公开(公告)号：US09213343B2

公开(公告)日：2015-12-15

申请号：US13783618

申请日：2013-03-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: G05D23/19 ,  H05K7/20

CPC classification number: H05K7/20836 ,  G05B15/02 ,  G05D23/1932 ,  H05K7/2079

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Abstract translation: 部分地基于组件的加权冷却效率来提供电子系统的冷却系统冷却的能量效率控制。 该控制包括自动确定冷却系统的多个可调冷却部件的速度控制设置。 所述自动确定至少部分地基于所述冷却系统的组件的加权冷却效果，并且所述确定操作以限制至少所述冷却系统的功率消耗，同时确保与至少一个 冷却系统或电子系统在所需的范围内，通过基于加权的冷却效果，提供冷却系统的多个可调冷却部件之间的期望的目标温度变化。 供应包括至少部分地通过所确定的控制设置向多个可调冷却部件供应应用的功率。

公开(公告)号：US09113581B2

公开(公告)日：2015-08-18

申请号：US14519401

申请日：2014-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

Abstract: Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.

Abstract translation: 提供了用于冷却电子部件的装置，电子部件包括耦合到电子部件的散热器，并且具有用于第一冷却剂的冷却剂传送通道。 第一冷却剂向电子部件提供两相冷却，并且作为包括冷却剂蒸气的冷却剂排出物从散热器排出。 该装置还包括联接到散热器以接收冷却剂排气的节点级冷凝模块。 冷凝模块通过第二冷却剂冷却，并且有助于冷凝冷却剂排出物中的冷却剂蒸气。 控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。 控制阀调节节点级冷凝模块的第二冷却剂的流量，基于冷却剂排气中的冷却剂蒸气的表征，阀被控制器自动控制。

公开(公告)号：US09102021B2

公开(公告)日：2015-08-11

申请号：US14064322

申请日：2013-10-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F28F3/00 ,  B23P15/26 ,  H05K7/20 ,  G06F1/20 ,  F28F3/12 ,  F28F13/00 ,  F28D15/02

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract translation: 提供散热器，冷却电子结构和利用散热器的冷却电子设备。 散热器由导热结构制成，该导热结构包括一个或多个冷却剂承载通道，其联接以便于冷却剂流过冷却剂输送通道。 散热器还包括与冷却剂输送通道相关联的膜。 该膜包括至少一个透气区域，其覆盖着一部分冷却剂输送通道，并且有助于从冷却剂输送通道中除去蒸气，以及至少一个孔口，其连接以将冷却剂注入到 在一个或多个通道的相对端之间的冷却剂承载通道的至少一个表面。

公开(公告)号：US09095889B2

公开(公告)日：2015-08-04

申请号：US13788798

申请日：2013-03-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: F25B21/02 ,  B21D53/02 ,  H05K7/20

CPC classification number: B21D53/02 ,  F25B21/02 ,  F25B2321/0252 ,  H05K7/2079 ,  Y10T29/49359

Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

Abstract translation: 提供一种电子系统的热电增强空气和液体冷却是通过提供一种冷却装置来实现的，所述冷却装置包括与电子部件热连通的液冷结构，以及液体 - 液体和空气 - 液体热交换器 通过冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

公开(公告)号：US09075582B2

公开(公告)日：2015-07-07

申请号：US13676313

申请日：2012-11-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

Abstract: A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

Abstract translation: 提供冷却装置和方法来冷却电子机架的电子子系统的一个或多个电子部件。 冷却装置包括散热器，其被配置为耦合到电子部件，并且其包括用于冷却剂流过其中的冷却剂输送通道。 冷却剂为电子部件提供两相冷却，并且作为包括要冷凝的冷却剂蒸汽的冷却剂排出物从散热器排出。 冷却装置还包括与电子子系统相关联的节点级冷凝模块，并且与散热器流体连通地耦合以接收来自散热器的冷却剂排出物。 冷凝模块是液体冷却的，并且便于冷却剂排气中的冷却剂蒸气的冷凝。 控制器自动控制散热器的液体冷却和/或节点级冷凝模块的液冷。

公开(公告)号：US09009971B2

公开(公告)日：2015-04-21

申请号：US13788871

申请日：2013-03-07

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: B23P15/26 ,  H05K7/20

CPC classification number: B23P15/26 ,  H05K7/203 ,  H05K7/20336 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49396

Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract translation: 提供了一种便于冷却电子系统的电子部件的方法。 该方法包括：提供壳体，其至少部分地环绕和形成围绕部件的隔室，并且提供浸入冷却流体设置在隔室内，电子系统的至少一个部件至少部分地不浸入流体 在隔间; 提供物理耦合到所述至少一个部件的主表面并且部分地设置在所述隔室内的流体内的芯吸膜元件; 以及通过耦合元件将所述芯吸膜元件物理耦合到所述至少一个部件的主表面，而不将所述耦合元件覆盖在所述部件的主表面上。 作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。

公开(公告)号：US08964391B2

公开(公告)日：2015-02-24

申请号：US13788919

申请日：2013-03-07

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  F28D15/00 ,  F28F27/00 ,  F28F9/00 ,  B23P15/26

CPC classification number: B23P15/26 ,  F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/06 ,  H05K7/20809 ,  Y10T29/4935

Abstract: Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract translation: 提供冷却方法以便于电子部件的抽吸浸没冷却。 冷却方法包括：提供围绕一个或多个部件形成隔室的壳体，以及提供供应歧管，回流歧管以及联接冷却剂回路联接器以使供应和返回歧管与壳体流体连通。 流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来冷却部件。 泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。 回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。 冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

公开(公告)号：US08947873B2

公开(公告)日：2015-02-03

申请号：US13684712

申请日：2012-11-26

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K5/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20236 ,  G06F1/20 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/2079 ,  H05K7/20809

Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract translation: 提供了一种冷却的电子系统和冷却方法，其中具有安装到板上的多个电子部件的电子板通过包括浸没冷却电子部件部分和传导冷却电子部件部分的设备来冷却。 浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。 多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。 传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地经由从至少一个 电子元件

公开(公告)号：US08929080B2

公开(公告)日：2015-01-06

申请号：US13788987

申请日：2013-03-07

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20 ,  H05K7/20236 ,  H05K7/20772 ,  Y10T29/49117

Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract translation: 提供了一种用于对诸如多节点机架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却的方法。 该方法包括提供围绕待冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。

公开(公告)号：US08713957B2

公开(公告)日：2014-05-06

申请号：US13692215

申请日：2012-12-03

Applicant: International Business Machines Corporation

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F25D23/12

CPC classification number: F25B21/02 ,  F25B2400/17 ,  H01L23/38 ,  H01L23/427 ,  H01L35/30 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

Abstract: Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser. The thermal conduction path couples the fluid-tight compartment and the second region of the heat sink in thermal contact, and includes a thermoelectric array, which facilitates transfer of heat from the fluid-tight compartment to the second region of the heat sink through the thermal conduction path.

Abstract translation: 提供冷却方法用于浸入冷却一个或多个电子部件。 冷却方法包括：提供壳体，其至少部分围绕电子部件周围并形成流体密封的隔室，以及设置在流体密封隔室内的介电流体，其中电子部件浸入介电流体 ; 并提供蒸气冷凝器，散热器和导热路径。 蒸汽冷凝器包括在流体密封室内延伸的多个导热冷凝器翅片，并且散热器包括第一区域和第二区域，散热片的第一区域与蒸气冷凝器热接触 。 热传导路径以热接触方式将流体密封室和散热器的第二区域耦合，并且包括热电阵列，其有助于将热量从流体密封隔室传导到散热器的第二区域，通过热 传导路径。