公开(公告)号：US10589990B2

公开(公告)日：2020-03-17

申请号：US16134355

申请日：2018-09-18

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Ulrich Krumbein ,  Gerhard Metzger-Brueckl ,  Johann Strasser ,  Juergen Wagner ,  Arnaud Walther

IPC: B81B7/02 ,  H04R19/00 ,  H04R19/04 ,  H04R1/28

Abstract: In accordance with an embodiment, a MEMS microphone includes a sound detection unit having a first membrane, a second membrane arranged at a distance from the first membrane, a low-pressure region arranged between the first membrane and the second membrane, a gas pressure that is reduced in relation to normal pressure being present in said low-pressure region, a counter electrode arranged in the low-pressure region, and a sound through-hole, which extends through the sound detection unit in a thickness direction of the sound detection unit; and a valve provided at the sound through-hole, said valve being configured to adopt a plurality of valve states, wherein a predetermined degree of transmission of the sound through-hole to sound is assigned to each valve state.

公开(公告)号：US20190270639A1

公开(公告)日：2019-09-05

申请号：US16270219

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Gunar Lorenz ,  Alfons Dehe ,  Marc Fueldner ,  Bernd Goller ,  Ulrich Krumbein ,  Andreas Wiesbauer

IPC: B81B7/00 ,  B81B7/02 ,  B81B3/00 ,  H04R19/04

Abstract: A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

公开(公告)号：US10322481B2

公开(公告)日：2019-06-18

申请号：US14198646

申请日：2014-03-06

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Reinhard Gabl ,  Ulrich Krumbein

IPC: B81B3/00 ,  B23Q3/18 ,  H04R7/18 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  B81C1/00

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

公开(公告)号：US20180213602A1

公开(公告)日：2018-07-26

申请号：US15879110

申请日：2018-01-24

Applicant: Infineon Technologies AG

Inventor： Ulrich Krumbein ,  Werner Simbuerger ,  Dietmar Straeussnigg ,  Andreas Wiesbauer

IPC: H05B3/02 ,  G01N33/00 ,  G01K1/20 ,  G01L19/04 ,  H04R1/08

CPC classification number: H05B3/02 ,  G01K1/20 ,  G01L9/125 ,  G01L19/0092 ,  G01L19/04 ,  G01N33/0073 ,  H04R1/08 ,  H04R9/022 ,  H04R2201/003 ,  H05B1/0227

Abstract: A sensor circuit and a method for compensating for temperature changes are provided. In accordance with an embodiment, sensor circuit includes at least one sensor for determining a measurement variable; a heating structure; and at least one compensation circuit. The compensation circuit is configured to acquire information about a temperature change in an environment of the sensor, and to counteract a temperature change in the sensor on the basis of the information by driving the heating structure.

公开(公告)号：US09888331B2

公开(公告)日：2018-02-06

申请号：US14486696

申请日：2014-09-15

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Christian Jenkner ,  Ulrich Krumbein ,  Marc Füldner

IPC: H04R29/00

Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.

公开(公告)号：US09691687B2

公开(公告)日：2017-06-27

申请号：US14266348

申请日：2014-04-30

Applicant: Infineon Technologies AG

Inventor： Daniel Kehrer ,  Ulrich Krumbein ,  Beng-Keh See ,  Horst Theuss ,  Helmut Wietschorke ,  Tze Yang Hin ,  Stefan Martens

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/31 ,  H01L23/66 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/495 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.

公开(公告)号：US20160080879A1

公开(公告)日：2016-03-17

申请号：US14486696

申请日：2014-09-15

Applicant: Infineon Technologies AG

Inventor： Andreas Wiesbauer ,  Christian Jenkner ,  Ulrich Krumbein ,  Marc Füldner

IPC: H04R29/00

CPC classification number: H04R29/004 ,  H04R2201/003

Abstract: According to an embodiment, a transducer system includes a transducing element and a symmetry detection circuit. The transducing element includes a signal plate, a first sensing plate, and a second sensing plate. The symmetry detection circuit is coupled to a differential output of the transducer element and is configured to output an error signal based on asymmetry in the differential output.

Abstract translation: 根据实施例，换能器系统包括换能元件和对称检测电路。 换能元件包括信号板，第一感测板和第二感测板。 对称性检测电路耦合到换能器元件的差分输出，并且被配置为基于差分输出中的不对称来输出误差信号。

公开(公告)号：US11899001B2

公开(公告)日：2024-02-13

申请号：US16692489

申请日：2019-11-22

Applicant: Infineon Technologies AG

Inventor： Prashanth Makaram ,  Ulrich Krumbein

IPC: G01N33/00 ,  G01N27/414 ,  G06F1/3203

CPC classification number: G01N33/0006 ,  G01N27/4146 ,  G01N33/0008 ,  G01N33/0062 ,  G01N33/0073 ,  G06F1/3203 ,  G01N2033/0068

Abstract: A method includes exposing gas sensitive material of a gas sensor device to different adjusted target gas concentrations, determining measurement values of the resistance of the gas sensitive material between first and second contact regions in response to the adjusted target gas concentration, determining a first gas sensor behavior model based on the measurement values of the resistance of the gas sensitive material as a function of the adjusted target gas concentration, translating the first gas sensor behavior model into a corresponding second gas sensor behavior model for the resistance of the gas sensitive material as a function of a control voltage, and sweeping the control voltage based on the second gas sensor behavior model over a control voltage range for providing control voltage dependent resistance data, wherein the control voltage dependent resistance data over the control voltage range form the calibration data for the gas sensor device.

公开(公告)号：US20210053821A1

公开(公告)日：2021-02-25

申请号：US16543970

申请日：2019-08-19

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein ,  Evangelos Angelopoulos ,  Stefan Barzen ,  Marc Fueldner ,  Stefan Geissler ,  Matthias Friedrich Herrmann ,  Ulrich Krumbein ,  Konstantin Tkachuk ,  Giordano Tosolini ,  Juergen Wagner

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/02 ,  H04R1/08 ,  H04R31/00 ,  H04R7/08

Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.

公开(公告)号：US20210040942A1

公开(公告)日：2021-02-11

申请号：US16922530

申请日：2020-07-07

Applicant: Infineon Technologies AG

Inventor： Martin Seidl ,  Alfons Dehe ,  Daniel Fruechtl ,  Wolfgang Klein ,  Ulrich Krumbein ,  Johann Strasser ,  Matthias Vobl

IPC: F04B43/04 ,  F04B53/10

Abstract: A MEMS pump includes a basis structure, a membrane structure opposing the basis structure and being deflectable parallel to a surface normal of the basis structure and includes a pump chamber between the basis structure and the membrane structure wherein a volume of the pump chamber is based on a position of the membrane structure with respect to the basis structure. The MEMS pump includes a passage for letting a fluid pass into the pump chamber or exit the pump chamber, wherein the passage is arranged in-plane with respect to the pump chamber. The MEMS pump includes a valve structure coupled to the passage for connecting, in a first state, the passage to a first outer volume and for connecting, in a second state, the passage to a second outer volume.