公开(公告)号：US07173433B2

公开(公告)日：2007-02-06

申请号：US11055698

申请日：2005-02-11

Applicant: Hiroyuki Hoshi ,  Hitoshi Kurusu

Inventor： Hiroyuki Hoshi ,  Hitoshi Kurusu

IPC: G01R35/00

CPC classification number: G01R35/007 ,  G01R31/2822 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a high frequency circuit property measurement method, prior to property measurements of a high frequency circuit with RF measurement probe heads, RF measurement probe heads are calibrated using a calibration pattern comprising a signal line having a characteristic impedance and extending on a dielectric substrate, a first GND pad having one end disposed close to and at an interval from a first end of the signal line, a second GND pad having one end disposed close to and at an interval from a second end of the signal line, and a conductor electrically coupling the first GND pad to the second GND pad.

Abstract translation: 在高频电路特性测量方法中，在具有RF测量探针头的高频电路的性质测量之前，使用包括具有特征阻抗并在电介质基底上延伸的信号线的校准图案校准RF测量探头， 第一GND焊盘，其一端靠近信号线的第一端并且间隔设置;第二GND焊盘，其一端靠近信号线的第二端并以一定距离设置;电导体 第一个GND焊盘到第二个GND焊盘。

公开(公告)号：US06624512B2

公开(公告)日：2003-09-23

申请号：US10157981

申请日：2002-05-31

Applicant: Hitoshi Kurusu

Inventor： Hitoshi Kurusu

IPC: H01L2348

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/544 ,  H01L29/0657 ,  H01L2223/54473 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/30105 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/10674 ,  H05K2203/0455 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor integrated circuit device and a printed wired board which self-align to each other in an exact and precise manner. The semiconductor integrated circuit device has conductive bumps. The printed wired board has conductive recessed members at positions corresponding to the conductive bumps. Each of the conductive bumps is fitted into the corresponding conductive recessed member so that the printed wired board is aligned with the semiconductor integrated circuit device.

Abstract translation: 半导体集成电路器件和印刷线路板，其精确和精确地彼此自对准。 半导体集成电路器件具有导电凸块。 印刷布线板在与导电凸块相对应的位置处具有导电凹槽。 每个导电凸块装配到相应的导电凹进部件中，使得印刷的布线板与半导体集成电路器件对准。