Phase shifting mask for manufacturing semiconductor device and method of fabricating the same
    11.
    发明申请
    Phase shifting mask for manufacturing semiconductor device and method of fabricating the same 有权
    用于制造半导体器件的相移掩模及其制造方法

    公开(公告)号:US20050164100A1

    公开(公告)日:2005-07-28

    申请号:US11084327

    申请日:2005-03-18

    CPC分类号: G03F1/32 G03F1/36

    摘要: A phase shifting mask (PSM) for manufacturing a semiconductor device and a method of fabricating the same includes a transparent substrate, a main pattern formed on the transparent substrate and comprising a first phase shifting layer having a first optical transmittance greater than 0, and at least one assistant pattern formed on the transparent substrate proximal to the main pattern for phase-shifting by the same degree as the main pattern and having a second optical transmittance, which is less than the first optical transmittance.

    摘要翻译: 用于制造半导体器件的相移掩模(PSM)及其制造方法包括:透明基板,形成在透明基板上的主图案,其包括第一透光率大于0的第一相移层,以及第 至少一个辅助图案形成在靠近主图案的透明基板上,用于与主图案相同程度的相移,并具有小于第一光透射率的第二光透射率。

    Method for forming fine patterns of a semiconductor device using a double patterning process
    12.
    发明申请
    Method for forming fine patterns of a semiconductor device using a double patterning process 失效
    使用双重图案形成工艺形成半导体器件的精细图案的方法

    公开(公告)号:US20080124931A1

    公开(公告)日:2008-05-29

    申请号:US11978718

    申请日:2007-10-30

    IPC分类号: H01L21/302

    摘要: A method for forming fine patterns of a semiconductor device includes forming an etching film on a substrate having first and second areas, forming first mask patterns on the substrate to have a first pattern density in the first area and a second pattern density in the second area, forming first capping patterns between the first mask patterns, forming second capping patterns between the first mask patterns, such that recess areas are formed between second capping patterns, and such that a first etching pattern is defined to include the first and second capping patterns, forming second mask patterns in the recess areas to include the first and second mask patterns, removing one of the first and second etching patterns, such that a single etching pattern is remaining on the substrate, and etching the etching film using the remaining etching pattern as an etch mask to form etching film patterns.

    摘要翻译: 用于形成半导体器件的精细图案的方法包括在具有第一和第二区域的衬底上形成蚀刻膜,在衬底上形成第一掩模图案以在第一区域中具有第一图案密度,在第二区域中形成第二图案密度 在所述第一掩模图案之间形成第一封盖图案,在所述第一掩模图案之间形成第二封盖图案,使得在第二封盖图案之间形成凹陷区域,并且使得第一蚀刻图案被限定为包括所述第一和第二封盖图案, 在凹陷区域中形成第二掩模图案以包括第一和第二掩模图案,去除第一和第二蚀刻图案中的一个,使得在基板上残留单个蚀刻图案,并使用剩余的蚀刻图案蚀刻蚀刻膜作为 蚀刻掩模以形成蚀刻膜图案。

    METHOD OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE BY USING DOUBLE PATTERNING PROCESS WHICH USES ACID DIFFUSION
    13.
    发明申请
    METHOD OF FORMING FINE PATTERNS OF SEMICONDUCTOR DEVICE BY USING DOUBLE PATTERNING PROCESS WHICH USES ACID DIFFUSION 有权
    通过使用双酸性方法形成半导体器件的精细图案的方法使用酸扩散

    公开(公告)号:US20090274980A1

    公开(公告)日:2009-11-05

    申请号:US12267687

    申请日:2008-11-10

    IPC分类号: G03F7/20

    摘要: A method of forming fine patterns of a semiconductor device according to a double patterning process that uses acid diffusion is provided. In this method, a plurality of first mask patterns are formed on a substrate so as to be separated from one another. A capping film including an acid source is formed on sidewalls and an upper surface of each of the plurality of first mask patterns. A second mask layer is formed on the capping films. A plurality of acid diffused regions are formed within the second mask layer by diffusing acid obtained from the acid source from the capping films into the second mask layer. A plurality of second mask patterns are formed of residual parts of the second mask layer which remain in the first spaces after removing the acid diffused regions of the second mask layer.

    摘要翻译: 提供了根据使用酸扩散的双重图案化工艺形成半导体器件的精细图案的方法。 在该方法中,在基板上形成多个第一掩模图案以彼此分离。 在多个第一掩模图案的每一个的侧壁和上表面上形成包括酸源的封盖膜。 在封盖膜上形成第二掩模层。 通过将从酸源获得的酸从封盖膜扩散到第二掩模层中,在第二掩模层内形成多个酸扩散区。 多个第二掩模图案由除去第二掩模层的酸扩散区域之后残留在第一间隙中的第二掩模层的残留部分形成。

    Semiconductor memory device having self-aligned contacts and method of fabricating the same
    14.
    发明授权
    Semiconductor memory device having self-aligned contacts and method of fabricating the same 失效
    具有自对准触点的半导体存储器件及其制造方法

    公开(公告)号:US06885052B2

    公开(公告)日:2005-04-26

    申请号:US09790240

    申请日:2001-02-21

    摘要: A semiconductor memory device having self-aligned contacts, capable of preventing a short-circuit between contacts for bit lines and contacts for storage electrodes and improving a process margin, and a method of fabricating the same are provided. The semiconductor memory device having self-aligned contacts includes a plurality of gate electrode patterns arranged in parallel on a semiconductor substrate, in which a plurality of first spacers are formed along the sidewalls of the gate electrode patterns, a first interdielectric layer formed on the entire surface of a resultant in which the first spacers are formed, a plurality of bit line patterns arranged in parallel on the first interdielectric layer to be perpendicular to the gate electrode patterns, in which a plurality of second spacers are formed along the sidewalls of the bit line patterns, a plurality of contacts for bit lines self-aligned with the first spacers, a second interdielectric layer formed on the entire surface of a resultant in which the second spacers are formed, and a plurality of contacts for storage electrodes simultaneously self-aligned with the second and first spacers.

    摘要翻译: 一种具有自对准触点的半导体存储器件及其制造方法,其特征在于能够防止位线触点和存储电极触点之间的短路,并提高加工余量。 具有自对准触点的半导体存储器件包括平行布置在半导体衬底上的多个栅电极图案,其中多个第一间隔物沿着栅电极图案的侧壁形成,第一绝缘层整体形成 其中形成有第一间隔物的结果的表面,在第一电介质层上平行布置成垂直于栅极电极图案的多个位线图案,其中沿着该位的侧壁形成多个第二间隔物 线图案,用于与第一间隔物自对准的位线的多个触点,形成在其中形成有第二间隔物的结果的整个表面上的第二电介质层和用于存储电极的多个触点同时自对准 与第二和第一间隔物。

    Semiconductor memory device having self-aligned contacts and method of fabricating the same
    15.
    发明授权
    Semiconductor memory device having self-aligned contacts and method of fabricating the same 失效
    具有自对准触点的半导体存储器件及其制造方法

    公开(公告)号:US07132708B2

    公开(公告)日:2006-11-07

    申请号:US11054593

    申请日:2005-02-09

    摘要: A semiconductor memory device having self-aligned contacts, capable of preventing a short-circuit between contacts for bit lines and contacts for storage electrodes and improving a process margin, and a method of fabricating the same are provided. The semiconductor memory device having self-aligned contacts includes a plurality of gate electrode patterns arranged in parallel on a semiconductor substrate, in which a plurality of first spacers are formed along the sidewalls of the gate electrode patterns, a first interdielectric layer formed on the entire surface of a resultant in which the first spacers are formed, a plurality of bit line patterns arranged in parallel on the first interdielectric layer to be perpendicular to the gate electrode patterns, in which a plurality of second spacers are formed along the sidewalls of the bit line patterns, a plurality of contacts for bit lines self-aligned with the first spacers, a second interdielectric layer formed on the entire surface of a resultant in which the second spacers are formed, and a plurality of contacts for storage electrodes simultaneously self-aligned with the second and first spacers.

    摘要翻译: 一种具有自对准触点的半导体存储器件及其制造方法,其特征在于能够防止位线触点和存储电极触点之间的短路,并提高加工余量。 具有自对准触点的半导体存储器件包括平行布置在半导体衬底上的多个栅电极图案,其中多个第一间隔物沿着栅电极图案的侧壁形成,第一绝缘层整体形成 其中形成有第一间隔物的结果的表面,在第一电介质层上平行布置成垂直于栅极电极图案的多个位线图案,其中沿着该位的侧壁形成多个第二间隔物 线图案,用于与第一间隔物自对准的位线的多个触点,形成在其中形成有第二间隔物的结果的整个表面上的第二电介质层和用于存储电极的多个触点同时自对准 与第二和第一间隔物。

    Method of forming fine patterns of semiconductor device by using double patterning process which uses acid diffusion
    16.
    发明授权
    Method of forming fine patterns of semiconductor device by using double patterning process which uses acid diffusion 有权
    通过使用酸扩散的双重图案化工艺形成半导体器件精细图案的方法

    公开(公告)号:US08431331B2

    公开(公告)日:2013-04-30

    申请号:US12267687

    申请日:2008-11-10

    IPC分类号: G03F7/40

    摘要: A method of forming fine patterns of a semiconductor device according to a double patterning process that uses acid diffusion is provided. In this method, a plurality of first mask patterns are formed on a substrate so as to be separated from one another. A capping film including an acid source is formed on sidewalls and an upper surface of each of the plurality of first mask patterns. A second mask layer is formed on the capping films. A plurality of acid diffused regions are formed within the second mask layer by diffusing acid obtained from the acid source from the capping films into the second mask layer. A plurality of second mask patterns are formed of residual parts of the second mask layer which remain in the first spaces after removing the acid diffused regions of the second mask layer.

    摘要翻译: 提供了根据使用酸扩散的双重图案化工艺形成半导体器件的精细图案的方法。 在该方法中,在基板上形成多个第一掩模图案以彼此分离。 在多个第一掩模图案的每一个的侧壁和上表面上形成包括酸源的封盖膜。 在封盖膜上形成第二掩模层。 通过将从酸源获得的酸从封盖膜扩散到第二掩模层中,在第二掩模层内形成多个酸扩散区。 多个第二掩模图案由除去第二掩模层的酸扩散区域之后残留在第一间隙中的第二掩模层的残留部分形成。

    Method for forming fine patterns of a semiconductor device using a double patterning process
    17.
    发明授权
    Method for forming fine patterns of a semiconductor device using a double patterning process 失效
    使用双重图案形成工艺形成半导体器件的精细图案的方法

    公开(公告)号:US07892982B2

    公开(公告)日:2011-02-22

    申请号:US11978718

    申请日:2007-10-30

    IPC分类号: H01L21/302

    摘要: A method for forming fine patterns of a semiconductor device includes forming an etching film on a substrate having first and second areas, forming first mask patterns on the substrate to have a first pattern density in the first area and a second pattern density in the second area, forming first capping patterns between the first mask patterns, forming second capping patterns between the first mask patterns, such that recess areas are formed between second capping patterns, and such that a first etching pattern is defined to include the first and second capping patterns, forming second mask patterns in the recess areas to include the first and second mask patterns, removing one of the first and second etching patterns, such that a single etching pattern is remaining on the substrate, and etching the etching film using the remaining etching pattern as an etch mask to form etching film patterns.

    摘要翻译: 用于形成半导体器件的精细图案的方法包括在具有第一和第二区域的衬底上形成蚀刻膜,在衬底上形成第一掩模图案以在第一区域中具有第一图案密度,在第二区域中形成第二图案密度 在所述第一掩模图案之间形成第一封盖图案,在所述第一掩模图案之间形成第二封盖图案,使得在第二封盖图案之间形成凹陷区域,并且使得第一蚀刻图案被限定为包括所述第一和第二封盖图案, 在凹陷区域中形成第二掩模图案以包括第一和第二掩模图案,去除第一和第二蚀刻图案中的一个,使得在基板上残留单个蚀刻图案,并使用剩余的蚀刻图案蚀刻蚀刻膜作为 蚀刻掩模以形成蚀刻膜图案。