公开(公告)号：US07035301B2

公开(公告)日：2006-04-25

申请号：US10679370

申请日：2003-10-07

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： H01S3/04 ,  H01S3/00 ,  H01L29/24 ,  H01L23/10

CPC分类号： G11B7/127 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01S5/02212 ,  H01S5/0222 ,  H01L2924/00

摘要： In a semiconductor laser device, a flange (33) of a cap (32) is provided with straight-line cut-off portions (34) that are the same in number as notches (36, 37) of a stem (35). With the cut-off portions (34) positioned so as not to overlap the notches (36, 37) of the stem (35) in position, welding between the cap (32) and the stem (35) is performed. The cut-off portions (34) of the cap (32) secure obtainment of a reference plane 38 with a large area in a place where the notches (36, 37) of the stem (35) are absent. As a result, sufficient precision in optical characteristics can be secured while suppressing an influence of unevenness of the stem (35) having a small diameter on a deviation angle θ of an optical axis from a normal line to a reference plane of an optical pickup.

摘要翻译： 在半导体激光装置中，帽（32）的凸缘（33）设置有与茎（35）的切口（36,37）相同数量的直线切断部（34）。 在切断部分34被定位成不与杆35的凹口36,37重叠的位置上，进行盖32和杆35之间的焊接。 盖（32）的切口部分（34）在不存在杆（35）的凹口（36,37）的位置处确保获得具有大面积的参考平面38。 结果，可以在抑制具有小直径的杆（35）的不均匀性对光轴的偏离角θ与光学拾取器的基准面的法线的影响的同时，确保光学特性的足够的精度。

公开(公告)号：US20070237197A1

公开(公告)日：2007-10-11

申请号：US11730507

申请日：2007-04-02

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： H01S3/04

CPC分类号： H01L33/64 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a light emitting element, a heat radiating member, and a submount interposed between the light emitting element and the heat radiating member. The light emitting element is fixed to heat radiating member by a brazing material with the submount interposed. The heat radiating member has a groove on its surface to which the submount is fixed. With this configuration, a semiconductor light emitting device that is applicable to a large-sized light emitting element that is excellent in heat radiation and that has high reliability can be provided.

摘要翻译： 半导体发光器件包括发光元件，散热构件和插入在发光元件和散热构件之间的基座。 发光元件通过钎焊材料固定到散热构件上，其中底座被插入。 散热构件在其表面上具有固定有底座的凹槽。 根据该结构，可以提供适用于散热优良且可靠性高的大型发光元件的半导体发光元件。

公开(公告)号：US20070097683A1

公开(公告)日：2007-05-03

申请号：US11590345

申请日：2006-10-30

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： F21V7/00

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted; and a coating member 4 which covers a surface of the light emitting element mounting member 3 where said light emitting elements 2 are mounted. In the semiconductor light emitting device 1, said light emitting element mounting member 3 is provided with depressed sections 7 at positions where said light emitting elements 2 are respectively mounted; said coating member 4 is provided with through holes at positions respectively corresponding to the depressed sections 7; inner wall surfaces of (i) each of the depressed sections 7 and (ii) each of the through holes respectively form (i) a first reflection surface 8 and (ii) a second reflection surface 9; and the second reflection surface 9 has an angle with respect to an optical axis of said light emitting element 2 smaller than an angle of said first reflection surface 8 with respect to an optical axis of said light emitting element 2.

摘要翻译： 半导体发光器件1包括：多个发光元件2; 发光元件安装构件3，其上安装有所述发光元件2; 以及覆盖安装有发光元件2的发光元件安装部件3的表面的涂布部件4。 在半导体发光器件1中，所述发光元件安装部件3在分别安装有发光元件2的位置处设置有凹部7。 所述涂覆部件4在分别对应于凹陷部分7的位置处设有通孔; （i）每个凹陷部分7和（ii）的每个通孔的内壁表面分别形成（i）第一反射表面8和（ii）第二反射表面9; 并且第二反射面9相对于所述发光元件2的光轴具有相对于所述发光元件2的光轴小于所述第一反射面8的角度的角度。

公开(公告)号：US07161190B2

公开(公告)日：2007-01-09

申请号：US11193364

申请日：2005-08-01

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： H01L31/024

CPC分类号： H01L33/648 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the first and second lead frames, and a heat-radiating member bonded to a back face of the first lead frame with a brazing member (electrically-conductive layer) containing metal interposed therebetween. The brazing member and the heat-radiating member are formed immediately below and around the light-emitting element.

摘要翻译： 一种半导体发光装置，包括发光元件，具有安装有发光元件的主表面的第一引线框架，与第一引线框架间隔开的第二引线框架，用于固定第一和 第二引线框架和散热构件，该散热构件与第一引线框架的背面接合，其间插入有金属的钎焊构件（导电层）。 钎焊构件和散热构件形成在发光元件的正下方和周围。

公开(公告)号：US20060022216A1

公开(公告)日：2006-02-02

申请号：US11193364

申请日：2005-08-01

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/648 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the first and second lead frames, and a heat-radiating member bonded to a back face of the first lead frame with a brazing member (electrically-conductive layer) containing metal interposed therebetween. The brazing member and the heat-radiating member are formed immediately below and around the light-emitting element.

摘要翻译： 一种半导体发光装置，包括发光元件，具有安装有发光元件的主表面的第一引线框架，与第一引线框架间隔开的第二引线框架，用于固定第一和 第二引线框架和散热构件，该散热构件与第一引线框架的背面接合，其间插入有金属的钎焊构件（导电层）。 钎焊构件和散热构件形成在发光元件的正下方和周围。

公开(公告)号：US20050133939A1

公开(公告)日：2005-06-23

申请号：US11013617

申请日：2004-12-15

申请人： Hiroshi Chikugawa ,  Yoshihiko Yamamoto ,  Eiji Kametani

发明人： Hiroshi Chikugawa ,  Yoshihiko Yamamoto ,  Eiji Kametani

IPC分类号： F21V29/00 ,  F21V1/00 ,  F21Y101/02 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting element is die-bonded to a portion of a lead frame exposed at the bottom of an opening formed at a top face of a resin package. A reflector to direct light emitted from the light emitting element towards a predetermined direction is attached to the top face of the resin package. Lead terminals are arranged so as to protrude from two opposite side regions of the resin package. A predetermined lead terminal among the plurality of lead terminals, connected to a portion where the light emitting element is die-bonded, is bent upwards, and soldered to the reflector by solder paste.

摘要翻译： 发光元件与在树脂封装的顶面形成的开口的底部露出的引线框架的一部分进行芯片接合。 将从发光元件发射的光朝向预定方向引导的反射器附接到树脂封装的顶面。 引线端子被布置成从树脂封装的两个相对侧区域突出。 多个引线端子中的与发光元件被芯片接合的部分连接的预定引线端子向上弯曲，并通过焊膏焊接到反射器。

公开(公告)号：US20090268084A1

公开(公告)日：2009-10-29

申请号：US12496755

申请日：2009-07-02

申请人： Eiji Kametani ,  Yoshihiko Yamamoto ,  Hiroshi Chikugawa

发明人： Eiji Kametani ,  Yoshihiko Yamamoto ,  Hiroshi Chikugawa

IPC分类号： H04N5/222

CPC分类号： H04N5/2256 ,  G03B15/05 ,  G03B2215/0503 ,  G03B2215/0567 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H04N5/2354 ,  H04N2101/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image capturing device employing as illumination source(s) (flash apparatus(es)) a plurality of light emitting diodes emitting light of different colors; wherein such light emitting diodes are respectively made to emit light in pulsed fashion in turn by emitted color during exposure time(s). Furthermore, during exposure time(s), such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color, and/or such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color over multiple iterations.

摘要翻译： 采用发光的不同颜色的多个发光二极管作为照明源（闪光装置）的摄像装置; 其中这种发光二极管分别在暴露时间期间依次通过发出的颜色以脉冲方式发光。 此外，在曝光时间期间，可以使这样的发光二极管依次通过发射的颜色顺序地以发光的方式发光，和/或这样的发光二极管依次通过发射的脉冲方式依次发光 颜色多次迭代。

公开(公告)号：US07282740B2

公开(公告)日：2007-10-16

申请号：US11013617

申请日：2004-12-15

申请人： Hiroshi Chikugawa ,  Yoshihiko Yamamoto ,  Eiji Kametani

发明人： Hiroshi Chikugawa ,  Yoshihiko Yamamoto ,  Eiji Kametani

IPC分类号： H01L27/15

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting element is die-bonded to a portion of a lead frame exposed at the bottom of an opening formed at a top face of a resin package. A reflector to direct light emitted from the light emitting element towards a predetermined direction is attached to the top face of the resin package. Lead terminals are arranged so as to protrude from two opposite side regions of the resin package. A predetermined lead terminal among the plurality of lead terminals, connected to a portion where the light emitting element is die-bonded, is bent upwards, and soldered to the reflector by solder paste.

摘要翻译： 发光元件与在树脂封装的顶面形成的开口的底部露出的引线框架的一部分进行芯片接合。 将从发光元件发射的光朝向预定方向引导的反射器附接到树脂封装的顶面。 引线端子被布置成从树脂封装的两个相对侧区域突出。 多个引线端子中的与发光元件被芯片接合的部分连接的预定引线端子向上弯曲，并通过焊膏焊接到反射器。

公开(公告)号：US07242156B2

公开(公告)日：2007-07-10

申请号：US10998714

申请日：2004-11-30

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： H05B37/02

CPC分类号： H05B33/0818 ,  H05B33/0869 ,  Y02B20/346

摘要： A pulse drive method for a light-emitting semiconductor devices having a plurality of light-emitting elements emitting light at different wavelengths and comprising first lit steps in which light-emitting element(s) of any of the emitted wavelengths is/are made to light as a result of being driven at drive setting(s) for each emitted wavelength, optical output(s) from the lit light-emitting element(s) is/are detected, and the light-emitting element(s) drive setting(s) is/are adjusted based on the detected light-emitting element optical output(s); and unlit steps in which the light-emitting elements of all of the emitted wavelengths are unlit for prescribed unlit time. The first lit steps are carried out in repeated fashion while the driven light-emitting element(s) is/are switched so as to cause the light-emitting element(s) to sequentially light in pulsed fashion in turn by emitted wavelength, and the unlit step respectively intervenes between each pair of successive iterations of the first lit steps.

摘要翻译： 一种用于具有发射不同波长的光的多个发光元件的发光半导体器件的脉冲驱动方法，包括使得发光波长的发光元件被发光的第一照明步骤 作为对于每个发射波长的驱动设置被驱动的结果，检测来自点亮的发光元件的光输出，并且发光元件的驱动设置（s） ）根据检测到的发光元件光输出进行调整; 以及未点亮的步骤，其中所有发射波长的发光元件在规定的不亮时间不亮。 第一点亮的步骤以重复的方式进行，同时切换驱动的发光元件以使得发光元件依次以发射的波长依次以顺序的方式点亮，并且 不亮的步骤分别介于第一点亮步骤的每对连续迭代之间。

公开(公告)号：US07046926B2

公开(公告)日：2006-05-16

申请号：US10852108

申请日：2004-05-25

申请人： Hiroshi Chikugawa

发明人： Hiroshi Chikugawa

IPC分类号： G03B15/03

CPC分类号： G03B15/05 ,  G03B2215/0567 ,  G03B2215/0585 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Light emitting semiconductor device(s) of the present invention is/are provided with three LED elements by way of lead frame(s) on substrate(s) Reflector(s)—having parabolically curved surface(s) at inner wall(s) thereof is/are installed at periphery or peripheries of these LED elements. Radiative angle(s) of light radiating from such reflector(s) is/are controlled by alteration of height(s) of reflector(s). Such height(s) may be lowered to increase radiative angle(s) θ of light therefrom so as to establish broader irradiative locus or loci and/or such height(s) may be raised to decrease radiative angle(s) θ of light radiating therefrom so as to establish narrower irradiative locus or loci.

摘要翻译： 本发明的发光半导体器件通过在基底上的引线框架设置有三个LED元件，反射器在内壁具有抛物面曲面， 它们被安装在这些LED元件的周边或周边。 通过改变反射器的高度来控制从这种反射器辐射的光的辐射角（s）。 可以降低这种高度以增加其光的辐射角θ，以便建立更宽的照射轨迹或轨迹，和/或可以提高这样的高度，以降低辐射光的辐射角（s） 从而建立较窄的照射位点或位点。