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公开(公告)号：US20170125388A1
公开(公告)日：2017-05-04
申请号：US15403430
申请日：2017-01-11
Applicant: International Business Machines Corporation
Inventor： Thomas J. Brunschwiler , Evan G. Colgan , John U. Knickerbocker , Bruno Michael , Chin Lee Ong , Cornelia K. Tsang
IPC: H01L25/065 , H01L23/427 , H01L25/00
CPC classification number: H05K7/20381 , H01L23/367 , H01L23/427 , H01L23/49816 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/13025 , H01L2224/14181 , H01L2224/16146 , H01L2224/81141 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2225/06593 , H05K7/20309 , H05K7/20327
Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.
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公开(公告)号：US20160319703A1
公开(公告)日：2016-11-03
申请号：US15105000
申请日：2014-12-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Brian Burg , Bruno Michel , Chin Lee Ong , Stephan Paredes , Patrick Ruch
Abstract: A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.
Abstract translation: 公开了一种用于将热量转换成机械能的装置。 该装置包括通道流动锅炉，其具有至少一个通道，其适于加热用于产生液体 - 气体混合物的工作流体; 膨胀装置，其适于膨胀所述液 - 气混合物; 以及可移动元件，其布置成使得所述膨胀液体 - 气体混合物至少部分地将所述液体 - 气体混合物的内部和/或动能转换成与所述可移动元件相关联的机械能; 其中所述通道流动锅炉和/或所述膨胀装置适于向所述液体 - 气体混合物供应热量。
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13.发明授权公开(公告)号：US09313921B2
公开(公告)日：2016-04-12
申请号：US14015063
申请日：2013-08-30
Applicant: International Business Machines Corporation
Inventor： Thomas J. Brunschwiler , Evan G. Colgan , John U. Knickerbocker , Bruno Michael , Chin Lee Ong , Cornelia K. Tsang
IPC: H05K7/20 , H01L23/367 , H01L23/427 , H01L25/065 , H01L29/06 , H01L23/498
CPC classification number: H05K7/20381 , H01L23/367 , H01L23/427 , H01L23/49816 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/13025 , H01L2224/14181 , H01L2224/16146 , H01L2224/81141 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2225/06593 , H05K7/20309 , H05K7/20327
Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.
Abstract translation: 用于实现两相冷却的封装结构包括设置在基板上的芯片堆叠和封装芯片堆叠的封装盖。 芯片堆叠包括多个联合芯片，通过芯片堆叠的中心区域形成的中心入口歧管和外围出口歧管。 中央输入歧管包括入口喷嘴，用于将液体冷却剂供入形成在相邻联结芯片之间的流动空腔中。 外围出口歧管从流动腔输出加热的液体和蒸气。 包装盖包括与中心入口歧管对准的中心冷却剂供给入口和外围液体蒸气出口，以输出从外围出口歧管排出的加热的液体和蒸气。 引导壁可以包括在流动腔中以引导液体和蒸气的流动，并且引导壁可以被布置成形成由中央入口歧管的不同入口喷嘴供给的径向流动通道。
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公开(公告)号：US20150166371A1
公开(公告)日：2015-06-18
申请号：US14415425
申请日：2013-07-04
Inventor： Werner Escher , Javier V. Goicochea , Ahmed S.G. Khalil , Bruno Michel , Chin Lee Ong , Stephan Paredes
CPC classification number: C02F1/447 , B01D61/364 , B01D61/366 , B01D2313/38 , C02F1/14 , C02F2101/10 , C02F2103/08 , Y02A20/128 , Y02A20/129 , Y02A20/131 , Y02A20/142 , Y02A20/211 , Y02A20/212
Abstract: A desalination system (1) for producing a distillate from a feed liquid includes: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam section (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22), which are separated by a wall (23).
Abstract translation: 用于从进料液体生产馏出物的脱盐系统（1）包括：具有由膜系统（7）分离的液体部分（5）和蒸汽部分（6）的蒸汽提升装置（2）; 具有第一蒸汽部分（11）和液体部分（12）的隔膜蒸馏装置（3），所述第一蒸汽部分（11）和液体部分（12）由壁（14）分离并具有与液体部分（12）分离的第二蒸汽部分（13） 通过膜系统（15）; 以及具有由壁（23）分隔开的第一液体部分（21）和第二液体部分（22）的热交换装置（4）。
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公开(公告)号：US10727159B2
公开(公告)日：2020-07-28
申请号：US16705278
申请日：2019-12-06
Applicant: International Business Machines Corporation
Inventor： Thomas J. Brunschwiler , Timothy J. Chainer , Evan G. Colgan , Arvind Raj Mahankali Sridhar , Chin Lee Ong , Pritish R. Parida , Gerd Schlottig , Mark D. Schultz , Joel A. Silberman
IPC: H01L23/473 , H01L23/427 , H01L21/48 , H01L23/00 , H01L25/065
Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
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Patent Agency Ranking
公开(公告)号：US10529648B2
公开(公告)日：2020-01-07
申请号：US15894974
申请日：2018-02-13
Applicant: International Business Machines Corporation
Inventor： Thomas J. Brunschwiler , Timothy J. Chainer , Evan G. Colgan , Arvind Raj Mahankali Sridhar , Chin Lee Ong , Pritish R. Parida , Gerd Schlottig , Mark D. Schultz , Joel A. Silberman
IPC: H01L23/473 , H01L23/427 , H01L21/48 , H01L23/00 , H01L25/065
Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
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公开(公告)号：US20180182686A1
公开(公告)日：2018-06-28
申请号：US15894974
申请日：2018-02-13
Applicant: International Business Machines Corporation
Inventor： Thomas J. Brunschwiler , Timothy J. Chainer , Evan G. Colgan , Arvind Raj Mahankali Sridhar , Chin Lee Ong , Pritish R. Parida , Gerd Schlottig , Mark D. Schultz , Joel A. Silberman
IPC: H01L23/427 , H01L21/48
CPC classification number: H01L23/427 , H01L21/4871 , H01L23/473 , H01L24/16 , H01L24/17 , H01L24/73 , H01L25/0657 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06589 , H01L2924/15311
Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.
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公开(公告)号：US09941250B2
公开(公告)日：2018-04-10
申请号：US15403430
申请日：2017-01-11
Applicant: International Business Machines Corporation
Inventor： Thomas J. Brunschwiler , Evan G. Colgan , John U. Knickerbocker , Bruno Michael , Chin Lee Ong , Cornelia K. Tsang
IPC: H05K7/20 , H01L25/065 , H01L25/00 , H01L23/427
CPC classification number: H05K7/20381 , H01L23/367 , H01L23/427 , H01L23/49816 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/13025 , H01L2224/14181 , H01L2224/16146 , H01L2224/81141 , H01L2225/06513 , H01L2225/06541 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H01L2225/06593 , H05K7/20309 , H05K7/20327
Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.
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公开(公告)号：US09630862B2
公开(公告)日：2017-04-25
申请号：US15168388
申请日：2016-05-31
Inventor： Werner Escher , Javier V. Goicochea , Ahmed S. G. Khalil , Bruno Michel , Chin Lee Ong , Stephan Paredes
IPC: B01D15/00 , B01D35/18 , C02F1/02 , C02F1/14 , C02F1/44 , B01D61/36 , C02F103/08 , C02F101/10
CPC classification number: C02F1/447 , B01D61/364 , B01D61/366 , B01D2313/38 , C02F1/14 , C02F2101/10 , C02F2103/08 , Y02A20/128 , Y02A20/129 , Y02A20/131 , Y02A20/142 , Y02A20/211 , Y02A20/212
Abstract: A desalination system (1) for producing a distillate from a feed liquid includes: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam section (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22), which are separated by a wall (23).
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公开(公告)号：US20160289095A1
公开(公告)日：2016-10-06
申请号：US15168388
申请日：2016-05-31
Inventor： Werner Escher , Javier V. Goicochea , Almed S.G. Khalil , Bruno Michel , Chin Lee Ong , Stephan Paredes
CPC classification number: C02F1/447 , B01D61/364 , B01D61/366 , B01D2313/38 , C02F1/14 , C02F2101/10 , C02F2103/08 , Y02A20/128 , Y02A20/129 , Y02A20/131 , Y02A20/142 , Y02A20/211 , Y02A20/212
Abstract: A desalination system (1) for producing a distillate from a feed liquid includes: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam section (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22), which are separated by a wall (23).
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