Combinatorial Process System
    6.
    发明申请
    Combinatorial Process System 审中-公开
    组合过程系统

    公开(公告)号:US20150093898A1

    公开(公告)日:2015-04-02

    申请号:US14562952

    申请日:2014-12-08

    Abstract: A combinatorial processing chamber is provided. The combinatorial processing chamber is configured to isolate a radial portion of a rotatable substrate support, which in turn is configured to support a substrate. The chamber includes a plurality of clusters process heads in one embodiment. An insert having a base plate disposed between the substrate support and the process heads defines a confinement region for a deposition process in one embodiment. The base plate has an opening to enable access of the deposition material to the substrate. Through rotation of the substrate and movement of the opening, multiple regions of the substrate are accessible for performing combinatorial processing on a single substrate.

    Abstract translation: 提供组合处理室。 组合处理室被配置为隔离可旋转的衬底支撑件的径向部分,该可旋转衬底支撑件又被配置为支撑衬底。 在一个实施例中,腔室包括多个聚集过程头。 在一个实施例中,具有设置在基板支撑件和工艺头之间的基板的插入件限定了用于沉积工艺的约束区域。 基板具有能够将沉积材料接近基板的开口。 通过基板的旋转和开口的移动,基板的多个区域是可访问的,以在单个基板上执行组合处理。

    Substrate Processing Including Correction for Deposition Location
    7.
    发明申请
    Substrate Processing Including Correction for Deposition Location 审中-公开
    衬底处理包括校正位置

    公开(公告)号:US20150025670A1

    公开(公告)日:2015-01-22

    申请号:US14505184

    申请日:2014-10-02

    Abstract: Substrate processing including correction for deposition location is described, including a combinatorial processing chamber that incorporates the correction. The combinatorial processing chamber can be used to process multiple regions of a substrate using different processing parameters on different regions. For example, one region can have one material deposited on it and another region can have a different material deposited on it, although other combinations and variations are possible. The combinatorial processing chamber uses a rotating and revolving substrate pedestal to be able to deposit on all locations or positions on a substrate. The combinatorial processing chamber uses a correction factor that accounts for variations in alignment and/or configuration of the processing chamber so that the actual location of deposition of a region is approximately the same as a desired location of deposition.

    Abstract translation: 描述包括用于沉积位置的校正的衬底处理,包括结合了校正的组合处理室。 组合处理室可用于在不同区域上使用不同的处理参数处理衬底的多个区域。 例如,一个区域可以具有沉积在其上的一个材料,而另一个区域可以具有沉积在其上的不同材料,尽管其它组合和变化是可能的。 组合处理室使用旋转和旋转的基板基座能够沉积在基板上的所有位置或位置上。 组合处理室使用考虑处理室的对准和/或配置变化的校正因子,使得区域的实际沉积位置与期望的沉积位置大致相同。

    SYSTEMS, METHODS, AND APPARATUS FOR PRODUCTION COATINGS OF LOW-EMISSIVITY GLASS
    10.
    发明申请
    SYSTEMS, METHODS, AND APPARATUS FOR PRODUCTION COATINGS OF LOW-EMISSIVITY GLASS 有权
    低功率玻璃生产涂料的系统,方法和装置

    公开(公告)号:US20140308528A1

    公开(公告)日:2014-10-16

    申请号:US14144828

    申请日:2013-12-31

    Abstract: Disclosed herein are systems, methods, and apparatus for forming a low emissivity panel. In various embodiments, a partially fabricated panel may be provided. The partially fabricated panel may include a substrate, a reflective layer formed over the substrate, and a top dielectric layer formed over the reflective layer such that the reflective layer is formed between the substrate and the top dielectric layer. The top dielectric layer may include tin having an oxidation state of +4. An interface layer may be formed over the top dielectric layer. A top diffusion layer may be formed over the interface layer. The top diffusion layer may be formed in a nitrogen plasma environment. The interface layer may substantially prevent nitrogen from the nitrogen plasma environment from reaching the top dielectric layer and changing the oxidation state of tin included in the top dielectric layer.

    Abstract translation: 本文公开了用于形成低发射率面板的系统,方法和装置。 在各种实施例中,可以提供部分制造的面板。 部分制造的面板可以包括衬底,在衬底上形成的反射层,以及形成在反射层上的顶部电介质层,使得反射层形成在衬底和顶部电介质层之间。 顶部电介质层可以包括具有+4的氧化态的锡。 界面层可以形成在顶部介电层上。 可以在界面层上形成顶部扩散层。 顶部扩散层可以在氮等离子体环境中形成。 界面层可以基本上防止来自氮等离子体环境的氮到达顶部电介质层并改变顶部电介质层中包含的锡的氧化态。

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