公开(公告)号：US20210028084A1

公开(公告)日：2021-01-28

申请号：US16518643

申请日：2019-07-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Edvin Cetegen ,  Baris Bicen ,  Aravindha R. Antoniswamy

IPC: H01L23/367 ,  H01L23/00

Abstract: Embodiments may relate to a microelectronic package that includes a die, a thermal interface material (TIM) coupled with the die, and an integrated heat spreader (IHS) coupled with the TIM. The IHS may include a feature with a non-uniform cross-sectional profile that includes a thin point and a thick point as measured in a direction perpendicular to a face of the die to which the TIM is coupled. Other embodiments may be described or claimed.

公开(公告)号：US20200381334A1

公开(公告)日：2020-12-03

申请号：US16423664

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Karthik Visvanathan ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Peng Li

IPC: H01L23/42 ,  H01L23/373 ,  H05K1/18 ,  H01L25/065 ,  H01L23/522

Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.

公开(公告)号：US20200006192A1

公开(公告)日：2020-01-02

申请号：US16019899

申请日：2018-06-27

Applicant: Intel Corporation

Inventor： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/367

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

公开(公告)号：US12238892B2

公开(公告)日：2025-02-25

申请号：US17128620

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC: H05K7/20

Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

公开(公告)号：US11894282B2

公开(公告)日：2024-02-06

申请号：US16446538

申请日：2019-06-19

Applicant: Intel Corporation

Inventor： Zhimin Wan ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Chandra Mohan Jha ,  Aravindha R. Antoniswamy ,  Cheng Xu ,  Junnan Zhao ,  Ying Wang

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/053

CPC classification number: H01L23/3675 ,  H01L23/053 ,  H01L23/433 ,  H01L23/49816

Abstract: Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.

公开(公告)号：US11817369B2

公开(公告)日：2023-11-14

申请号：US16435355

申请日：2019-06-07

Applicant: INTEL CORPORATION

Inventor： Bamidele Daniel Falola ,  Susmriti Das Mahapatra ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Amitesh Saha

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0652 ,  H01L24/09 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

公开(公告)号：US11682605B2

公开(公告)日：2023-06-20

申请号：US16423664

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Karthik Visvanathan ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Peng Li

IPC: H01L23/42 ,  H01L23/373 ,  H05K1/18 ,  H01L25/065 ,  H01L23/522 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0655 ,  H05K1/18 ,  H01L24/09 ,  H01L24/17 ,  H05K2201/10734

Abstract: Disclosed herein are integrated circuit (IC) packages with asymmetric adhesion material regions, as well as related methods and devices. For example, in some embodiments, an IC package may include a solder thermal interface material (STIM) between a die of the IC package and a lid of the IC package. The lid of the IC package may include an adhesion material region, in contact with the STIM, that is asymmetric with respect to the die.

公开(公告)号：US20220201889A1

公开(公告)日：2022-06-23

申请号：US17128620

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC: H05K7/20

Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

公开(公告)号：US20210013117A1

公开(公告)日：2021-01-14

申请号：US16504698

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US12205915B2

公开(公告)日：2025-01-21

申请号：US18346321

申请日：2023-07-03

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Sergio Antonio Chan Arguedas ,  Jimin Yao ,  Chandra Mohan Jha

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/367

Abstract: Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.