chakravorty ,  Paul Wermer ,  David Figueroa ,  Debabrata Gupta

IPC分类号： H05K7/06 ,  H05K1/03

CPC分类号： H01L23/49822 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/162 ,  H05K1/185 ,  H05K3/4605 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/0401

摘要： To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed of a high permittivity layer sandwiched between conductive planes. An organic portion of the substrate includes suitable routing and fan-out of power and signal conductors. The organic portion includes a build-up of multiple layers of organic material overlying the ceramic portion. Also described are an electronic system, a data processing system, and various methods of manufacture.

摘要翻译： 为了降低开关噪声，集成电路管芯的电源端子耦合到多层陶瓷/有机混合衬底中的至少一个嵌入式电容器的相应端子。 在一个实施例中，衬底的陶瓷部分包括由夹在导电平面之间的高电容率层形成的至少一个电容器。 基板的有机部分包括电源和信号导体的合适布线和扇出。 有机部分包括覆盖陶瓷部分的多层有机材料的堆积。 还描述了电子系统，数据处理系统和各种制造方法。

公开(公告)号：US4564390A

公开(公告)日：1986-01-14

申请号：US684775

申请日：1984-12-21

申请人： Debabrata Gupta ,  John C. Yarwood

发明人： Debabrata Gupta ,  John C. Yarwood

IPC分类号： C22B9/05 ,  C21C5/56 ,  C21C7/00 ,  C21C7/068 ,  C21C7/072 ,  C21C7/076 ,  C22B9/10

CPC分类号： C21C7/0037 ,  C21C7/0685 ,  C21C5/567 ,  C21C7/068 ,  C21C7/072

摘要： A process is disclosed for reducing the carbon content of a melt of metal or metal alloy, carbon, and at least one strong oxide forming metallic alloying element from an initial value of about 0.1 wt % carbon to a final value of not less than about 0.003 wt % carbon. The process consists of contacting the melt with a reactive oxide of the metallic alloying element and simultaneously stirring the melt with an inert gas.

摘要翻译： 公开了一种方法，用于从约0.1重量％碳的初始值降低金属或金属合金，碳和至少一种形成强氧化物的金属合金元素的熔体的碳含量，最终值不小于约0.003 重量％的碳。 该方法包括使熔体与金属合金元素的反应性氧化物接触并同时用惰性气体搅拌熔体。

公开(公告)号：US06775150B1

公开(公告)日：2004-08-10

申请号：US09650566

申请日：2000-08-30

申请人： Kishore K. Chakravorty ,  Paul H. Wermer ,  David G. Figueroa ,  Debabrata Gupta

发明人： Kishore K. Chakravorty ,  Paul H. Wermer ,  David G. Figueroa ,  Debabrata Gupta

IPC分类号： H05K118

CPC分类号： H01L23/49822 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/162 ,  H05K1/185 ,  H05K3/4605 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/09309 ,  H05K2201/10674 ,  H01L2224/0401

摘要： To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid substrate. In one embodiment, a ceramic portion of the substrate includes at least one capacitor formed of a high permittivity layer sandwiched between conductive planes. An organic portion of the substrate includes suitable routing and fan-out of power and signal conductors. The organic portion includes a build-up of multiple layers of organic material overlying the ceramic portion. Also described are an electronic system, a data processing system, and various methods of manufacture.

摘要翻译： 为了降低开关噪声，集成电路管芯的电源端子耦合到多层陶瓷/有机混合衬底中的至少一个嵌入式电容器的相应端子。 在一个实施例中，衬底的陶瓷部分包括由夹在导电平面之间的高电容率层形成的至少一个电容器。 基板的有机部分包括电源和信号导体的合适布线和扇出。 有机部分包括覆盖陶瓷部分的多层有机材料的堆积。 还描述了电子系统，数据处理系统和各种制造方法。

公开(公告)号：US5567648A

公开(公告)日：1996-10-22

申请号：US552430

申请日：1995-11-03

申请人： Debabrata Gupta

发明人： Debabrata Gupta

IPC分类号： H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H05K3/3478 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/0305 ,  H05K2201/10424 ,  H05K2201/10734 ,  H05K2203/043

摘要： A method for forming conductive interconnect bumps, such as solder bumps, on bond pads on a substrate. The method includes conductive discs and a connecting member formed between two adjacent conductive discs. The discs and connecting member are then placed over the bond pads and heat is applied so that the conductive discs and the connecting member combine to form isolated interconnect bumps. A polymer backsheet is used for support.

摘要翻译： 一种用于在衬底上的接合焊盘上形成诸如焊料凸块的导电互连凸块的方法。 该方法包括导电盘和形成在两个相邻导电盘之间的连接构件。 然后将盘和连接构件放置在接合焊盘上，并施加热量，使得导电盘和连接构件组合形成隔离的互连凸块。 聚合物底片用于支撑。

公开(公告)号：US5198963A

公开(公告)日：1993-03-30

申请号：US795440

申请日：1991-11-21

申请人： Debabrata Gupta ,  James E. Drye

发明人： Debabrata Gupta ,  James E. Drye

IPC分类号： G01R31/28 ,  H01L21/66 ,  H01L23/538 ,  H01L25/065

CPC分类号： G01R31/2863 ,  G01R31/2886 ,  H01L22/20 ,  H01L23/5385 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/24227 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/15192

摘要： A multi-chip module (26) used to interconnect and house a plurality of integrated circuits (10). The module (26) employs an intermediate structure referred to, herein, as a bridge chip (12). The bridge chip (12) connects the integrated circuit (10) to the module substrate (19). The integrated circuit (10) is attached to the bridge chip (12) and forms a composite structure (18) which can be burned-in and tested as an individual unit. The bridge chip (12) has interconnects to bring out the inputs and outputs of the integrated circuit (10). The composite structure (18) is mounted to the module substrate (19) such that, the integrated circuit (10) has a thermal pathway to the module substrate (19), and the bridge chip (12) connects to the module substrate (19). The module substrate (19) has interconnects to connect the plurality of composite structures (18).

摘要翻译： 用于互连和容纳多个集成电路（10）的多芯片模块（26）。 模块（26）采用这里称为桥芯片（12）的中间结构。 桥芯片（12）将集成电路（10）连接到模块基板（19）。 集成电路（10）附接到桥芯片（12）并形成可以作为单独单元进行燃烧和测试的复合结构（18）。 桥芯片（12）具有互连以便输出集成电路（10）的输入和输出。 复合结构（18）安装到模块基板（19），使得集成电路（10）具有到模块基板（19）的热通路，桥接芯片（12）连接到模块基板（19） ）。 模块基板（19）具有互连以连接多个复合结构（18）。

公开(公告)号：US4773469A

公开(公告)日：1988-09-27

申请号：US150476

申请日：1988-01-26

申请人： Debabrata Gupta ,  Harvey P. Cheskis

发明人： Debabrata Gupta ,  Harvey P. Cheskis

IPC分类号： B22D11/047 ,  B22D11/00

CPC分类号： B22D11/0475 ,  B22D11/047

摘要： An apparatus and process for continuous horizontal casting of an ingot from molten metal. The apparatus comprises a mold for effecting rapid solidification of the molten metal into the ingot. A feed nozzle supplies the molten metal to the mold. Transition structure is disposed between the mold and the feed nozzle for solidifying the molten metal in the transition structure to prevent freeze back in the feed nozzle.

摘要翻译： 用于从熔融金属连续水平铸造锭的设备和方法。 该装置包括用于使熔融金属快速固化到锭中的模具。 进料喷嘴将熔融金属提供给模具。 过渡结构设置在模具和进料喷嘴之间，用于固化过渡结构中的熔融金属，以防止进料喷嘴中的冷凝。