MEMS APPARATUS HAVING IMPACT ABSORBER
    11.
    发明申请

    公开(公告)号:US20180186624A1

    公开(公告)日:2018-07-05

    申请号:US15393268

    申请日:2016-12-29

    CPC classification number: B81B3/0072

    Abstract: A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

    MEMS apparatus having impact absorber

    公开(公告)号:US10011476B1

    公开(公告)日:2018-07-03

    申请号:US15393268

    申请日:2016-12-29

    Abstract: A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

    Vertically integrated micro-bolometer and manufacturing method thereof

    公开(公告)号:US12264972B2

    公开(公告)日:2025-04-01

    申请号:US18201996

    申请日:2023-05-25

    Abstract: A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.

    Microelectromechanical apparatus having multiple vibrating portions

    公开(公告)号:US12180062B2

    公开(公告)日:2024-12-31

    申请号:US17743331

    申请日:2022-05-12

    Abstract: A microelectromechanical apparatus includes a base and a thin film including a stationary part disposed on the base, a peripheral part, a central part surrounded by the peripheral part, and a first and second elastic part. The first elastic part is connected to the stationary part and the peripheral part. The second elastic part is connected to the peripheral part and the central part. When low frequency signal is input to a first electrode of the first elastic part, the peripheral part and the and the central part respectively vibrate with a first and second low-frequency amplitudes. When high-frequency signal is input to a second electrode of the second elastic part, the peripheral part and the central part respectively vibrate with a first and second high-frequency amplitudes. A difference between the first and second low-frequency amplitudes is smaller than a difference between the first and second high-frequency amplitudes.

    Microelectromechanical infrared sensing apparatus having stoppers

    公开(公告)号:US11359970B2

    公开(公告)日:2022-06-14

    申请号:US16904820

    申请日:2020-06-18

    Abstract: A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.

    Linear guideway with embedded sensor

    公开(公告)号:US11131340B2

    公开(公告)日:2021-09-28

    申请号:US16870439

    申请日:2020-05-08

    Abstract: A linear guideway with an embedded sensor includes a track, a slider, a plurality of rolling members, and a sensing module. The track extends in a first direction and has a first recess. The slider can move in the first direction and include a second recess, a channel, at least one hole, and a deforming region. The channel is formed by coupling the first recess and the second recess, and extends in the first direction. The hole extends from the surface of the slider along the insertion axis and into the slider. The rolling members are disposed in the channel. The sensing module is disposed in the hole, and contacts the deforming region to detect the amount of deformation.

    Microelectromechanical system (MEMS) apparatus with adjustable spring

    公开(公告)号:US10703625B1

    公开(公告)日:2020-07-07

    申请号:US16369542

    申请日:2019-03-29

    Abstract: A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.

    BALL SCREW WITH FORCE SENSOR IN RADIAL DIRECTION

    公开(公告)号:US20200025281A1

    公开(公告)日:2020-01-23

    申请号:US16221615

    申请日:2018-12-17

    Abstract: A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.

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