公开(公告)号：US20170288639A1

公开(公告)日：2017-10-05

申请号：US15088830

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Baris BICEN ,  Telesphor KAMGAING ,  Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: H03H9/30 ,  H03H9/13

Abstract: Embodiments of the invention include a waveguide structure that includes a first piezoelectric transducer that is positioned in proximity to a first end of a cavity of an organic substrate. The first piezoelectric transducer receives an input electrical signal and generates an acoustic wave to be transmitted with a transmission medium. A second piezoelectric transducer is positioned in proximity to a second end of the cavity. The second piezoelectric transducer receives the acoustic wave from the transmission medium and generates an output electrical signal.

公开(公告)号：US20170283249A1

公开(公告)日：2017-10-05

申请号：US15088982

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Feras EID ,  Adel A. ELSHERBINI ,  Vijay K. NAIR ,  Telesphor KAMGAING ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: B81B7/00

CPC classification number: B81C1/0015 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04

Abstract: Embodiments of the invention include a switching device that includes an electrode, a piezoelectric material coupled to the electrode, and a movable structure (e.g., cantilever, beam) coupled to the piezoelectric material. The movable structure includes a first end coupled to an anchor of a package substrate having organic layers and a second released end positioned within a cavity of the package substrate.

公开(公告)号：US20250079300A1

公开(公告)日：2025-03-06

申请号：US18240318

申请日：2023-08-30

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Neelam PRABHU GAUNKAR ,  Henning BRAUNISCH ,  Wenhao LI ,  Feras EID ,  Georgios C. DOGIAMIS

IPC: H01L23/522 ,  H01F1/03 ,  H01F41/16

Abstract: Magnetic inductors for microelectronics packages are provided. Magnetic inductive structures include a magnetic region, a magnetic region base region, and a conductive region that forms a channel within the magnetic region. The magnetic region has a different chemical composition than the base region. Additional structures are provided in which the magnetic region is recessed into a package substrate core. Further inductor structures are provided in which the conductive region includes through-core vias and the conductive region at least partially encircles a portion of a package substrate core. Additionally, methods of manufacture are provided for semiconductor packages that include magnetic inductors.

公开(公告)号：US20230197592A1

公开(公告)日：2023-06-22

申请号：US17553189

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Brandon RAWLINGS ,  Aleksandar ALEKSOV ,  Andrew P. COLLINS ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Neelam PRABHU GAUNKAR

IPC: H01L23/498 ,  H05K1/18 ,  H01L23/15 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/181

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a core with a first surface and a second surface, where the core comprises glass. In an embodiment, a first buildup layer is over the first surface of the core, and a second buildup layer is under the second surface of the core. In an embodiment, the electronic package further comprises a via through the core between the first surface of the core and the second surface of the core, and a plane into the first surface of the core, where a width of the plane is greater than a width of the via.

公开(公告)号：US20220407212A1

公开(公告)日：2022-12-22

申请号：US17350184

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Veronica STRONG ,  Aleksandar ALEKSOV

IPC: H01P7/08 ,  H01L23/15 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01P5/18 ,  H01P11/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.

公开(公告)号：US20220406698A1

公开(公告)日：2022-12-22

申请号：US17350818

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Veronica STRONG ,  Johanna M. SWAN

IPC: H01L23/498 ,  H01L23/58 ,  H01L21/48 ,  H01F27/28

Abstract: Embodiments disclosed herein include electronic packages with magnetic features and methods of forming such packages. In an embodiment, a package substrate comprises a core and a conductive via through a thickness of the core. In an embodiment, a shell surrounds a perimeter of the conductive via and the shell is a magnetic material. In an embodiment, a surface of the conductive via is spaced away from the shell.

公开(公告)号：US20220246554A1

公开(公告)日：2022-08-04

申请号：US17721241

申请日：2022-04-14

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Javier A. FALCON ,  Shawna M. LIFF ,  Yoshihiro TOMITA

IPC: H01L23/66 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10 ,  H01L25/16

Abstract: Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20200235716A1

公开(公告)日：2020-07-23

申请号：US16648121

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Feras EID ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/10 ,  H03H9/05 ,  H03H9/54

Abstract: Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：US20200052404A1

公开(公告)日：2020-02-13

申请号：US16345171

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01L23/495 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q19/22

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20190113545A1

公开(公告)日：2019-04-18

申请号：US16096968

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Jelena CULIC-VISKOTA ,  Thomas L. SOUNART ,  Feras EID ,  Sasha N. OSTER

IPC: G01R15/20 ,  H01L41/06 ,  H01L41/12

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.