摘要:
A design support apparatus supports wiring design for bond wires that connect a semiconductor chip and an interposer. The design support apparatus includes a creating unit that creates simulated design data simulating occurrence of fluctuation in an arrangement position of a semiconductor chip on an interposer and occurrence of fluctuation in bond wire connection terminal positions of the interposer, and an analyzing unit that analyzes, based on the simulated design data, deficiencies in manufacturing of semiconductor devices due to the fluctuation in the arrangement position of the semiconductor chip on the interposer and the fluctuation in the bond wire connection terminal positions of the interposer.
摘要:
A knitted-in slide fastener in which a continuous fastener element row can be mounted stably in its dimensional meaning and firmly while breaking of a needle is prevented, so as to secure a smooth engagement of elements, wherein the continuous fastener element row is fixed and knitted-in by a fixing chain knitting yarn at the same time when a fastener tape is knitted, the fixing chain knitting yarn for the elements is knitted into plural wales of a fastener element attaching portion on one side edge of the fastener tape, warp knitting yarns to be knitted for reinforcement are entangled with a needle loop formed by a constituent yarn of at least one of wales in a foundation structure adjoining the plural wales through their needle loops but not entangled with a needle loop of the fixing chain knitting yarn through their needle loops.
摘要:
There is provided a knit-in slide fastener in which a continuous fastener element row is knitted simultaneously with the knitting of a warp knitted fastener tape at a fastener element mounting portion on a longitudinal side edge portion of the fastener tape. Since a yarn composed of ordinary long fibers, or a textured yarn is employed as a fixing knitting yarn for the fastener element mounting portion, even if a sewing needle is pierced into the textured yarn, the fixing knitting yarn is never cut off because the sewing needle passes through a number of fibers which compose the textured yarn. Further, even when part of the fibers are cut off, no fraying occurs in the yarns, so that the fastener element row at the cut off portions does not separate from the fastener tape.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
摘要:
In a knit slide fastener in which a continuous fastener element row is knitted in a fastener element attaching portion of each fastener tape simultaneously with the knitting of the fastener tape, a plurality of laid-in weft yarns are knitted in the warp-knit structure of the fastener element attaching portion so as to turn alternately in every course and to be interlaced with knit loops of a chain stitch extending along the outermost edge of the fastener element attaching portion, and the fastener element row is secured to the ground structure of the attaching portion by two binding chain stitches.
摘要:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
摘要:
A semiconductor memory device comprises a DRAM memory cell array comprising a plurality of dynamic type memory cells arranged in a plurality of rows and columns, and an SRAM memory cell array comprising static type memory cells arranged in a plurality of rows and columns. The DRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns. The SRAM memory cell array is divided into a plurality of blocks each comprising a plurality of columns, corresponding to the plurality of blocks in the DRAM memory cell array. The SRAM memory cell array is used as a cache memory. At the time of cache hit, data is accessed to the SRAM memory cell array. At the time of cache miss, data is accessed to the DRAM memory cell array. On this occasion, data corresponding to one row in each of the blocks in the DRAM memory cell array is transferred to one row in the corresponding block in the SRAM memory cell array.
摘要:
A semiconductor memory device of folded bit line structure includes a cross portion in at least one portion of each bit line pair so that values of coupling capacitance with adjacent bit line pairs are equal to each other with respect to the paired bit lines. Preferably, the respective bit line pairs are equally divided into 4N (N being an integer), although advantages of the invention may be obtained with division of the bit lines into 3N, and the cross parts are provided at dividing points so that bit line pairs having the cross parts at the same dividing points are arranged on alternate pairs of bit lines. In a preferred embodiment, the cross parts are provided in regions for forming restore circuits or sense amplifiers. In a further embodiment, a dummy word line for selecting dummy cells for providing a reference potential is selected according to the position of a selected word line.
摘要:
A semiconductor memory device comprises a plurality of bit line pairs and an input/output line pair. Each bit line pair comprises first and second bit lines supplied with complementary data, and the input/output line pair comprises first and second input/output lines supplied with complementary data. A switching circuit is provided on each bit line pair. Each switching circuit, in response to a control signal according to an address signal, respectively couples the first and the second bit lines to the first and the second input/output lines, or inversely, respectively couples the first and the second bit lines to the second and the first input/output lines.