公开(公告)号：US07259537B2

公开(公告)日：2007-08-21

申请号：US10479074

申请日：2002-05-11

申请人： Henning Hauenstein ,  Richard Spitz ,  Stephan Ernst ,  Achim Henkel

发明人： Henning Hauenstein ,  Richard Spitz ,  Stephan Ernst ,  Achim Henkel

IPC分类号： H02J7/14

CPC分类号： H02J7/0034 ,  H01M2200/30

摘要： A polarity-reversal protector for power sources, in particular for automobile batteries, which is connected between a power source and at least one consumer and/or at least one generator, is described. The polarity-reversal protector is to prevent the reverse polarity current from flowing through the connected systems, so that the systems may not be damaged in case of polarity reversal. For this purpose, the polarity-reversal protector includes means for recognizing whether the two poles of the power source are connected to the appropriate terminals of the consumer and/or generator, and means for decoupling the power source from the consumer and/or from the generator if the two poles of the power source have been transposed during connection to the consumer and/or generator.

摘要翻译： 描述了连接在电源和至少一个消费者和/或至少一个发电机之间的用于电源的极性反转保护器，特别是汽车电池。 极性反转保护器是为了防止反极性电流流过连接的系统，以便在极性反转的情况下，系统可能不会损坏。 为此，极性反转保护器包括用于识别电源的两极是否连接到消费者和/或发电机的适当端子的装置，以及用于将电源与消费者和/或从消费者和/ 如果电源的两极在与消费者和/或发电机连接期间已被转置，则发电机。

公开(公告)号：US20060163648A1

公开(公告)日：2006-07-27

申请号：US10514171

申请日：2003-02-10

申请人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

发明人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

IPC分类号： H01L29/76

CPC分类号： H01L23/488 ,  H01L23/3735 ,  H01L23/482 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

摘要翻译： 一种半导体元件，其能够简单，快速且可靠地制造并且可用于功率应用，并且包括形成在半导体芯片的第一侧上的半导体芯片，下部第一主电极层，下部控制电极 形成在第一侧上的第一主电极层，形成在下第一主电极层和下控制电极层之间的第一侧上并部分覆盖下第一主电极层的绝缘层，形成在第一侧上的第一主电极层 下部第一主电极层，形成在下部控制电极层和绝缘层上的上部控制电极层，并且在绝缘层上部分地在下部第一主电极层的上方延伸，第二主电极层形成在第二侧上 的半导体芯片。

公开(公告)号：US06744250B2

公开(公告)日：2004-06-01

申请号：US10238489

申请日：2002-09-09

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： G01R3302

CPC分类号： H01L27/22 ,  G01R15/20 ,  G01R33/06 ,  G01R33/07 ,  H01L29/4238 ,  H01L29/7803 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/82

摘要： A device for measuring the strength of a vector component of a magnetic field, a current-measuring device and a use of a field-effect transistor are proposed, the orientation of the wall of the at least one first trench gate being provided orthogonally with respect to the magnetic-field vector component to be measured.

摘要翻译： 提出了一种用于测量磁场的矢量分量的强度的装置，电流测量装置和场效应晶体管的使用，所述至少一个第一沟槽栅极的壁的取向正交地设置在与 到待测量的磁场矢量分量。

公开(公告)号：US07723830B2

公开(公告)日：2010-05-25

申请号：US11619742

申请日：2007-01-04

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L23/02

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/39 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32057 ,  H01L2224/32503 ,  H01L2224/73153 ,  H01L2224/83101 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15747 ,  H01L2924/18301 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/29099

摘要： A substrate on which a silicon device is mounted in accordance with an embodiment of the present invention includes a plurality of protrusions extending upward from a top surface of the substrate and a solder layer formed on the top of the substrate such that the plurality of protrusions extends through the solder layer and a top portion of each protrusion of the plurality of protrusions is stamped down to be level with a top surface of the solder layer such that the silicon device is supported on the plurality of protrusions when placed on the substrate. The protrusions are preferably gouged up from the surface of the substrate with a needle like tool. A stamper tool is used to stamp the protrusions down to their desired height such that they are properly positioned to support the silicon device. The solder layer may be a solder pre-form or may be a layer of solder paste. The solder layer is heated to form liquid solder to bond the substrate and the silicon device, however, the protrusions support the silicon device to prevent movement thereof when the solder is in liquid form.

摘要翻译： 根据本发明的实施例，其上安装有硅器件的衬底包括从衬底的顶表面向上延伸的多个突起和形成在衬底的顶部上的焊料层，使得多个突起延伸 通过焊料层和多个突起中的每个突起的顶部被压下以与焊料层的顶表面平齐，使得硅器件在放置在衬底上时被支撑在多个突起上。 优选地，用针状工具从该基板的表面向上突出突起。 压模工具用于将突起压印至其期望的高度，使得它们被适当地定位以支撑硅器件。 焊料层可以是焊料预形式，或者可以是一层焊膏。 焊料层被加热以形成液体焊料以结合衬底和硅器件，然而，当焊料为液体形式时，突起支撑硅器件以防止其移动。

公开(公告)号：US07554188B2

公开(公告)日：2009-06-30

申请号：US11786388

申请日：2007-04-11

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L23/52

CPC分类号： H01L25/072 ,  H01L23/13 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/074 ,  H01L25/18 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/73153 ,  H01L2224/732 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/30107 ,  H01L2224/83 ,  H01L2924/00

摘要： A power semiconductor package that includes at least two semiconductor devices electrically coupled to one another through a common metallic web.

摘要翻译： 一种功率半导体封装，其包括通过公共金属网而彼此电耦合的至少两个半导体器件。

公开(公告)号：US20070290311A1

公开(公告)日：2007-12-20

申请号：US11751936

申请日：2007-05-22

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L24/97 ,  H01L25/112 ,  H01L2224/73153 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00

摘要： A wire bond free power module assembly consists of a plurality of individual thin packages each consisting of two DBC wafers which sandwich one or more semiconductor die. The die electrodes and terminals extend through one insulation covered end of the wafer sandwich and the outer sides of the sandwiches are the outer copper plates of the DBC wafers which are in good thermal communication with the semiconductor die but are electrically insulated therefrom. The plural packages may be connected in parallel by lead frames on the terminals and the packages are stacked with a space between them to expose both sides of all packages to a cooling medium, either the fingers of a conductive comb or a fluid heat exchange medium.

摘要翻译： 无电线自由功率模块组件由多个单独的薄封装组成，每个单独的薄封装由夹着一个或多个半导体管芯的两个DBC晶片组成。 晶片电极和端子延伸穿过晶片夹层的一个绝缘覆盖端，并且三明治的外侧是DBC晶片的外部铜板，其与半导体管芯良好的热连通，但与之电绝缘。 多个封装可以通过端子上的引线框架并联连接，并且封装件在它们之间具有空间堆叠，以将所有封装的两侧暴露于导电梳状物或流体热交换介质的指状物的冷却介质。

公开(公告)号：US20070267926A1

公开(公告)日：2007-11-22

申请号：US11888812

申请日：2007-08-02

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： H02P25/00

CPC分类号： B60L15/20 ,  B60K2001/003 ,  B60L11/1872 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/705 ,  Y02T10/7275

摘要： The power switches of an inverter are mechanically integrated with an electric motor of a vehicle and are mounted on the end plate of the motor and employ short connections between the motor a-c terminals and the inverter a-c output terminals. Bond wireless modules are employed. The electronic controls for the inverter are mounted on a main control board which is positioned remotely from the inverter and is not subject to the heat and EMI produced by the inverter.

摘要翻译： 逆变器的电源开关与车辆的电动机械机械地集成，并且安装在电动机的端板上，并且在电动机a-c端子和逆变器a-c输出端子之间短连接。 Bond无线模块被采用。 逆变器的电子控制装置安装在远离变频器的主控板上，不受变频器产生的热和EMI的影响。

公开(公告)号：US07208829B2

公开(公告)日：2007-04-24

申请号：US10514171

申请日：2003-02-10

申请人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

发明人： Henning Hauenstein ,  Rainer Topp ,  Jochen Seibold ,  Dirk Balszunat ,  Stefan Ernst ,  Wolfgang Feiler ,  Thomas Koester ,  Stefan Hornung ,  Dieter Streb

IPC分类号： H01L29/72

CPC分类号： H01L23/488 ,  H01L23/3735 ,  H01L23/482 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor component that is able to be produced simply, quickly, and yet reliably and that usable for power applications, and including a semiconductor chip, a lower, first main electrode layer formed on a first side of the semiconductor chip, a lower control electrode layer formed on the first side, an insulation layer formed on the first side between the lower first main electrode layer and the lower control electrode layer and which partly covers the lower first main electrode layer, an upper first main electrode layer which is formed on the lower first main electrode layer, an upper control electrode layer which is formed on the lower control electrode layer and the insulation layer and extends on the insulation layer partially above the lower first main electrode layer, and a second main electrode layer formed on a second side of the semiconductor chip.

摘要翻译： 一种半导体元件，其能够简单，快速且可靠地制造并且可用于功率应用，并且包括形成在半导体芯片的第一侧上的半导体芯片，下部第一主电极层，下部控制电极 形成在第一侧上的第一主电极层，形成在下第一主电极层和下控制电极层之间的第一侧上并部分覆盖下第一主电极层的绝缘层，形成在第一侧上的第一主电极层 下部第一主电极层，形成在下部控制电极层和绝缘层上的上部控制电极层，并且在绝缘层上部分地在下部第一主电极层的上方延伸，第二主电极层形成在第二侧上 的半导体芯片。

公开(公告)号：US07190156B2

公开(公告)日：2007-03-13

申请号：US10478555

申请日：2002-05-03

申请人： Henning Hauenstein

发明人： Henning Hauenstein

IPC分类号： G01R19/00 ,  G01R33/02

CPC分类号： G01R33/07 ,  H01L43/065

摘要： A device includes a magnetic-field sensor and an ammeter, in which a field distribution of a first electric field is provided in a region so that the magnitude of the x component of the first electric field increases in the x direction.

摘要翻译： 一种器件包括磁场传感器和电流表，其中在区域中提供第一电场的场分布，使得第一电场的x分量的大小在x方向上增加。