中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

29 records (took 0.018 seconds)

    FORMABLE INTERFACE AND SHIELDING STRUCTURES
    11.
    发明申请
    FORMABLE INTERFACE AND SHIELDING STRUCTURES 审中-公开

    公开(公告)号：US20170176116A1

    公开(公告)日：2017-06-22

    申请号：US14975676

    申请日：2015-12-18

    Applicant: Renee Wu ,  Michael Nikkhoo

    Inventor： Renee Wu ,  Michael Nikkhoo

    IPC: F28F21/02 ,  B23P15/26 ,  F28F21/06

    CPC classification number: F28F21/02 ,  B23P15/26 ,  F28F21/065 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/552

    Abstract: A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.

    DIFFERENTLY ORIENTED LAYERED THERMAL CONDUIT
    12.
    发明申请
    DIFFERENTLY ORIENTED LAYERED THERMAL CONDUIT 审中-公开
    不同方向的层状热管

    公开(公告)号：US20160381832A1

    公开(公告)日：2016-12-29

    申请号：US14754483

    申请日：2015-06-29

    Applicant: Erin Hurbi ,  Michael Nikkhoo ,  Douglas L. Heirich

    Inventor： Erin Hurbi ,  Michael Nikkhoo ,  Douglas L. Heirich

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20509 ,  B23P15/26 ,  B23P2700/10 ,  F28D2021/0028 ,  F28F21/02 ,  F28F2013/001 ,  F28F2255/00 ,  G02B27/0176 ,  H01L23/373 ,  H01L23/3733

    Abstract: A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.

    Abstract translation: 本文公开了一种构造成将热量从热源传导到散热器的热导管和形成所述导管的方法。 热导管可以包括由各向异性导热材料形成的多个堆叠片材，其非限制性实例是石墨，每个片材具有相应的导热取向。 多个片材的热传导取向可以在层叠方向上逐步变化，形成弯曲的热流路径。

    MICROSPHERE SPACED WAVEGUIDE DISPLAY
    13.
    发明申请
    MICROSPHERE SPACED WAVEGUIDE DISPLAY 审中-公开
    MICROSPHERE空间波形显示

    公开(公告)号：US20160252724A1

    公开(公告)日：2016-09-01

    申请号：US14600659

    申请日：2015-01-20

    Applicant: Michael Nikkhoo

    Inventor： Michael Nikkhoo

    IPC: G02B27/01 ,  F21V8/00

    CPC classification number: G02B27/0172 ,  G02B6/0043 ,  G02B6/005 ,  G02B6/0065 ,  G02B27/0081 ,  G02B2027/0178 ,  G02B2027/0194 ,  G02B2027/0196

    Abstract: The technology provides a waveguide display including an optical waveguide comprising a plurality of separated parallel optical substrates. The substrates are joined by an adhesive configured to have suspended therein a plurality of hard microspheres. The adhesive may be a pressure sensitive adhesive designed to have suspended therein the microspheres. Microspheres may have diameters on the order of a few microns up to 100 microns. The waveguide may be constructed of first and second optical substrates, and a pressure sensitive adhesive including embedded microspheres joining and spacing the substrates apart from each other. Additional substrates may be provided. The technology also provides a method of manufacturing a waveguide.

    Abstract translation: 该技术提供一种波导显示器，其包括包括多个分离的平行光学基板的光波导。 基板通过被配置为在其中悬挂有多个硬微球体的粘合剂连接。 粘合剂可以是设计成在其中悬浮在其中的压敏粘合剂。 微球可以具有几微米直到100微米的直径。 波导可以由第一和第二光学基底构成，并且压敏粘合剂包括嵌入的微球，将基片彼此分开连接并间隔开。 可以提供附加的基底。 该技术还提供了制造波导的方法。

    PRINTED CIRCUIT BOARDS WITH EMBEDDED COMPONENTS
    16.
    发明申请
    PRINTED CIRCUIT BOARDS WITH EMBEDDED COMPONENTS 有权
    带嵌入式组件的印刷电路板

    公开(公告)号：US20120008294A1

    公开(公告)日：2012-01-12

    申请号：US12832885

    申请日：2010-07-08

    Applicant: Jahan Minoo ,  Anthony P.N. Bidmead ,  Michael Nikkhoo

    Inventor： Jahan Minoo ,  Anthony P.N. Bidmead ,  Michael Nikkhoo

    IPC: H05K1/18 ,  H05K1/03 ,  H05K1/00 ,  H05K1/16

    CPC classification number: H05K1/183 ,  H04R1/025 ,  H04R1/04 ,  H05K1/02 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10356 ,  H05K2201/10446

    Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

    Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。

    METAL ENCASED GRAPHITE LAYER HEAT PIPE
    18.
    发明申请
    METAL ENCASED GRAPHITE LAYER HEAT PIPE 有权
    金属加工石墨层热管

    公开(公告)号：US20160212888A1

    公开(公告)日：2016-07-21

    申请号：US14601088

    申请日：2015-01-20

    Applicant: Michael Nikkhoo ,  Erin Hurbi

    Inventor： Michael Nikkhoo ,  Erin Hurbi

    IPC: H05K7/20 ,  G02B27/01

    CPC classification number: H05K7/20963 ,  G02B7/008 ,  G02B27/0176 ,  G02B2027/0178

    Abstract: A metal encased multilayer stack of graphite sheets used as a passive thermal conductor. In the stack, each sheet has a plane high thermal conductivity along a first axis and a plane of lower thermal conductivity along a second axis. The stack is created to have a three-dimensional shape including a length and a width, and the first axis is aligned parallel to said length, the multilayer stack having a height less than the width. A first metal structure surrounds the multilayer stack of graphite sheets, with the metal structure encasing the multilayer stack along the length, width and height of the multilayer stack.

    Abstract translation: 用作无源热导体的石墨片的金属封装多层叠层。 在堆叠中，每个片材沿着第一轴线具有平面高热导率，沿着第二轴线具有较低热导率的平面。 该叠层被制造成具有包括长度和宽度的三维形状，并且第一轴线平行于所述长度排列，所述多层堆叠具有小于该宽度的高度。 第一金属结构围绕石墨片的多层堆叠，其中金属结构沿着多层堆叠的长度，宽度和高度包围多层堆叠。

    WEARABLE DISPLAY WITH BONDED GRAPHITE HEATPIPE
    19.
    发明申请
    WEARABLE DISPLAY WITH BONDED GRAPHITE HEATPIPE 审中-公开
    具有粘结石墨热表面的可显示显示

    公开(公告)号：US20160212886A1

    公开(公告)日：2016-07-21

    申请号：US14600753

    申请日：2015-01-20

    Applicant: Michael Nikkhoo

    Inventor： Michael Nikkhoo

    IPC: H05K7/20 ,  G02B27/01

    CPC classification number: H05K7/20963 ,  G02B7/008 ,  G02B27/0176 ,  G02B2027/0178

    Abstract: The technology provides an optical mounting structure adapted for a head mounted display. The structure is configured to support heat producing electronic components on an interior surface, the structure including frame elements having an exterior surface. At least one bonded graphite layer thermally coupled to the electronic components and at least partially mounted to an exterior surface of the optical mounting structure. The graphite may be adhesively bonded to the surface of the mounting structure. A frame region is adapted to contain heat producing electronic components and first and second structural components extending away from the frame region. First and second graphite layers are thermally coupled to the electronic components, one of said first and second graphite layers bonded to an exterior surface of each structural component. A method of fabricating the structure is also provided.

    Abstract translation: 该技术提供适用于头戴式显示器的光学安装结构。 该结构构造成支撑内表面上的发热电子部件，该结构包括具有外表面的框架元件。 至少一个粘合的石墨层热耦合到电子部件并且至少部分地安装到光学安装结构的外表面。 石墨可以粘合到安装结构的表面上。 框架区域适于容纳发热电子部件以及远离框架区域延伸的第一和第二结构部件。 第一和第二石墨层热耦合到电子部件，所述第一和第二石墨层中的一个结合到每个结构部件的外表面。 还提供了一种制造该结构的方法。

    CONVECTIVE OPTICAL MOUNT STRUCTURE
    20.
    发明申请
    CONVECTIVE OPTICAL MOUNT STRUCTURE 审中-公开
    对角光学结构

    公开(公告)号：US20160209659A1

    公开(公告)日：2016-07-21

    申请号：US14601093

    申请日：2015-01-20

    Applicant: Michael Nikkhoo ,  Erin Hurbi

    Inventor： Michael Nikkhoo ,  Erin Hurbi

    IPC: G02B27/01

    CPC classification number: G02B27/0176 ,  G02B7/008 ,  G02B2027/0152 ,  G02B2027/0178 ,  G02C5/18 ,  G02C11/08 ,  G02C11/10

    Abstract: An optical mount includes a frame adapted to support display optical systems and heat emitting electronic components. The mount includes a first portion housing the electronic components and one or more support components extending away from the electronic components. The one or more support components may include temple arms adapted to support the frame on the head of a wearer of the optical mount. The frame may be comprised of a thermally conductive material coupled to the electronic components. The support components include a first side and a second side, and at least one void positioned between the first side and the second side adapted to convey heat away from the electronic components. The void may define a bifurcated region in the support component.

    Abstract translation: 光学座架包括适于支撑显示光学系统和发热电子部件的框架。 安装件包括容纳电子部件的第一部分和远离电子部件延伸的一个或多个支撑部件。 一个或多个支撑部件可以包括适于将框架支撑在光学安装件的佩戴者的头部上的镜腿臂。 框架可以由耦合到电子部件的导热材料构成。 支撑部件包括第一侧和第二侧，以及位于第一侧和第二侧之间的至少一个空隙，其适于将热量从电子部件传送出去。 空隙可以在支撑部件中定义分叉区域。

Patent Agency Ranking