公开(公告)号：US5340851A

公开(公告)日：1994-08-23

申请号：US17290

申请日：1993-02-12

申请人： Toshio Shiobara ,  Hisashi Shimizu ,  Minoru Takei

发明人： Toshio Shiobara ,  Hisashi Shimizu ,  Minoru Takei

IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29

CPC分类号： H01L23/293 ,  C08G59/4042 ,  C08L63/00 ,  H01B3/40 ,  H01L2924/0002

摘要： A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

摘要翻译： 热固性树脂组合物包含（A）具有不含烯丙基的马来酰亚胺基的酰亚胺化合物和具有含烯丙基的酰亚胺基的酰亚胺化合物的混合物，（B）环氧树脂，（C）酚醛树脂， （D）芳族聚合物/有机聚硅氧烷共聚物。 组分（B）和/或（C）包括含有与芳环共轭的双键的萘环的化合物。 该组合物易于加工并且粘合性良好，并且可以改善机械强度，耐热水性，低热膨胀性和最小化吸水性的产品。

公开(公告)号：US5306748A

公开(公告)日：1994-04-26

申请号：US921251

申请日：1992-07-29

申请人： Toshio Shiobara ,  Hisashi Shimizu ,  Manabu Narumi

发明人： Toshio Shiobara ,  Hisashi Shimizu ,  Manabu Narumi

IPC分类号： C08G8/08 ,  C08G59/08 ,  C08G59/32 ,  C08L61/06 ,  C08L63/00 ,  C08G59/00 ,  C08G8/04 ,  C08G14/04

CPC分类号： C08L61/06 ,  C08G59/08 ,  C08G59/3218 ,  C08G59/3254 ,  C08G8/08 ,  C08L63/00

摘要： Fluorine-modified thermosetting reins are available as phenolic or epoxy resins having trifluoromethyl groups and a naphthalene skeleton in a molecule. They are useful as components of resin compositions or resin modifiers and cure to products having low water pickup, low coefficient of thermal expansion, and adhesion as well as heat resistance and mechanical strength. Thermosetting resin compositions having such a thermosetting resin blended therein are useful in semiconductor element packaging.

摘要翻译： 氟改性的热固性榫头可以作为分子中具有三氟甲基和萘骨架的酚醛树脂或环氧树脂来获得。 它们可用作树脂组合物或树脂改性剂的组分，并且固化成具有低吸水率，低热膨胀系数和粘合性以及耐热性和机械强度的产品。 具有这样的热固性树脂的热固性树脂组合物可用于半导体元件封装。

公开(公告)号：US07563854B2

公开(公告)日：2009-07-21

申请号：US11586525

申请日：2006-10-26

申请人： Hisashi Shimizu ,  Toshio Shiobara ,  Tsutomu Kashiwagi

发明人： Hisashi Shimizu ,  Toshio Shiobara ,  Tsutomu Kashiwagi

IPC分类号： C08G77/06

CPC分类号： C08G77/04 ,  C08G77/06 ,  C08G77/08 ,  C08G77/14 ,  Y10T428/31663

摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.

摘要翻译： 本发明提供一种聚苯乙烯换算重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有水解性基团的硅烷化合物进行第一次水解缩合而制造有机聚硅氧烷的工序， 该有机聚硅氧烷再次进行水解和缩合。 高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。 包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

公开(公告)号：US07550204B2

公开(公告)日：2009-06-23

申请号：US11586564

申请日：2006-10-26

申请人： Hisashi Shimizu ,  Toshio Shiobara ,  Tsutomu Kashiwagi

发明人： Hisashi Shimizu ,  Toshio Shiobara ,  Tsutomu Kashiwagi

IPC分类号： B32B9/04 ,  C08G77/18

CPC分类号： C08L83/04 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08J7/047 ,  C08J2483/00 ,  C08K5/0091 ,  H01L23/296 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

摘要： The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.

摘要翻译： 本发明提供了一种用于密封光学装置的组合物，其包含（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In- 线形式“end =”lead“→> R1a（OX）bSiO（4-ab）/ 2 <？in-line-formula description =”In-line Formulas“end =”tail“？>（其中，R1表示 烷基，烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团（其中，RE至R 4为一价烃基）和烷基，烯基，烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数，a + b满足1.00 a + b 2），（ii）缩合催化剂，以及由 固化组合物，以及密封半导体元件的方法，其包括施加组合物的步骤 涉及半导体元件，以及固化已经施加到半导体元件上的组合物的步骤。 该组合物可以形成表现出优异的耐热性，耐紫外线性，光学透明性，韧性和粘附性的涂膜。

公开(公告)号：US20060035092A1

公开(公告)日：2006-02-16

申请号：US11199175

申请日：2005-08-09

申请人： Hisashi Shimizu ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Hisashi Shimizu ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B32B27/04 ,  C08L83/04 ,  H01L21/00

CPC分类号： C09D183/04 ,  H01L33/56 ,  Y10T428/31663

摘要： Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b)/2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0

摘要翻译： 提供一种用于密封LED元件的树脂组合物，其包含（i）由平均组成式（1）表示的聚苯乙烯换算重均分子量为至少5×10 3的有机聚硅氧烷：R

公开(公告)号：US06210811B1

公开(公告)日：2001-04-03

申请号：US09404301

申请日：1999-09-24

申请人： Tsuyoshi Honda ,  Miyuki Wakao ,  Hisashi Shimizu ,  Toshio Shiobara

发明人： Tsuyoshi Honda ,  Miyuki Wakao ,  Hisashi Shimizu ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L23/293 ,  C08G59/32 ,  C08G59/3254 ,  C08L63/00 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  Y10T428/12528 ,  C08L83/00 ,  H01L2924/3512 ,  H01L2924/00

摘要： An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

摘要翻译： 一种环氧树脂组合物，其包含含有0-10重量％的2-核化合物和50-100重量％组合并具有1.0-1.7分散性（Mw / Mn）的3至5个核化合物的环氧树脂， 无机填料，固化催化剂和任选的酚醛树脂，并且在未固化状态下具有低于15℃的Tg，有效地形成易于在室温下加工的柔性膜。 层压膜包括环氧树脂组合物层和保护层。 通过用膜密封半导体芯片，获得了具有改善的耐热性，改进的耐湿性，低应力性能的半导体封装。

公开(公告)号：US5182351A

公开(公告)日：1993-01-26

申请号：US580668

申请日：1990-09-11

申请人： Toshio Shiobara ,  Hisashi Shimizu

发明人： Toshio Shiobara ,  Hisashi Shimizu

IPC分类号： C08F222/40 ,  C08F20/52 ,  C08F30/08 ,  C08F230/08 ,  C08F290/00 ,  C08F299/00 ,  C08F299/08 ,  C08G59/20 ,  C08G59/30 ,  C08G59/40 ,  C08G73/12 ,  C08K5/3415 ,  C08L79/08 ,  C08L83/04 ,  C08L83/07

CPC分类号： C08L79/08 ,  C08F299/08 ,  C08F30/08 ,  C08G73/12 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08G77/44 ,  C08G77/70

摘要： A thermosetting resin composition comprising a maleimide having at least one N-substituted maleimide group in the molecule thereof and a silicon compound having conjugated double bonds is easily workable and yields cured products having improved heat resistance.

摘要翻译： 包含其分子中具有至少一个N-取代的马来酰亚胺基团的马来酰亚胺和具有共轭双键的硅化合物的热固性树脂组合物易于加工，并产生具有改善的耐热性的固化产物。

公开(公告)号：US20060229408A1

公开(公告)日：2006-10-12

申请号：US11399434

申请日：2006-04-07

申请人： Hisashi Shimizu ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Hisashi Shimizu ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： C08L83/06 ,  C08G77/08

CPC分类号： H01L23/293 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2924/0002 ,  C08L2666/52 ,  C08L2666/54 ,  H01L2924/00

摘要： A curable resin composition for sealing an LED element is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, (ii) a condensation catalyst, (iii) a solvent, and (iv) a finely powdered inorganic filler. It is suited to formation of a coating film or the like with excellent heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and is ideal for applications such as the sealing of LED elements.

摘要翻译： 提供一种用于密封LED元件的可固化树脂组合物。 组合物包括（i）聚​​苯乙烯当量重均分子量为至少5×10 3的有机聚硅氧烷，（ii）缩合催化剂，（iii）溶剂和（iv）细粉末状无机物 填料。 适合于形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘合性的涂膜等，并且是诸如LED元件的密封等应用的理想选择。

公开(公告)号：US06235865B1

公开(公告)日：2001-05-22

申请号：US09345390

申请日：1999-06-30

申请人： Hisashi Shimizu ,  Minoru Takei ,  Toshio Shiobara

发明人： Hisashi Shimizu ,  Minoru Takei ,  Toshio Shiobara

IPC分类号： B01J3122

CPC分类号： C08K5/55 ,  B01J31/0268 ,  B01J31/146 ,  C07F9/54 ,  C08G59/688 ,  C08L63/00

摘要： Phosphonium borate compounds of formula (1) are novel. R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at least one of R1, R2, R3 and R4 which are bonded to phosphorus atom and at least one of R1, R2, R3 and R4 which are bonded to boron atom are each an organic group derived by releasing a proton from a proton donor selected from among an aromatic carboxylic acid having at least one carboxyl group, an aromatic carboxylic acid having at least one acid anhydride group and at least one carboxyl group, a phenol compound having at least one phenolic hydroxyl group, an aromatic compound having at least one carboxyl group and at least one phenolic hydroxyl group, and an aliphatic carboxylic acid having at least one carboxyl group. The phosphonium borate compounds are useful as a latent curing catalyst for epoxy resin compositions. The epoxy resin compositions are improved in shelf stability, fast-curing ability and flow and cure into products having moisture resistance and improved electrical properties.

摘要翻译： 式（1）的硼酸鏻化合物是新颖的.R1，R2，R3和R4各自是具有芳族或杂环或一价脂族基的一价有机基团，R 1，R 2，R 3和R 4中的至少一个是键合的 磷原子和与硼原子键合的R 1，R 2，R 3和R 4中的至少一个各自是通过从质子供体中释放质子衍生的有机基团，所述质子供体选自具有至少一个羧基的芳族羧酸， 具有至少一个酸酐基和至少一个羧基的芳族羧酸，具有至少一个酚羟基的酚化合物，至少一个羧基和至少一个酚羟基的芳族化合物和脂族羧酸 具有至少一个羧基。 硼酸鏻化合物可用作环氧树脂组合物的潜在固化催化剂。 环氧树脂组合物在贮存稳定性，快速固化能力和流动性方面得到改进，并且固化成具有防潮性和改善的电性能的产品。