Two Layer Ag Process For Low Emissivity Coatings
    15.
    发明申请
    Two Layer Ag Process For Low Emissivity Coatings 审中-公开
    用于低发射率涂层的两层Ag工艺

    公开(公告)号:US20140170434A1

    公开(公告)日:2014-06-19

    申请号:US13715709

    申请日:2012-12-14

    CPC classification number: G02B1/10 Y10T428/12056 Y10T428/12611

    Abstract: Two layer silver process comprising a silver layer deposited on a doped silver layer can improve the adhesion of the silver layer on a substrate, minimizing agglomeration to provide a high quality silver layer. The doped silver layer can comprise silver and a doping element that has lower enthalpy of formation with oxide than that of silver, leading to better bonding with oxygen in the substrate.

    Abstract translation: 包含沉积在掺杂银层上的银层的双层银方法可以改善银层在基片上的附着力,最小化附聚以提供高质量的银层。 掺杂的银层可以包含银和掺杂元素,其掺杂元素具有比银更低的氧化物形成焓,导致与衬底中的氧更好的结合。

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